A squeegee for spreading a conductive paste across a stencil during a stencil printing process is provided. The stencil covers an underlying base such that the conductive paste is spread across the stencil and into openings in the stencil to contact the underlying base. The squeegee has a leading surface at the front of the squeegee, a trailing surface at the rear of the squeegee, and a bottom surface. The bottom surface is oriented at an oblique angle relative to the leading surface and the trailing surface. In some embodiments, a rear corner or edge of the squeegee is the contact point between the squeegee and the stencil. Some of the paste can be collected beneath the bottom surface and scraped along with the squeegee.

A paste dispensing transfer system of a stencil printer is configured to print an assembly material on an electronic substrate. The transfer system includes a paste cartridge mechanism coupled to a print head assembly of the stencil printer, and a rotary indexing mechanism coupled to a frame of the stencil printer. The paste dispensing transfer system is configured to transfer a used paste cartridge from the print head assembly to the rotary indexing mechanism supported by the frame and to transfer a new paste cartridge from the rotary indexing mechanism to the print head assembly.

The present application provides a method for providing solder paste, for providing solder paste accommodated in a solder paste tub into a solder paste printer, the method comprising: inserting a solder paste nozzle into a housing of the solder paste tub through an opening of the solder paste tub, wherein solder paste is accommodated in the housing of the solder paste tub; bearing the solder paste tub, with the opening facing downward, on a working platform by means of the solder paste nozzle; holding the solder paste tub by mating a holder with an engagement means on an outer wall of the housing of the solder paste tub, the holder being capable of moving up and down with the housing of the solder paste tub; and pressing the housing of the solder paste tub, such that the housing of the solder paste tub moves relative to the solder paste nozzle, at the same time causing the holder to move as the housing of the solder paste tub moves, so as to extrude solder paste accommodated in the housing of the solder paste tub from the solder paste nozzle.

The disclosure is and includes at least an apparatus, system and method printing multilayer circuits on graphics. The multilayer print may include forming an electronic human machine interface, sensor readout, or a driver circuit, by way of example, and may include successively printing at least two functional ink layers comprising at least one conductive layer and at least one dielectric layer on a substrate comprising one of a thermoform and an overmold; printing at least one non-conductive graphical ink layer in the succession of the successively printing; curing each of the successively printed layers after the printing of each of the successively printed layers, wherein the curing of the successively printed functional ink layers comprises at least an ultra-violet curing; and squeegeeing at least the at least one conductive layer with a squeegee having a low durometer.

A screen printer comprising: a board positioning device configured to convey and hold a board to a work position in the screen printer; a mask holding device configured to hold a mask above the work position; a squeegee device configured to spread a cream solder on a mask on the board; a correction device configured to correct a relative position between the board of the board positioning device and the mask of the mask holding device; a control device configured to acquire inspection data of a print state from a print inspection device provided inside or outside the screen printer and perform correction control on the correction device by a correction value corrected according to a deviation amount of printing based on the inspection data; and an input device configured to include an instruction input section that senses an inspection instruction operation of an operator and transmit, to the control device, an inspection data acquisition signal for acquiring the inspection data of the print state from the print inspection device based on an instruction operation of the operator to the instruction input section.

The present application provides an automatic solder paste addition apparatus and system for a solder paste printer, the apparatus comprising: a push rod, a pressure plate, a support plate, a movable plate and a working platform; the pressure plate moves up and down as the push rod moves up and down, the support plate is fixed in relation to movement of the push rod, an outer side of the movable plate is disposed on the support plate so as to be capable of sliding up and down, the pressure plate is disposed on an inner side of the movable plate so as to be capable of sliding up and down, and the working platform is fixed to the movable plate and used for bearing a solder paste tub, wherein a lower one-way locking mechanism is provided between the movable plate and the support plate, the lower one-way locking mechanism being configured to lock the movable plate when the movable plate is in the working position, so that the movable plate cannot move downward; and wherein an upper locking mechanism is provided between the movable plate and the pressure plate, the upper locking mechanism being configured so that the pressure plate can move relative to the movable plate when the movable plate is not moving, and can also move together with the movable plate when the movable plate is moving.

The present application relates to a stencil printing machine, which comprises a first holder device (110), a mobile device (121), two support tables (131, 132) and two driving devices (151, 152), wherein the first holder device (110) is configured to be able to horizontally reciprocate in the portrait orientation, the mobile device (121) is mounted on the first holder device (110) and is configured to be able to horizontally reciprocate in the landscape orientation on the first holder device (110), the two support tables (131, 132) are mounted at the lower end of the mobile device (121) and are used to bear corresponding solder paste jars (141, 142), the two driving devices (151, 152) are mounted on the mobile device (121) so that each of the two driving devices (151, 152) is located above a corresponding support table (131, 132) and is used to press a corresponding solder paste jar (141, 142), and the mobile device (121) is configured to be able to drive the two support tables (131, 132) and the two driving devices (151, 152) to reciprocate vertically. Two standard solder paste jars (141, 142) can be assembled for the stencil printing machine provided by the present application. When one solder paste jar (141, 142) is empty, solder paste supply is switched to the other solder paste jar (141, 142) and the stencil printing machine can continue to operate without stopping, thus improving the working efficiency of the stencil printing machine significantly.

Micro solder joint and stencil design. In one embodiment, a stencil for depositing solder on a printed circuit board (PCB) includes a plurality of stencil apertures, a first stencil aperture of the plurality of apertures having an aperture wall defining an aperture perimeter. The aperture wall is configured to not extend beyond an outer edge of a PCB pad provided on the printed circuit board, the aperture wall is also configured to not extend beyond an outer edge of a terminal of a surface mount component, and the first stencil aperture is configured to receive solder paste to form a non-convex solder joint between the PCB pad and the terminal.

A method for printing conductive solder paste on a base substrate to establish an electrical connection is provided. The method includes applying conductive solder paste over a stencil, and within an opening of the stencil to contact the base substrate therebeneath. In embodiments, a squeegee can be used to scrape some of the conductive solder paste off of the stencil, leaving behind some of the conductive solder paste within the opening. Subsequently, the stencil can be removed at a speed of more than 200 millimeters per second to help reduce the end-of-track bump ultimately formed at the end of the conductive solder paste that remains after the stencil is removed.

The supply unit is used in a printing device including a printing head configured to perform printing process of a viscous fluid on a printing target using a screen mask, a collection section having a collection member configured to contact the screen mask to collect and move the viscous fluid and a collecting and moving section configured to move the collection member in a predetermined printing direction. The supply unit includes a supply section having a mounting section capable of mounting and dismounting a cartridge accommodating the viscous fluid, a driving section configured to move the supply section in the supply operation direction, a detection member, and a supply section detecting section configured to detect whether the supply section is positioned in a passage space where the collection section and the supply section do not contact each other by the position of the detection member.