The wired circuit board includes a metal supporting board, an insulating layer and a conductor layer disposed at one side in the thickness direction of the metal supporting board, a gold plate layer disposed at the other side in the thickness direction of the metal supporting board, and an adherence layer disposed between the metal supporting board and the gold plate layer. The material of the metal supporting board is a corrosion resistant alloy. In the adherence layer, gold and the metal contained in the corrosion resistant alloy are mixedly present.

A laminated electronic component includes an element body formed by laminating an insulating layer and having a bottom surface used as a mounting surface, and a bottom surface electrode formed on the bottom surface of the element body and containing glass and a sintered metal. The bottom surface electrode includes a first electrode layer and a second electrode layer formed on the element body side from the first electrode layer, an edge portion of the second electrode layer is covered with an overcoat layer which is a part of the element body, the first electrode layer is laminated on the second electrode layer with the overcoat layer interposed therebetween, and a content of glass in the first electrode layer is larger than a content of glass in the second electrode layer.

A ceramic circuit board and a method of making are provided. The ceramic circuit board includes a substrate and a composite material layer. The composite material layer is formed on the substrate and comprises metal oxide powders and ceramic powders. The composite material layer has an interface layer which is transformed from the metal oxide powders by reduction and includes comprises zero-valent metal, lower-valent metal oxide and eutectic mixture reduced from the metal oxide powders of the composite material layer.

A metal-ceramic bonded substrate is such that a heat dissipating face is formed in a spherical protruding form, because of which contact pressure with a thermally conductive grease when attaching a heat dissipating fin to the heat dissipating face is high, and high heat dissipation can be secured. Also, by an overflow portion communicating with a metal base portion formation portion being provided farther to an outer side than an external form of the metal-ceramic bonded substrate in an interior of a casting mold, an overflow portion residue is restricted by the casting mold when causing molten metal to solidify and cool, because of which warping deformation occurring because of a difference between linear expansion coefficients of a metal material and a ceramic material can be restricted, and a casting defect such as a running defect in a molten metal flowing process, cold shut, a ripple mark, can be restricted.

A flexible circuit board assembly for an LED lamp of the present disclosure comprises: a resin layer having a strip shape; a conductive signal line layer formed from a predetermined pattern provided on the upper part of the resin layer; and a radiation layer provided on the lower part of the resin layer, having a thickness relatively thicker than that of the conductive signal line layer, and radiating the heat generated from an LED mounted on the signal line layer, wherein the signal line layer and the radiation layer are made from one material from among copper, aluminum, copper alloy and an aluminum alloy.

The disclosure provides an insulated metal substrate (IMS) including a substrate having a first side and a second side. The IMS may also include a first dielectric layer on the first side of the substrate. The dielectric layer may include a metal-based oxynitride and/or a metalloid-based oxynitride layer, oxygen is from 0.1 at % to 49.9 at %, nitrogen is from 0.1 at % to 49.9 at % and a sum of oxygen and nitrogen is about 50 at %. The first dielectric layer comprises a material selected from a group consisting of aluminum oxynitride (AlON), aluminum oxyhydronitride (AlHON), aluminum oxycarbonitride (AlCON), SiGeON, GaON, SiON, and GeON. The substrate comprises one of Cu, Al, AlSi, CAl, WCu, or Ti.

Electronic component with a support comprising a first inorganic insulating layer and a second inorganic insulating layer, between which a metal core is arranged, a first, a second and a third electrically conductive structure which are arranged on a top surface of the carrier, a first and a second electrical contact point and a thermal contact point, which are arranged on a bottom surface of the carrier, a component and an electrical protection element which are arranged on the side of the top surface of the carrier, in which the first electrically conductive structure is electrically conductively connected to the first electrical contact point, the second electrically conductive structure is electrically conductively connected to the second electrical contact point, the third electrically conductive structure is electrically conductively connected to the thermal contact point, the component is electrically conductively connected to the first and second electrically conductive structures, the electrical protection element is electrically conductively connected to the third electrically conductive structure and the first or second electrically conductive structure.

A light emitting module and the like having a higher heat-dissipation effect includes a light emitting element mounting substrate, one or more light emitting elements, a heatsink including a through-hole in a position corresponding to a screw hole, a bolt screwed in the screw hole and fastening the heatsink and a metal plate or a full thread and a nut for the fastening. In the light emitting element mounting substrate, the metal plate, an insulating layer, and an electrode layer on which the one or more light emitting elements are mountable are stacked in this order. The metal plate includes a bottomed screw hole opened at a surface opposite to a surface in contact with the insulating layer. The bolt or the full thread and the nut have a heat conductivity equal to or greater than that of the metal plate.

A light source module includes at least one light source emitting light, and a body supporting the light source. The body includes a heat sink absorbing heat from the light source and dissipating the heat to the outside, an insulating layer having electrical insulating properties, the insulating layer being provided on at least one surface of the heat sink, and a conductive layer provided on the insulating layer to enable electric current to flow therein. The conductive layer includes an electrically conductive layer providing a path region in which electric current is applied to the light source, and a heat dissipation conductive layer diffusing generated by the light source. Accordingly, it is possible to obtain effects such as rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, and promotion of heat dissipation. Furthermore, it is possible to obtain various effects that can be understood through configurations described in embodiments.

A method of manufacturing a component carrier is presented. The method includes providing a base structure having a front side and a back side, the back side being at least partially covered by a metallic layer, removing material of the base structure from the front side to thereby form a cavity which is at least partially closed by the metallic layer, inserting a component in the cavity and placing the component on the metallic layer.