A method of manufacturing support elements for lighting devices includes: providing an elongated, electrically non-conductive substrate with opposed surfaces, with an electrically-conductive layer extending along one of said opposed surfaces, etching said electrically-conductive layer to provide a set of electrically-conductive tracks extending along the non-conductive substrate with at least one portion of the non-conductive substrate left free by the set of electrically-conductive tracks, forming a network of electrically-conductive lines coupleable with at least one light radiation source at said portion of said non-conductive substrate left free by the electrically-conductive tracks. Said forming operation includes selectively removing e.g. via laser etching a further electrically-conductive layer provided on said non-conductive substrate, or printing electrically-conductive material onto the non-conductive substrate. The electrically-conductive tracks and the network of electrically-conductive lines may be coupled with each other e.g. by means of electrically-conductive vias extending through the non-conductive substrate.

A substrate includes a dielectric layer, a first metal bar, a plurality of first traces, a plurality of first openings, a second metal bar, and at least one second opening. The dielectric layer has a first major surface and a second major surface opposite to the first major surface. The first metal bar is on the first major surface. The plurality of first traces are on the first major surface. Each first trace is connected at one end to the first metal bar. The plurality of first openings expose the dielectric layer on the first major surface and intersect a first trace. The second metal bar is on the second major surface. The at least one second opening exposes the dielectric layer on the second major surface and intersects the second metal bar. The first openings are laterally offset with respect to the at least one second opening.

A wiring substrate includes an insulating layer having a front surface and a back surface and at least two wiring parts that are disposed at least on the front surface of the insulating layer and that are insulated from each other. At least one of the wiring parts is electrically isolated on the insulating layer. Each of the wiring parts includes a conductive base layer disposed on the front surface of the insulating layer, a conductive layer disposed on a front surface of the conductive base layer, and a conductive covering layer arranged to cover at least a portion of a front surface of the conductive layer, at least a portion of a side surface of the conductive base layer, and at least a portion of a side surface of the conductive layer. The conductive base layer and the conductive layer overlap and coincide with each other in plan view.

A component carrier including an electrically insulating core, at least one electronic component embedded in the core, and a coupling structure with at least one electrically conductive through-connection extending at least partially therethrough and having a component contacting end and a wiring contacting end. The electronic component directly contacts the component contacting end. The wiring contacting end is directly electrically contacted to the wiring structure. The exterior surface portion of the coupling structure has homogeneous ablation properties and surface recesses filled with an electrically conductive wiring structure. A method includes embedding an electronic component in an electrically insulating core, providing a coupling structure with a conductive connection having a component end and a wiring end, connecting the electronic component directly to the component end, providing a surface portion of the coupling structure with homogeneous ablation properties, patterning the surface portion with recesses and filling the recesses with a wiring structure such that the wiring end is contacted directly.

Methods, and devices produced by the methods, for electroplating a multitude of micro-scale electrodes that are electrically isolated from each other on a cable or other device is described. A localized area of connections on another end of the cable is shorted together by depositing a metal sheet or other conductive material over the localized area. The metal sheet is connected to a terminal of a power supply, and the electrode end of the cable is immersed in an electrolyte solution for electrodeposition by electroplating. After the electrodes are electroplated, the metal sheet is removed from the cable in order to re-isolate the electrodes.

According to an embodiment, a printed circuit board and an electronic device is disclosed. The printed circuit board includes a first pattern configured to be formed in a first layer. The printed circuit board also includes a second pattern configured to be formed in at least one second layer under the first layer. The printed circuit board also includes a via configured to electrically connect the first pattern to the second pattern. The printed circuit board further includes a recess configured to be formed by removing at least a portion of an area in which the via is formed and to electrically separate the first pattern from the second pattern.

Apparatuses and methods for forming serial advanced technology attachment (SATA) board edge connectors with electroplated hard gold contacts. One example method can include forming a tie bar on an inner layer of a printed circuit board (PCB), forming a trace on an outer layer of the PCB, forming a via, wherein the via electrically couples the tie bar to the trace, forming a contact coupled to the trace on the outer layer, and sending an electrical charge from the tie bar through the via and the trace to the contact to electroplate the contact.

A method for manufacturing a printed-wiring assembly is provided. The method includes a first step of forming a first pattern of printed wiring extending to an end face of a substrate by copper or silver on the substrate. The method includes a second step of cutting the first pattern into a first portion on the end face side from a predetermined position and a second portion on the inner side of the predetermined position, and the cut surface in the second portion is inclined by a predetermined angle with respect to a surface perpendicular to the substrate. The method further includes a third step of forming a protective layer of the second portion so as to cover the cut surface.

A component carrier for carrying electronic components includes an at least partially electrically insulating core, at least one electronic component embedded in the core, and a coupling structure with at least one electrically conductive through-connection extending at least partially therethrough and having a component contacting end and a wiring contacting end. The at least one electronic component is electrically contacted directly to the component contacting end. At least an exterior surface portion of the coupling structure has homogeneous ablation properties and is patterned so as to have surface recesses filled with an electrically conductive wiring structure, and the wiring contacting end is electrically contacted directly to the wiring structure.

A module board includes a substrate having a wire pattern on a surface, a protection layer covering the surface of the substrate so as to expose one edge region of the substrate surface, and a plurality of tab terminals connected to the wire pattern and arranged on one edge region. Each tab terminal has a width larger than a width of the wire pattern. Each tab terminal has a pattern layer. A protection layer is on the pattern layer at a region where each tab terminal is connected to the wire pattern, and a plating layer is on a remainder of the pattern layer.