The present invention relates to a carrier foil-attached metal foil, a laminate for a printed wiring board manufactured using the carrier foil-attached metal foil, and a manufacturing method of the laminate for the printed wiring board.

A sensor device for integration in an electrical circuit includes a support layer (12), which is formed with a release layer; at least one flexible insulating layer (14, 32), which is made using a printing method; and at least one flexible electrical conductor structure (20, 34), which is applied with a printing method onto the insulating layer (14). The insulating layer (14, 32) and the conductor structure (20, 34) form a flexible unit, which is removable without damage from the support layer (12).

There is provided a copper foil provided with a carrier exhibiting a high peeling resistance against the developer in the photoresist developing process and achieving high stability of mechanical peel strength of the carrier. The copper foil provided with a carrier comprises a carrier; an interlayer disposed on the carrier, the interlayer having a first surface adjacent to the carrier and containing 1.0 atom % or more of at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W and Ni and a second surface remote from the carrier and containing 30 atom % or more of Cu; a release layer disposed on the interlayer; and an extremely-thin copper layer disposed on the release layer.

A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board (10) comprises the following steps: drilling a hole on a substrate (11), the hole comprising a blind hole and/or a through hole (S1); on a surface (12) of the substrate, forming a photoresist layer having a circuit negative image (S2); forming a conductive seed layer on the surface (12) of the substrate and a hole wall (19) of the hole (S3); removing the photoresist layer, and forming a circuit pattern on the surface (12) of the substrate (S4), wherein Step S3 comprises implanting a conductive material below the surface (12) of the substrate and below the hole wall (19) of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.

A sensor device for integration in an electrical circuit, including a support layer (12), which is formed with a release layer; at least one flexible insulating layer (14, 32), which is made using a printing method; and at least one flexible electrical conductor structure (20, 34), which is applied with a printing method onto the insulating layer (14). The insulating layer (14, 32) and the conductor structure (20, 34) form a flexible unit, which is removable without damage from the support layer (12).

A process for producing a structured surface, in which a composition comprising nanowires is applied to a surface and structured, especially by partial displacement of the composition. When the solvent is removed, the nanowires aggregate to form structures. These may be transparent and also conductive.

A thin substrate has a layered structure on one surface, and can also have a layered structure on the other. Each layered structure can include a part of at least one patterned layer that, if patterned by photolithography, would frequently result in damage to the substrate due to fragility. For example, the substrate could be a 3 mil (76.2 m) or thinner polyimide film and one patterned layer could be a semiconductor material such as vanadium oxide, while another could be metal in electrical contact with semiconductor material. The layer part, however, can be patterned by a printing operation or can include a printed patterned artifact such as an uneven boundary or an alignment. The printing operation can be direct printing or printing of a mask for etching or liftoff or both. The layered structure can include an array of cells, each with layer parts on each substrate surface.

A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires which may be embedded in a matrix. The conductive layer is optically transparent and flexible. It can be coated or laminated onto a variety of substrates, including flexible and rigid substrates.

A PCB having multiple stacked layers laminated together. The laminated stack includes regular flow prepreg and includes a recessed cavity, a bottom perimeter of which is formed by a photo definable, or photo imageable, polymer structure, such as a solder mask frame, and a protective film. The solder mask frame and protective film protect inner core circuitry at the bottom of the cavity during the fabrication process, as well as enable the use of regular flow prepreg in the laminated stack.

A method for making an electronic assembly includes applying a conductive adhesive to a resist layer overlying a patterned conductive nanowire layer on a substrate and engaging an electrical contact of an electronic component with the conductive adhesive to provide an electrical connection between the electronic component and the conductive nanowire layer.