The present invention relates to an assembly to be used in an inkjet printer, an inkjet printer and a method for printing. The assembly comprises (i) a first fixture configured to hold a first print head; and (ii) at least two processing lines A, B, C, D, wherein each processing line A, B, C, D includes a first printing section in which a functional layer is printed on a surface of an electronic device, a sintering section spaced apart from the first printing section and configured to sinter the functional layer, wherein the sintered functional layer exhibits a crystal lattice structure, and a transport mechanism (4) configured to move from the printing section to the sintering section. The first fixture is movable from one processing line A, B, C, D to another processing line A, B, C, D.

Described herein are methods for forming resistive heaters and force sensing elements on a flexible substrate, and devices that include these elements to provide a force responsive conductive heater, such as a seat heater in a vehicle. The methods include printing a conductive ink on a flexible substrate that is heated to 30° C. to 90° C. before and/or during the printing process and curing the substrate to produce a conductive pattern thereon. The conductive inks generally include a particle-free metal-complex composition formulated from at least one metal complex and a solvent, and optionally, a conductive filler material.

The present disclosure relates to a substrate processing apparatus and a substrate processing method, for manufacturing a flexible circuit board, and more specifically, to a substrate processing apparatus and a substrate processing method, for manufacturing a flexible circuit board, capable of manufacturing a flexible circuit board with a fine line width without undergoing a photolithographic process using a mask.

The substrate processing apparatus and the substrate processing method, for manufacturing a flexible circuit board, according to the present disclosure, can efficiently manufacture a flexible circuit board having a fine line width at low costs.

A method of producing a functional vehicle component includes fixing a leather sheet over a surface of a vehicle component, applying a flexible electronic circuit to an A-surface of the leather sheet, and arranging a pigmented coating over the circuit. The pigmented coating inhibits or prevents the circuit from being visible through the pigmented coating. The method may include attaching an electronic element, such as a light source, a sensor, a wireless transmitter, or a switch, to the circuit. When the circuit includes a light source, the pigmented coating inhibits or prevents the light source from being visible through the pigmented coating, but light emitted by the light source is visible through the pigmented coating.

To provide a wiring formation method that can increase the wiring density in a case where wiring is formed on an inclined surface by three-dimensional additive manufacturing. The wiring formation method of the present disclosure includes a metal member forming step of forming multiple metal members with a first fluid containing metal particles, a resin layer forming step of forming a resin layer including an upper surface and an inclined surface inclined downward from the upper surface, and a connection wiring forming step of forming multiple connection wirings on the inclined surface and the upper surface of the resin layer with a second fluid containing metal particles, and the connection wirings being formed to individually connect the multiple connection wirings to the multiple metal members on a lower surface of the inclined surface.

The present invention relates to a method for manufacturing an electronic or electrical system, the method comprising the layer-free production of at least one physical structure (101, 102) which is designed to guide electromagnetic waves, using at least one additively operating apparatus, wherein the layer-free production of the spatial, layer-free structure comprises the simultaneous or sequential application and/or removal of one or more materials in the spatial arrangement, as a result of which the electronic or electrical system is partially or completely formed. The invention further relates to a system which is manufactured in accordance with the method.

A method for forming a conductive fine pattern according to an embodiment forms a conductive fine pattern on a substrate having identical surface energy by using inkjet printing for printing ink along a path. The method includes a droplet ejection process of simultaneously performing, discharging photocurable ink at the front side of the path, discharging volatile ink containing minute metal particles at the rear side of the path, and applying light energy to the discharged photocurable ink. The light energy is configured to have a light intensity such that: the photocurable ink is semi-cured and ejected in a gel state on the substrate, and thus forms a boundary with liquid volatile ink ejected on the substrate; and the photocurable ink is completely cured after the ejection of both the photocurable ink and the volatile ink is completed.

A method for curing solder paste on a thermally fragile substrate is disclosed. An optically reflective layer and an optically absorptive layer are printed on a thermally fragile substrate. Multiple conductive traces are selectively deposited on the optically reflective layer and on the optically absorptive layer. Solder paste is then applied on selective locations that are corresponding to locations of the optically absorptive layer. After a component has been placed on the solder paste, the substrate is irradiated from one side with uniform pulsed light. The optically absorptive layer absorbs the pulsed light and becomes heated, and the heat is subsequently transferred to the solder paste and the component via thermal conduction in order to heat and melt the solder paste.

Research on practical realization of various types of printable devices has progressed, and the realization of devices in which these printable devices are integrated on a flexible board is expected. However, there is the problem that, if a plurality of printable devices are simply integrated on the same board, the area of the integrated device increases, and the yield ratio greatly decreases. An integration technique that solves the problem of an increase in the area and a decrease in the yield ratio is in demand. Electronic devices to be integrated are formed on individual boards, the boards are laid to overlap each other in a predetermined relationship, and then through-vias are formed at predetermined positions. With this, the electronic devices are electrically connected to each other, and function as an integrated device.

According to the present disclosure, a support structure for lighting devices, e.g. LED lighting devices, is provided with an electrically insulating core layer having a first and a second mutually opposed surfaces, with mounting locations for electrically-powered light radiation sources on the first surface, a network of electrically conductive lines printed on said first surface, at least some of said electrically conductive lines extending between the mounting locations and fixed locations on the first surface, and electrical distribution lines of electrically conductive material on the second surface of the core layer, and electrically conductive vias extending through core layer and electrically coupling the electrical distribution lines on the second surface with the electrically conductive lines at said fixed locations on the first surface.