A system for normalizing the solder interconnects (e.g., normalizing the height of the solder ball interconnects) in a circuit package module (e.g., dual-sided mold grid array package module) after removal from a test board includes a fixture that receives the circuit package module upside down and a stencil removably coupleable to the fixture and over the circuit package module. The stencil has a pattern of apertures that coincides with the pattern of solder interconnects of the circuit package module. Solder paste can be applied over the stencil to pass through the apertures to add solder paste to the solder interconnects. The stencil can be removed from over the fixture, and the circuit package module removed from the fixture. The circuit package module can be heated to reflow the solder interconnects with the added solder paste.

A vacuum wiper, comprising a housing, a connection port, multiple holes and a hole adjusting means; the housing contains a cavity; the connection port is disposed on the housing and is in communication with the cavity; the multiple holes are disposed on the housing in the length direction of the housing, such that the cavity of the vacuum wiper housing is able to be in fluid communication with the outside via the multiple holes. The vacuum wiper has a maximum vacuumizing length when all of the multiple holes are in communication with the outside. The hole adjusting means is configured to be capable of blocking one or more of the multiple holes in sequence from two ends in the length direction of arrangement of the multiple holes of the vacuum wiper, such that the vacuum wiper is able to adjust the vacuumizing length. The provision of the hole adjusting means enables the vacuum wiping apparatus to have an adjustable vacuumizing length, in order to match the wiping of stencils with different length specifications, thereby effectively increasing the vacuumizing efficiency of the vacuum wiping apparatus and reducing the production cost.

A printing device includes a coating material scooping unit configured to scoop a coating material on a mask, and a controller configured or programmed to determine whether or not the coating material scooping unit performs collecting operation to collect the coating material on the mask when the mask is replaced.

A printing parameter acquisition device includes an acquisition section and an output section. The acquisition section acquires a printing condition for specifying a member to be used when solder is printed on a board. The output section outputs a printing parameter which is associated with a printing condition corresponding to a printing condition acquired by the acquisition section and of which a reliability is a predetermined level or more, from a database that stores the printing condition, a printing parameter used for controlling driving of a printer, and the reliability of the printing parameter including inspection information on a print state of the solder inspected by a printing inspector in association with each other.

A vacuum wiper, comprising a housing, a connection port, multiple holes and a hole adjusting means; the housing contains a cavity; the connection port is disposed on the housing and is in communication with the cavity; the multiple holes are disposed on the housing in the length direction of the housing, such that the cavity of the vacuum wiper housing is able to be in fluid communication with the outside via the multiple holes. The vacuum wiper has a maximum vacuumizing length when all of the multiple holes are in communication with the outside. The hole adjusting means is configured to be capable of blocking one or more of the multiple holes in sequence from two ends in the length direction of arrangement of the multiple holes of the vacuum wiper, such that the vacuum wiper is able to adjust the vacuumizing length. The provision of the hole adjusting means enables the vacuum wiping apparatus to have an adjustable vacuumizing length, in order to match the wiping of stencils with different length specifications, thereby effectively increasing the vacuumizing efficiency of the vacuum wiping apparatus and reducing the production cost.

A screen printing method of the present disclosure includes: a step of performing printing of a first viscous fluid through a screen on the first circuit board using a first squeegee and a first holding member; and a step of performing printing of a second viscous fluid through the screen on the second circuit board using a second squeegee and a second holding member. As described above, in the printing of the first viscous fluid on the first circuit board and the printing of the second viscous fluid on the second circuit board, squeegees and holding members different from each other are used, and thus, the first viscous fluid and the second viscous fluid do not mix with each other. As a result, it is possible to perform printing of different types of viscous fluids on the first circuit board and the second circuit board.

A template or stencil with perforations, which improves solder-paste stencilling on an object, includes: a first area treated with precision powder on a bottom laminar face of the template, the treated face covering at least an area where perforations are distributed; a second area treated with precision powder on a top laminar surface of the template, the second treated area encircling the perforations; and a third area treated twice with precision powder on the bottom laminar surface, the third area encircling the perforations of the template. A method for producing a template that improves solder-paste stencilling on an object is also provided, as is and to a method for the improved application of solder-paste on an object, such as a printed circuit board.

A screen printing apparatus includes a squeegee driver that lifts/lowers a first lifting/lowering shaft and a second lifting/lowering shaft; a link mechanism including a swinging member that pivots about a horizontal axis by lifting/lowering operations of the first lifting/lowering shaft and the second lifting/lowering shaft; a squeegee unit installed to the swinging member; and a controller that controls at least a height of the squeegee unit and an orientation of the squeegee unit in a rotating direction by controlling the squeegee driver.

Micro solder joint and stencil design. In one embodiment, a stencil for depositing solder on a printed circuit board (PCB) includes a plurality of stencil apertures, a first stencil aperture of the plurality of apertures having an aperture wall defining an aperture perimeter. The aperture wall is configured to not extend beyond an outer edge of a PCB pad provided on the printed circuit board, the aperture wall is also configured to not extend beyond an outer edge of a terminal of a surface mount component, and the first stencil aperture is configured to receive solder paste to form a non-convex solder joint between the PCB pad and the terminal.

A method of forming solder paste on an object is provided. The method includes providing a multilayered stencil, each stencil layer having an aperture formed therethrough from a top surface of the respective stencil layer to a bottom surface of the stencil layer. The method also includes applying the stencil to a surface of the object. The method also includes filling a void space formed by a combination of the apertures in the stencil layers with solder paste. The method also includes removing the stencil layers in a sequential manner to leave the solder paste.