An instrument panel as a vehicular panel includes a panel body on a surface side of which key tops are installed, a printed wiring section arranged on the surface side of the panel body, and an insulation outer layer arranged on the surface side of the panel body so as to cover the printed wiring section.

The invention relates to a method for producing at least one functional region (1) on an electrical contact element (30) such as, for example, a switching contact or a plug type contact. The at least one functional region (1), for example, a contact location or a connection region for crimping or soldering connections is limited to a partial area of the contact element. In order to prevent the high environmental burden which is disadvantageous in wet-chemical methods and to overcome the restriction to a very small number of materials caused in hot dip methods in physical technical terms, and to substantially improve the spatial possibility for selection and structuring which is insufficient in both techniques, there is provision according to the invention for at least one material coating (4) to be applied mechanically in a highly selective manner to the contact element in the functional region (1) and subsequently highly energetic thermal radiation (9) such as, for example, a particle beam in the form of an ion and/or electron beam, to be directed onto the at least one material coating (4). The material coating (4) can contain new materials or material combinations which cannot be provided by previous methods. The invention further relates to a device for producing such a functional region and a contact element having such a functional region (1), the contact element (30) being produced in accordance with the above method.

A wiring board includes: an insulating substrate; and a wiring layer including a first metal layer disposed on the insulating substrate and a second metal layer disposed so as to cover a surface of the first metal layer, the surface not being in contact with the insulating substrate, wherein the thickness of the second metal layer is 1/10 of the total thickness of the wiring layer, the wiring layer contains a migration inhibitor, and the mass Y of the migration inhibitor contained in the second metal layer is greater than the mass X of the migration inhibitor contained in the first metal layer.

Applying a solderable surface to conductive ink may include partially curing a conductive ink trace; applying, to the partially cured conductive ink trace, a conductive paste comprising conductive particles; and curing the partially cured conductive ink trace and the conductive paste.