A method of manufacturing component carriers is disclosed. The method includes providing a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, forming a first hole in a core of the stack and subsequently embedding a first component in the first hole, thereafter forming a second hole in the same core of the stack and subsequently embedding a second component in the second hole. A component carrier has a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A first hole is formed in a core of the stack. A first component is embedded in the first hole. A second hole is formed in the same core of the stack and subsequently a second component is embedded in the second hole.

A component carrier includes an electrically insulating layer structure, a first electrically conductive layer structure, a second electrically conductive layer structure, and a laser through-hole with an electrically conductive medium filling at least part of the through-hole. The first electrically conductive layer structure covers a first side of the electrically insulating layer structure and has a first window extending through the first electrically conductive layer structure formed by etching using a conformal mask. The second electrically conductive layer structure covers an opposed side of the electrically insulating layer structure and has a second window extending through the second electrically conductive layer structure formed by etching using a conformal mask. The laser through-hole extends through the electrically insulating layer structure. At least a portion of at least one sidewall of the electrically conductive layer structures delimiting the windows is tapered.

A component carrier and a method of manufacturing a component carrier are provided. The component carrier includes a stack having a front side and a back side, the stack including a plurality of stacked electrically insulating layer structures, a through hole being narrower in its inner portion compared to its exterior portions and extending through the plurality of electrically insulating layer structures so that sidewalls of each of the electrically insulating layer structures delimit respective parts of the through hole, and an electrically conductive filling medium filling at least a part of the through hole.

A composite substrate that includes: an upper ceramic layer; a lower ceramic layer; a middle resin layer between the upper ceramic layer and the lower ceramic layer; and a side surface resin layer on all side surfaces of the composite substrate, wherein the middle resin layer and the side surface resin layer are integral resin layers.

A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first conductive layer; defining a first trace pattern including one or more traces in the first laminate; providing a second laminate including a second insulating layer and a second conductive layer; defining a second trace pattern including one or more traces in the second laminate; defining access holes in the second insulating layer; at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and aligning and attaching the first laminate to the second laminate to create a laminated substrate.

A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first conductive layer; defining a first trace pattern including one or more traces in the first laminate; providing a second laminate including a second insulating layer and a second conductive layer; defining a second trace pattern including one or more traces in the second laminate; defining access holes in the second insulating layer; at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and aligning and attaching the first laminate to the second laminate to create a laminated substrate.

Disclosed herein is a system for drilling in a multilayer printed circuit board. The system includes a source of electromagnetic radiation configured to transmit a measurement pulse in open air to a workpiece, an anode, a resettable electric charge sensor (ECS), operably connected to the anode, and a control unit, configured to receive at least one value indicative of the quantity of at least part of charged molecules received at the anode and determine a second value indicative of the quantity of charged molecules received at the anode that were derivative of emitted electrons responsive to the measurement pulse.

A method of manufacturing a component carrier is disclosed. The method includes providing an electrically insulating layer structure having a front side and a back side, wherein the front side is covered by a first electrically conductive layer structure and the back side is covered by a second electrically conductive layer structure, carrying out a first opening process, such as a first laser drilling, through the first electrically conductive layer structure and into the electrically insulating layer structure from the front side to thereby form a blind hole in the electrically insulating layer structure, and thereafter carrying out a second opening process, such as a second laser drilling, through the second electrically conductive layer structure and through the electrically insulating layer structure from the back side to thereby extend the blind hole into a through hole, in particular a laser through hole, with substantially trapezoidal shape.

A flexible circuit (FC) and a method of forming the FC each include providing a first dielectric layer, applying a plurality of conductive circuit traces that are substantially parallel to each other to the first dielectric layer, providing a second dielectric layer atop the first dielectric layer and the plurality of conductive circuit traces to form a third dielectric layer having the plurality of conductive traces disposed therein and being configured to support and insulate the plurality of conductive traces, and forming a plurality of channels extending at least partially through a thickness of the third dielectric layer, wherein the plurality of channels are arranged between the plurality of conductive circuit traces and substantially parallel thereto and are configured to provide increased flexibility of the FC.

A circuit board includes: a first substrate including a first through hole, a first metal layer formed over an inner wall of the first through hole, and a first conductive composite resin provided on an inner side of the first metal layer of the first through hole; and a second substrate stacked together with the first substrate and including a second through hole that faces the first through hole and has a first open end which is provided on a side of the first through hole and is located on the inner side of the first metal layer, and a second conductive composite resin that is provided in the second through hole and is coupled to the first conductive composite resin.