Provided is a photosensitive resin composition comprising (A) a polymer including a silicone skeleton and (B) photo-acid generators, wherein the photo-acid generators (B) comprise (B1) a photo-acid generator which is an onium salt and (B2) a photo-acid generator which is not an onium salt.

A jettable composition is described, comprising a reactive monomer, oligomer or prepolymer containing at least one epoxy or oxetane functional group; a free radical polymerizable compound; a thermal cross-linking agent; and a radical initiator, along with an electronic device having the composition jetted thereon and a method of manufacturing an electronic device.

Touchscreen, comprising: a display device; a touch sensor over the display device; and, a cover lens; wherein the touch sensor comprises: a transparent substrate; a layer of catalytic photoresist patterns of a catalytic photoresist composition, the catalytic photoresist composition including a photoresist and catalytic nanoparticles; a metal conductive layer with conductive patterns over the layer of catalytic photoresist patterns; a metal passivation layer over the metal layer; and a transparent protective layer over the metal passivation layer.

A component carrier system with a component carrier, a base solder mask layer formed on a surface of the component carrier, and a top solder mask layer formed on top of a predefined section of the base solder mask. The predefined section of the base solder mask covers a target section of the component carrier.

A electronic component including a first protective layer covering the substrate and the conductive tract, a second protective layer covering at least a portion of the first protective layer, wherein the second protective layer includes Parylene, and a third protective layer covering at least a portion of the second protective layer.

The present invention addresses the problem of providing a protection member which is for a semiconductor and has excellent pattern retention at high temperatures and moisture resistance and has good adhesion to a semiconductor circuit, etc. for long period of time. The protection member which is for a semiconductor and solves said problem, includes a cured article of an organic polymerizable compound having a functional group containing an oxygen atom and/or a nitrogen atom. The absolute value of the difference between the linear expansion coefficient at 150° C. of the cured article and the linear expansion coefficient at 25° C. of the cured article is 55 or less.

A photosensitive dry film and uses of the same are provided. The photosensitive dry film comprises a support layer and a photosensitive resin layer disposed on the support layer, wherein the support layer has a first surface and a second surface opposite the first surface, and the first surface is in contact with the photosensitive resin layer and has a non-smooth structure.

Provided is a high oil contact angle coating comprising fluoropolymer, compositions and processes for forming the coating, and articles comprising the coating. The fluoropolymer is a crosslinkable tetrapolymer fluoropolymer produced from the copolymerization of monomers tetrafluoroethylene, fluoro(alkyl vinyl ether) or fluoro(alkyl ethylene), alkyl vinyl ether and alkenyl silane. The fluoropolymer coating has high oil contact angle and utility as coating when the fluoropolymer is in the uncrosslinked or crosslinked state.

A method of making a printed circuit board includes a step of providing a double-sided plate that is an insulating substrate having conductive layers on respective surfaces thereof, a first coating step of coating a first surface of the double-sided plate with a first photosensitive resin film, a second coating step of coating a second surface of the double-sided plate with a second photosensitive resin film, a first exposure step of exposing the photosensitive resin film coating the first surface after the first and second coating steps, and a second exposure step of exposing the photosensitive resin film coating the second surface after the first exposure step, wherein a maximum depth of a depression in an outermost surface of the second photosensitive resin film used in the second exposure step is less than 1.0 μm.

The purpose of the present invention is to provide a wiring board on which an opaque wiring electrode is less visible. The wiring board comprises a transparent substrate, an opaque wiring electrode patterned on at least one surface of the transparent substrate, and a transparent protective layer formed on the transparent substrate and the opaque wiring electrode. The part where the opaque wiring electrode is formed has an internal reflectivity R1 of 0.1% or less, which is measured from the transparent protective layer of the wiring board, and a refractive index n1 of the transparent substrate and a refractive index n2 of the transparent protective layer satisfy the following formula (1). 0.97≤n2/n1≤1.03 (1)