Proposed is a method of forming an electrode on a surface of an object by using inkjet printing, the method including forming a buffer on an outer edge of an electrode formation position, and forming the electrode by filling electrode ink inside the buffer, wherein the buffer formation is performed by stacking buffer layers formed by inkjet printing of buffer ink, and hydrophilicity of a surface of each of the buffer layers is lower than hydrophilicity of the object surface. According to an electrode forming apparatus, the buffer constituting the outer edge of the electrode is formed high and the electrode ink is filled inside the buffer to form the electrode, thereby enabling the formation of the electrode having an increased sectional area.

A method for obtaining a glazing includes a glass sheet covered, on one of its faces with electroconductive patterns having in at least one area, a so-called extra thickness area, a greater thickness than in the other areas, the method including depositing by screenprinting a first electroconductive layer forming patterns on one side of the glass sheet, then depositing by a digital printing technique, in the or each extra thickness area, a second electroconductive layer on the first layer while the latter is still wet, then a heat treatment step to cure the first and the second layer.

A circuit module is provide that includes a substrate including a first surface and a second surface that are opposite to each other, an IC mounted on the first surface of the substrate, a circuit disposed on the first surface and the second surface of the substrate with a conductor pattern obtained by heat curing of conductive paste, and connected between the IC and an external circuit, and a dummy conductor pattern obtained by heat curing of the conductive paste, disposed on at least one of the first surface and the second surface of the substrate, and configured to maintain a balance of the conductive paste on the first surface and the second surface of the substrate.

A printed substrate forming method includes: a resin layer forming step of forming a resin layer with curable resin in a specific region that is a region other than a predetermined region of a base which is composed of an insulating layer and a conductor layer, the predetermined region of which being a region on which a solder resist is formed; and a wiring forming step of forming a wiring by discharging metal-containing liquid which contains metal fine particles onto a top surface of the resin layer, and firing the metal-containing liquid.

A method and system for manufacturing a coil for wireless charging are disclosed herein. The method may include manufacturing a printed circuit board, generating a coil-shaped metal pattern on the printed circuit board, and generating an additional metal pattern on the top of the metal pattern using a 3D metal printer.

An apparatus for producing a printed circuit board on a substrate, has a table for supporting the substrate, a function head configured to effect printing conductive and non-conductive materials on the substrate, a positioner configured to effect movement of the function head relative to the table, and a controller configured to operate the function head and the positioner to effect the printing of conductive and non-conductive materials on the substrate. The apparatus optionally has a layout translation module configured to convert PCB files or multilayer PCB files to printing data for controlling the function head to print conductive material and nonconductive material onto the substrate. The apparatus has a testing head to verify conductors which operates automatically. The translation module also prints nonconductive material component alignment areas and nonconductive material substrate stiffeners.

Water-based nanoparticle inks may be formulated to be compatible with printed electronic direct-write methods. The water-based nanoparticle inks may include a functional material (nanoparticle) in combination with an appropriate solvent system. A method may include dispersing nanoparticles in a solvent and printing a circuit in an aerosol jet process or plasma jet process.

The invention relates to a medical device comprising a printable electrical component (1), the printable electrical component (1) comprising a plastic substrate (L1) wherein at least electrical component (E) is applied to the plastic substrate, wherein the electrical component (E) comprises a dried conductive ink, wherein the plastic substrate is selected from the group comprising polycarbonate, cycloolefin copolymers, polymethylacrylate, polypropylene and wherein the dried conductive ink comprise silver and/or gold, wherein the electrical component (E) comprises feather-like and/or meander-like and/or spiral-shaped sections, whereby the medical device further comprises a fluid line, wherein the printable electrical component is located on the outside of the fluid line. The invention also relates to a medical device comprising a printable electrical component (1) the printable electrical component (1) comprising a plastic substrate (L1), wherein at least one electrical component (E) is applied to the plastic substrate, wherein the electrical component (E) comprises a dried conductive ink, wherein the plastic substrate is selected from a group comprising polycarbonate, cycloolefin copolymers, polymethyl-methacrylate, polypropylene and wherein the dried, conductive ink comprises silver and/or gold, wherein the electrical component (E) comprises at least one conductor section or at least two electrodes, characterized in that the electrical component (E) is part of an expansion sensor and/or a pressure sensor and/or a thermal flow sensor.

Described herein are ultra-thin nanocellulose flexible electronic device on which SU-8, an epoxy material which can become highly stressed upon UV exposure, is printed on desired areas. Upon UV exposure and then release from the surface it is anchored on, the nanocellulose device will spontaneously self-mold into a desired form due to stress differences between the SU-8 and the nanocellulose sheet. The flexible electronics can be manufactured using standard printed circuit board processing techniques, including electroless metallization and soldering of surface mount components.

Aspects of the present disclosure relate to an apparatus comprising: a substrate; communication circuitry deposited on said substrate; and ballot circuitry deposited on said substrate. The ballot circuitry comprises: a plurality of voting circuitry elements, each voting circuitry element being responsive to a voting operation to change a conductive state of that voting circuitry element; and logic circuitry communicatively coupled with each of the plurality of voting circuitry elements and with the communication circuitry. The logic circuitry is configured to: detect the conductive state of each of the plurality of voting circuitry elements; and transmit, via the communication circuitry and based on the conductive state of each of the plurality of voting circuitry elements, a voting result.