A ceramic circuit board and a method of making are provided. The ceramic circuit board includes a substrate and a composite material layer. The composite material layer is formed on the substrate and comprises metal oxide powders and ceramic powders. The composite material layer has an interface layer which is transformed from the metal oxide powders by reduction and includes comprises zero-valent metal, lower-valent metal oxide and eutectic mixture reduced from the metal oxide powders of the composite material layer.

A print circuit board and a manufacturing method thereof are disclosed. The print circuit board includes a first substrate, a first insulating layer and a metal sheet. The first insulating layer is formed between the first substrate and the metal sheet. The insulating layer includes silicon-based polymer compound. The manufacturing method for the print circuit board includes the following steps: coating a first substrate and a metal sheet with insulating material, placing the first substrate and the metal sheet into a heating device to bake the insulating material on the first substrate and the metal sheet, and bonding the metal sheet onto the first substrate through thermally pressing the baked insulating material. The insulating material includes silicon-based polymer compound.

A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an inner layer including at least one insulating layer and wiring parts, and outer layers disposed on opposing sides of the inner layer, the outer layers including reinforcing layers and wiring parts, the reinforcing layers having a greater degree of rigidity than the insulating layer.

A method for making conformal non-planar multi-layer circuitry is described. The method can include providing a substrate having a non-planar surface and depositing a first conformal dielectric layer on the substrate, the first conformal dielectric layer conforming to the non-planar surface of the substrate and having a non-planar surface. The method can also include applying a first conformal circuitry layer on the first conformal dielectric layer. The method can include depositing a second conformal dielectric layer on the first conformal circuitry layer, the second conformal dielectric layer conforming to a non-planar surface of the first conformal circuitry layer, and applying a second conformal circuitry layer on the second conformal dielectric layer. Successive layers can be sequentially deposited.

In a suspension board, a first insulating layer is formed on a support substrate. A ground layer and a power wiring trace are formed on the first insulating layer. The ground layer has electric conductivity higher than that of the support substrate. A second insulating layer is formed on the first insulating layer to cover the ground layer and the power wiring trace. A write wiring trace is formed on the second insulating layer to overlap with the ground layer. In a stacking direction of the support substrate, the first insulating layer and the second insulating layer, a distance between the ground layer and the write wiring trace is larger than a distance between the power wiring trace and the write wiring trace.

A light source module includes a light source for emitting light, and a heat sink for absorbing heat from the light source and dissipating the heat to the outside. The heat sink includes a mounting part for attaching the light source, and a heat dissipation fin for absorbing heat generated by the light source and dissipating the heat to the outside. An electrical insulating layer is provided on at least one surface of the heat sink, and an electrically conductive layer is provided in the insulating layer. The electrically conductive layer provides a path through which electric current is applied to the light source. A lens cover is provided over the light source.

An illumination device including an LED mounting platform (2) having a peripheral region (2a) and a relatively inner region (2b); at least one warm white LED (3) and at least one cool white LED (4) mounted adjacent the peripheral region (2a) of the LED mounting platform (2), and, at least one RGB LED (5) mounted adjacent the relatively inner region (2b) of the LED mounting platform (2); a diffusion cover (10) configured to allow light emitted from the at least one warm white LED (3), the at least one cool white LED (4), and the at least one RGB LED (5) to pass therethrough; and wherein at least one light emission characteristic of light emitted from the at least one warm white LED (3), the at least one cool white LED (4), and/or the at least one RGB LED (5) is configured to be selectably varied in response to an input control signal so as to produce a plurality of lighting modes.

A light emitting diode (LED) module may include a direct current (DC) voltage node formed on a first layer. The DC voltage node may be configured to sink a first current. One or more devices may be formed on the first layer configured to provide a second current to one or more LEDs. A device of the one or more devices may carry a steep slope voltage waveform. A local shielding area may be formed in a second layer directly below the DC voltage node and the one or more devices. The local shielding area may include a substantially continuous area of conductive material. A conductive via may extend through one or more layers. The conductive via may electrically connect the DC voltage node and the local shielding area.

An assembly sheet includes a wiring circuit board, a frame, and a reinforcement portion. The wiring circuit board has a support layer, a base insulating layer, and a conductive pattern. The frame supports the wiring circuit board. The reinforcement portion is disposed on the frame and reinforces the frame. The reinforcement portion has a first layer made of a metal and a second layer made of a metal.

An EMC filter device for power electronics of an electric machine includes an electrical conductor structure having at least two separate conducting layers that are insulated from one another; an inductor that cooperates with the electrical conductor structure; and a plurality of additional electronic components fastened to the electrical conductor structure.