A solder paste printer for which a pressing force of squeegee towards a stencil when spreading solder paste is smaller than a printing pressure when performing solder paste printing. The force with which the solder paste is pressed downwards by the squeegee is weak, and instead of solder paste being pressed down, it spreads along the squeegee. Also, the moving speed of the squeegee when spreading the solder paste is faster than the moving speed of the squeegee when printing solder paste. Thus, because the squeegee is moving fast, before the solder paste is pressed down sufficiently to be printed, the solder paste spreads out along the squeegee. Accordingly, it is possible to appropriately spread the solder paste along the direction in which the squeegee extends.

A screen printing device includes a printing work part; a mask storage part including a plurality of accommodating sections each capable of accommodating a screen mask; a transfer device that transfers the screen mask between each of the accommodating sections and the printing work part; a pair of first guide members that is disposed in the printing work part, and guides the screen mask during the transfer, the pair of first guide members having a variable interval; a pair of second guide members that is disposed in the accommodating sections, and guides the screen mask during the transfer; and a guide width determination device that determines whether or not the interval between the pair of first guide members coincides with the interval between the pair of second guide members.

In component mounting for mounting a pin connecting component having a pin on a board having a through-hole electrode, a solder paste is printed on the through-hole electrode through a screen mask having an opening corresponding to the through-hole electrode, a flux is transferred onto the pin by holding the pin connecting component and immersing the pin into a flux tank filled with the flux, and the pin onto which the flux is transferred is inserted into the through-hole electrode on which the solder paste is printed to mount the pin connecting component on the board.

A method for screen printing, including: by using a screen printing apparatus provided with a screen printing plate having an opening part corresponding to a printing pattern, a scraper, and a squeegee, filling a paste supplied on an upper surface of the screen printing plate into the opening part of the screen printing plate by the scraper; and, after that, pushing out the paste to a predetermined position of an object to be printed from the opening part of the screen printing plate by the squeegee to screen-print the paste corresponding to the printing pattern on the object to be printed, wherein the humidity in the screen printing apparatus is adjusted during the screen printing. As a result, by controlling an amount of moisture in the paste on the screen printing plate, a screen printing method is capable of improving the printing property of the paste.

The present application provides an apparatus for automatically clearing away residual solder paste, comprising: a working platform for bearing a solder paste tub accommodating a solder paste nozzle, the solder paste nozzle having a solder paste nozzle mouth, the working platform having a solder paste through-hole for accommodating the solder paste nozzle mouth; and a gas channel disposed in the working platform, the gas channel comprising a gas inlet and a gas outlet, the gas inlet being configured to be in communication with a cleaning gas source, and the gas outlet being configured to blow gas towards the solder paste nozzle mouth accommodated in the solder paste through-hole, thereby cutting solder paste remaining at the solder paste nozzle mouth.

In a printing device, a second storage position is displaced from a first storage position so as to enable a moving member to move a second mask arranged in a second storage in a state in which a first mask is arranged in the first storage position by movement of the first mask from an operation position to the first storage position by the moving member.

A printing device includes a controller configured or programmed to acquire, based on a width of a coating material that has been measured, at least one of a start position, an end position, or an amount of movement of a coating material scooping unit in coating material scooping operation.

On a glass substrate formed with a plurality of through holes, an electrode-portion forming step of forming an electrode portion in each of the through holes, a resin-material layer forming step of forming a resin-material layer on a topside of the glass substrate, a via-hole forming step of forming a via hole in a resin-material layer formed on the glass substrate at a location atop the electrode portion, a filling step of filling the via hole with a conductive elastic material, a semi-hardening step of semi-hardening the conductive elastic material, a separation step of separating the resin-material layer, an insulation-portion forming step of forming an insulation portion on the topside of the glass substrate by using an insulating elastic material, and a hardening step of hardening the insulation portion along with the conductive elastic material are performed.

A printed wiring board includes a substrate and wiring provided on a surface of the substrate and including a cured conductive paste. The conductive paste contains metal nanoparticles having an average particle diameter of 30 nm or more and 600 nm or less, metal particles having an average particle diameter larger than that of the metal nanoparticles, a thermosetting resin having an oxirane ring in a molecule, a curing agent, and a cellulose resin. The wiring has a length of 100 mm or more and 1600 mm or less, a width of 0.3 mm or more and 3 mm or less, a thickness of 10 μm or more and 40 μm or less, and a resistance value of 1000 mΩ/m or less.

A wiring board includes a rod-shaped shaft member including at one end a flange that has a larger diameter than any other portion, a heat-releasing plate including a first through-hole in which the shaft member is inserted, and a board including a second through-hole in which the shaft member is inserted. In the wiring board, a gap is formed at least in part between the heat-releasing plate and the board.