An electronic board includes: a board including an upper surface ground on an upper surface; at least one first land formed on the upper surface and connected to a first signal line; at least one second land formed on the upper surface and connected to a second signal line; at least one third land disposed on the upper surface between the first land and the second land and connected to the upper surface ground; and at least one fourth land disposed on the upper surface on a side opposite to the third land and connected to the upper surface ground, the first land being interposed between the third land and the fourth land.

Disclosed is a printed circuit board according to an embodiment. The printed circuit board comprises: a base board; a metal layer, including a pad and a metal line formed in the base board; a solder resist layer that is formed on the base board on which the metal layer is formed and has an opening through which the surface of the metal line is exposed; and an underfill that is formed between the solder resist layer and a semiconductor chip electrically connected to the pad and includes a blocking area formed in the opening.

A base member includes a via having a first hole and a second hole. When viewed from a direction in which a base surface extends, the first hole and the second hole have shapes becoming wider as getting closer to a first surface and a second surface of the base surface from a portion at which a lower end of the first hole and an upper end of the second hole are in contact with each other. When the first hole and the second hole are viewed from the direction in which the base surface extends, a smaller angle of angles formed by a generatrix of the first hole and a generatrix of the second hole is smaller in a thin region of the base member than in a thick region of the base member.

The invention relates to a method for soldering an SMD component (1) to a circuit carrier (2) in a positionally stable manner, having the following steps: a) providing a circuit carrier (2) comprising at least one printed circuit board contact surface (2a), which is coated with a soldering paste (3) and which is designed to electrically, thermally and/or mechanically contact the SMD component (1) to be connected, wherein a number of filled vias (6), which cannot be coated with molten solder, pass through the circuit carrier (2) at least in the region of the printed circuit board contact surface (2a), b) applying at least one adhesive point (4a, 4b, 4c, 4d, 4e) onto the circuit carrier (2) such that the adhesive point (4a, 4b, 4c, 4d, 4e) delimits the printed circuit board contact surface (2a) coated with soldering paste (3) on at least one side of an edge point (R.sub.a, R.sub.b) paired with the soldering paste (3), c) placing an SMD component (1), which comprises at least one component contact surface (1a), on the printed circuit board contact surface (2a) coated with soldering paste (3) such that the at least one component contact surface (1a) electrically, thermally and/or mechanically contacts the printed circuit board contact surface (2a) via the soldering paste (3) lying therebetween, said placement being carried out and the position of said at least one adhesive point (4a, 4b, 4c, 4d, 4e) being selected in step b) such that the SMD component (1) rests on the soldering paste (3) without contacting the at least one adhesive point (4a, 4b, 4c, 4d, 4e), d) waiting for a specifiable duration t until a curing process of the at least one adhesive point (4a, 4b, 4c, 4d, 4e) is complete, and e) heating, melting and subsequently cooling the soldering paste (3) in order to produce an electric, thermal and/or a mechanical connection between the at least one component contact surface (1a) of the SMD component (1) and the at least one printed circuit board contact surface (2a) of the circuit carrier (2), wherein a barrier (5) is formed using the at least one adhesiv

A circuit board assembly includes a circuit board having at least one conductive inner layer and at least one surface. Contact areas or surfaces and electrical and/or electronic components are disposed on the surface and electrically connected to the contact areas. At least two of the contact areas are connected to one another by an electrically conductive strip having ends each being connected to a respective one of the contact areas. The at least two contact areas and the electrically conductive strip have a width of at least 8 mm and the strip has a thickness that is at least double the thickness of the at least one inner layer.

A circuit comprises a first printed circuit board (60) carrying a first set of components and a second printed circuit board (62) carrying a second set of components, with a clearance (64) between the first and second printed circuit boards. A transformer (66) has a primary side connected to the first set of components and a secondary side connected to the second set of components. One of the transformer windings, and its connection to a respective set of components, comprises a triple insulated wire. A glass, ceramic or mica spacer (70) mounted to the first and second printed circuit boards defines and sets the clearance (64) between the first and second printed circuit boards. The clearance requirement is met by providing separate printed circuit boards with spacing between them and the use of a triple insulated wire addresses or overcomes issues of creepage. Thus, high frequency and high voltage operation on the first printed circuit board is possible.

An apparatus is configured to print a circuit board using conductive and nonconductive printing materials in accordance with parameters. A database stores information correlating characteristics of printing materials with shelf life and/or age of the printing materials, and/or environmental conditions. The apparatus either prompts operator to make printing parameter adjustments or automatically optimizes printing parameters based on information stored in the database and the environmental conditions. The apparatus optionally further optimizes printing parameters based on age of a print head and positioning mechanisms.

A camera for a vehicle vision system includes a front housing portion, a circuit board, and a rear housing portion having a connector portion for connection of a vehicle coaxial cable. The circuit board includes a first solder pad for soldering a core pin connecting element, and a second solder pad that partially circumscribes the first solder pad for soldering a shielding connecting element. The second solder pad only partially circumscribes the first solder pad so as to have a gap between opposing ends of the second solder pad. The gap is configured to allow for escape of gases that evaporate out of the solder during the soldering process. The core pin connecting element electrically connects between a core pin of the connected coaxial cable and circuitry of the circuit board and the shielding connecting element electrically connects between shielding of the coaxial cable and circuitry of the circuit board.

An electronic component assembly is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations. A component stability structure is attached to at least one face. A circuit board is provided wherein the circuit board comprises circuit traces arranged for electrical engagement with the external terminations. The component stability structure mechanically engages with the circuit board and inhibits the electronic device from moving relative to the circuit board.

Protective coatings are disclosed that are configured to cover electronic components within an electronic device, while enabling electrical connections to be established with electrical contacts that are covered by the protective coatings. Such a protective coating may comprise a parylene, or a poly(p-xylylene), protective coating that has a thickness of at least 0.1 μm and at most about 2 μm. Electronic devices that include such a protective coating are also disclosed.