Disclosed is a printing screen assembly, a frame for a printing screen and method for their construction. The printing screen assembly has a frame (310) with an elongate first frame member (320, 320a) and an elongate second frame member (320, 320b) parallel to the first frame member (320, 320a) and in fixed relation thereto; and a corresponding cantilevered first and second tensioning arrangement (326) extending from each frame member (320) along a length thereof. A predictable pre-tensioning force may be applied by resiliently deflecting the tensioning arrangements (326) into contact with an abutment arrangement (328) and securing a printing screen to an attachment portion (326b) of the first tensioning arrangement (326a), while the first tensioning arrangement (326) is in contact with the first abutment arrangement (326a). The frame may be formed by preselecting the resilience of the tensioning arrangement (326) so as to preselect the tension applied when tensioning a printing screen in use.

A stencil-avoidance design method, a stencil-avoidance design device, an electronic device, and a non-transitory storage medium are provided. The method includes: obtaining a plurality of first regions and a plurality of first stencil aperture regions; determining whether a shortest distance between a selected first region of the plurality of first regions and a selected first stencil aperture region of the plurality of first stencil aperture regions is within a preset threshold range; further obtaining a second region and a second stencil aperture region if the shortest distance is within the preset threshold range, and then obtaining a third region; performing a collision step if a collision test is required, and obtaining a final stencil aperture region. The above method can improve the efficiency, accuracy, coverage, and comprehensiveness of the stencil avoidance design.

An electrical device, comprising a softening polymer layer, an electrode layer on a surface of the softening polymer layer and a cover polymer layer on the surface of the softening polymer layer. An opening in the polymer cover layer is filled with a reflowed solder, one end of the reflowed solder, located inside the opening, contacts a contact pad site portion of the electrode layer, and another end of the reflowed solder contacts an electrical connector electrode of the device.

A method for manufacturing a light-emitting module includes a step of providing a bonded board including a board including, on a first surface, a circuit pattern and wiring pads that are continuous with the circuit pattern and each have bottomed holes and light-emitting segments connected on a second surface of the board with an adhesive sheet interposed therebetween and including an array of light-emitting devices; a step of supplying electrically conductive paste inside the bottomed holes and on portions of the surface of the wiring pad around the bottomed holes through openings of a mask; and a step of performing thermal compression to harden the electrically conductive paste such that the thickness of the electrically conductive paste on the portions of the surface of the wiring pad is smaller than the electrically conductive paste at the timing of being disposed through the openings of the mask.

The inventive concepts relate to a method of manufacturing a hybrid metal pattern and a hybrid metal pattern manufactured thereby. In the method, the hybrid metal pattern may be manufactured on a substrate (e.g., a flexible substrate), formed of various materials, at room temperature without damaging the substrate, by a wire explosion method in liquid and light-sintering. In more detail, when performing the wire explosion method in liquid according to conditions of the inventive concepts, metal particles having uniform nano-sizes and uniform micro-sizes can be formed by a simple process, and additional dispersing and collecting processes can be omitted. In addition, conductive hybrid ink is formed by adding a metal precursor and then is light-sintered. In this case, the hybrid metal pattern can be manufactured by a very simple process.

The supply unit is used in a printing device to perform a print process of a viscous fluid on a printing target to supply the viscous fluid. The supply unit includes an attachment section to and from which a cartridge accommodating the viscous fluid is attachable or detachable, a restricting wall section configured to cover the cartridge and restrict access to an inside of the printing device, and a driving section configured to move the cartridge attached to the attachment section and the restricting wall section in a supply operation direction.

An apparatus that communicates with a screen printer and a solder inspection device is disclosed. The apparatus according to the present disclosure may include a process that is configured to: obtain first information associated with each of a plurality of pads on the substrate; obtain second information associated with each piece of the solder paste applied to each of the plurality of pads from the solder inspection device; determine a position correction value for the stencil mask with respect to the substrate based on the first information and the second information; and deliver the position correction value to the screen printer.

Stencil frames for tensioning stencils of an angular shape are provided. The stencil frame comprises corner elements (2), edge elements (1), fastening elements (13) and tensioning devices with a tensioning device being associated with each edge element (1). The corner elements (2) each have two, mutually perpendicular, guiding profiles (12) which joined at an intersection of their axes and the edge elements (1) each have a uniaxial reception profile (11). Each reception profile (11) is connectable to two guiding profiles (12) by loose fit. Each tensioning device has at least one elastic element (5) and connects between two neighbouring corner elements (2). A line of force exerted by each tensioning device is parallel to the axis of its corresponding reception profile (11).

A system for generating a program used to direct the operation of a solder paste inspection machine is provided. The system includes a solder paste inspection system having a stencil mounting bracket located therein and configured to hold a solder paste printing stencil in position within an inspection region of the solder paste inspection system. An image sensor is mounted in the solder paste inspection system and is configured to acquire images of a stencil mounted on the stencil mounting bracket. A controller is coupled to the image sensor and is configured to generate a solder paste inspection program using the acquired images of the stencil.

A system is provided to align a movable cart to an assembly apparatus. The assembly apparatus has at least one item of a plurality of items for replacement within the assembly apparatus. The assembly apparatus includes a docking station. The movable cart is configured to receive a used item and/or provide a new item to the assembly apparatus. The movable cart includes an interface configured to dock within the docking station of the assembly apparatus. The system includes a sensor associated with one of the assembly apparatus and the movable cart and a laser associated with the other of the assembly apparatus and the movable cart. The sensor and the laser are configured to align the movable cart with the assembly apparatus after an initial docking of the movable cart within the docking station of the assembly apparatus.