Patent classifications
H05K3/326
CHIP INTERCONNECT DEVICES
An interconnect device may include a first center conductor of a first material that has a first durometer. The first center conductor may be surrounded by a first inner dielectric ring, which may be surrounded by a conductive region of a second material having a second durometer. The second durometer may be different from the first durometer. The conductive region may have a first end that defines a first plane and a second end that defines a second plane. An outer dielectric ring may surround the conductive region. The first center conductor may have a first bulb and a second bulb, the first bulb may extend in a direction away from the second plane and beyond the first plane, and the second bulb may extend in a direction away from the first plane and beyond the second plane.
METHOD OF ASSEMBLY OF A BATTERY MODULE WITH UNIFIED CONNECTION ARRAY
A method for assembling a battery module including a unified connection array with a flexible connector is described. The flexible connector can include a plurality of pads that are secured to a central spine. The flexible connector may be a single piece connector. The flexible connector can include monitors that are mounted to the flexible connector to gather data regarding battery cells of the battery module.
Solder-Free Component Carrier Connection Using an Elastic Element and Method
A component carrier is illustrated and described. The component carrier has i) a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and ii) at least one elastic element attached to the stack and configured to reversibly connect the component carrier with a further component carrier by elastically deforming the at least one elastic element and essentially not deforming the stack and the further component carrier.
Unified connection array for battery module
A flexible connector a battery system and a method for assembling in a battery assembly. The apparatus can include a plurality of pads that are secured to a central spine. The flexible connector may be a single piece connector. The flexible connector can include monitors that are mounted to the flexible connector to gather data regarding battery cells.
Bond-free interconnect between a microcircuit housing and a printed circuit assembly
A method of assembling a fully detachable microcircuit starts with obtaining a fabricated microcircuit housing with an upper surface, a lower surface, a first recess in the upper surface, a second recess in the lower surface, and a pin on the lower surface. A thermal layer is applied to the lower surface. A conductive elastomer signal pin connector and a ground pin connector are attached to a thin film circuit, and the thin film circuit with is inserted into the second recess with the conductive elastomer signal pin connector and the ground pin connector attached. A bonding target is applied to the upper surface. The bonding target and the microcircuit are connected with a bond wire. The microcircuit housing is screwed to a printed circuit assembly without bonding the microcircuit housing to the printed circuit assembly.
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
This wiring board comprises: a substrate having a first elastic modulus and including a first surface and a second surface positioned on the opposite side of the first surface; wiring positioned on the first surface side of the substrate and connected to an electrode of an electronic component mounted on the wiring board; and a reinforcing member having a second elastic modulus greater than the first elastic modulus and at least including a first reinforcing part that is positioned on the first surface side of the substrate or on the second surface side of the substrate and that at least partially overlaps the electronic component mounted on the wiring board when viewed along the normal direction of the first surface of the substrate. The wiring includes a section that does not overlap the reinforcing member when viewed along the normal direction of the first surface and that has a meandering shape section including pluralities of peaks and valleys aligned along an planar direction of the first surface of the substrate.
FLEXIBLE PRINTED CIRCUIT ELECTRICAL CONNECTOR
Disclosed herein is an electrical connector. The electrical connector comprises a flexible printed circuit comprising electrical elements on a flexible substrate. The electrical elements each comprises a solder pad and contact pad connected by a link. The electrical connector also comprises a base to at least partially surround the flexible printed circuit. The base comprises a connection interface to facilitate electrical connection with the flexible printed circuit through the base. The electrical connector further comprises a receptacle to couple to the base to partially enclose the flexible printed circuit. The receptacle exposes a portion of the flexible printed circuit to facilitate selective electrical connection with the flexible printed circuit through the receptacle.
Substrate
A substrate includes: a wiring substrate; a lower plate disposed below the wiring substrate; a canted coil spring disposed between the lower plate and the wiring substrate; an electronic component package disposed above the wiring substrate; a sheet disposed between the wiring substrate and the electronic component package and including a plurality of connection members that connects a plurality of first electrodes provided on an upper surface of the wiring substrate and a plurality of second electrodes provided on a lower surface of the electronic component package; an upper plate disposed on the electronic component package; and a coupling member that couples the lower plate and the upper plate, wherein the lower plate, the canted coil spring, the wiring substrate, the sheet, the electronic component package, and the upper plate are laminated and fixed in this order by coupling the lower plate and the upper plate by the coupling member.
BOND-FREE INTERCONNECT BETWEEN A MICROCIRCUIT HOUSING AND A PRINTED CIRCUIT ASSEMBLY
A method of assembling a fully detachable microcircuit starts with obtaining a fabricated microcircuit housing with an upper surface, a lower surface, a first recess in the upper surface, a second recess in the lower surface, and a pin on the lower surface. A thermal layer is applied to the lower surface. A conductive elastomer signal pin connector and a ground pin connector are attached to a thin film circuit, and the thin film circuit with is inserted into the second recess with the conductive elastomer signal pin connector and the ground pin connector attached. A bonding target is applied to the upper surface. The bonding target and the microcircuit are connected with a bond wire. The microcircuit housing is screwed to a printed circuit assembly without bonding the microcircuit housing to the printed circuit assembly.
Electrical Assembly
Various embodiments include an electrical assembly comprising: an electronic switching element electrically contacted on an underside and arranged on a flexible first wiring support; wherein the electronic switching element is electrically contacted on an upper side lying opposite the lower side; and a second wiring support arranged lying opposite the first wiring support on the upper side electrical contacting area of the electronic switching element. The first wiring support and the second wiring support each comprise a permanently elastic, electrically insulating, thermally conductive material.