Patent classifications
H05K3/287
Bulb-type light source
A lighting device includes a substrate having a plurality of flat portions and a non-flat portion disposed between the flat portions, a plurality of light emitting sources disposed on the substrate, a fluorescent substrate layer covering one or more light emitting sources and converting a wavelength of a light from the light emitting source, and a connection line disposed on the substrate and electrically connecting the light emitting sources adjacent to each other between the adjacent light emitting sources. The substrate has a first end and a second end are arranged at different distance from a central axis.
Method for forming redistribution layer using photo-sintering
The present invention relates to a method for formation of a redistribution layer using photo-sintering and to the redistribution layer formed by the method. The method for forming a redistribution layer using photo-sintering includes printing, on a substrate, a liquid electrode pattern for a redistribution layer; coating a transparent polymer on the substrate and the pattern; photo-sintering the electrode pattern using photonic energy; and evaporating an organic substance contained in the liquid electrode pattern via the photo-sintering to remove the polymer on a top face of the electrode pattern to form a redistribution layer as the sintered electrode pattern.
Printed Circuit Board and Vehicle Having the Same
A printed circuit board includes a rigid part including a central insulating layer for insulation, inner copper foil layers including a first conductive circuit portion, outer insulating layers for insulation, and outer copper foil layers including a second conductive circuit portion, wherein ones of the inner copper foil layers, the outer insulating layers, and the outer copper foil layers are symmetrically positioned on opposite sides of the central insulating layer and are sequentially laminated, and a flexible part formed by selectively removing a portion of the rigid part up to one side of the central insulating layer.
Method for manufacturing cured film, method for manufacturing electronic component, and electronic component
Provided is a method for producing a cured product film, which is capable of increasing the formation accuracy of a fine cured product film and also increasing the adhesion of the cured product film. The method for producing a curable film according to the present invention includes an application step in which a curable composition that is photocurable and thermocurable and also is in liquid form is applied using an ink jet device, a first light irradiation step in which the curable composition is irradiated with light from a first light irradiation part, and a heating step in which a precured product film irradiated with light is heated, the ink jet device has an ink tank to store the curable composition, a discharge part, and a circulation flow path part, and in the application step, the curable composition is applied while being circulated in the ink jet device.
BULB-TYPE LIGHT SOURCE
A lighting device includes a substrate having a plurality of flat portions and a non-flat portion disposed between the flat portions, a plurality of light emitting sources disposed on the substrate, a fluorescent substrate layer covering one or more light emitting sources and converting a wavelength of a light from the light emitting source, and a connection line disposed on the substrate and electrically connecting the light emitting sources adjacent to each other between the adjacent light emitting sources. The substrate has a first end and a second end are arranged at different distance from a central axis.
COATINGS FOR WATERPROOFING ELECTRONIC COMPONENTS
A circuit board water-proofing coating composition is provided comprising: at least one passivating agent, preferably containing a molecule comprising a thio-functional group, desirably a thiol group, an azolic moiety, or an azole, and combinations thereof; at least one binder component comprising an organic or inorganic film-forming polymer, and/or one or more polymer pre-cursors polymerizable on a substrate surface; and optionally one or more additive(s); also provided are methods of making and using the coating composition and coated circuit boards.
Apparatus for transferring a conductive pattern to a substrate and corresponding pattern transferring process
Apparatus for transferring conductive patterns to a substrate (56), comprising a module (52) configured to transfer a pattern (63) of sinterable material (63a) to said substrate (56) and an optical module (12) to perform a sintering of the transferred pattern (63a). Said apparatus comprises one or more self-propelled pattern transferring units (52) comprising a module configured to move said self-propelled unit (14, 20) over said substrate (56) under the control of movement instructions (53b) associated to a motor (16, 21), said self-propelled unit (14, 20) comprising said module (52) configured to transfer a pattern (63a) of sinterable material (CI) to said substrate (56) obtaining a transferred pattern (63a) and comprising also said optical module (12) to perform a sintering of the transferred pattern (63a) on said substrate (56) obtaining a sintered pattern (63b, 63c).
PROTECTIVE FILM FOR METAL MESH TOUCH SENSOR
Touchscreen, comprising: a display device; a touch sensor over the display device; and, a cover lens; wherein the touch sensor comprises: a transparent substrate; a layer of catalytic photoresist patterns of a catalytic photoresist composition, the catalytic photoresist composition including a photoresist and catalytic nanoparticles; a metal conductive layer with conductive patterns over the layer of catalytic photoresist patterns; a metal passivation layer over the metal layer; and a transparent protective layer over the metal passivation layer.
Method for forming circuit
In a circuit forming device, a resin laminated body is formed by curing an ultraviolet curable resin ejected by an ejecting device. Then, ultraviolet curable resin is ejected into a cavity of the resin laminated body, and an electronic component is placed on the ultraviolet curable resin. Then, the electronic component is cured and the electronic component is fixed.
PRINTED CIRCUIT BOARD
A printed circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer; and a cavity formed in the first and second insulating layers; wherein the cavity includes a first portion formed in the second insulating layer; and a second portion formed in the first insulating layer; wherein the first portion has a first cross-sectional shape, and wherein the second part has a second cross-sectional shape different from the first cross-sectional shape.