An electronic component mounting system is disclosed. An elapsed time acquiring section acquires an elapsed time from printing onto circuit board by solder printer. A raising and lowering operation changing section changes raising and lowering operation of component holding tool based on the elapsed time from printing acquired by the elapsed time acquiring section. A mounter mounts an electronic component on the solder printed on circuit board by performing raising and lowering of the component holding tool at the raising and lowering operation changed by the raising and lowering operation changing section.

An electronic device module includes: a substrate; at least one electronic device mounted on a first surface of the substrate; a connection portion mounted on the first surface of the substrate; and a shielding portion disposed along an external surface of the connection portion and electrically connected to a ground of the substrate through at least one connection conductor.

Disclosed is a printed circuit board having at least one power semiconductor soldered thereon and, as a thermal fuse, a spring having two contact arms fastened to solder pads of the printed circuit board by soldered connections. The spring is under mechanical stress such that at least one of the two contact arms moves away from one of the solder pads by spring force as soon as the soldered connection loses its strength and fails due to overheating. The soldered connection of at least one of the contact arms loses its strength at a lower temperature and is formed from a different alloy than the soldered connection that connects the power semiconductor to the printed circuit board. A method for populating a printed circuit board is also described.

A method of manufacturing a flexible circuit comprises providing a laminated substrate that includes a conductive layer, an adhesive layer, and a support layer. The method comprises forming conductive traces by removing selected portions of the conductive layer and the adhesive layer by dry milling the laminated substrate. The method comprises applying a protective coating to the conductive traces. The method comprises dispensing a solder material on the protective coating at a first connection point and arranging a first component at the first connection point. The method comprises heating the solder material to remove the protective coating from the first connection point and to connect the first component to one of the conductive traces at the first connection point. The method comprises attaching a second component to the conductive layer at a second connection point that is free of the protective coating by a process other than soldering.

A circuit board assembly has a circuit board and an electrical component embedded in a cured plastic layer, as well as a heat sink for cooling the component. The component is placed with a first side on a surface of the circuit board facing the heat sink and in electrical contact with the circuit board, and is located in a window in the cured plastic layer. Moreover, the component is materially bonded to a surface of the heat sink facing the circuit board at a second side lying opposite the first side, in particular through soldering or sintering. The plastic layer is injected and cured between the surface of the circuit board and the surface of the heat sink. In the production process, the material is melted by the heat at the same time as the injection, such that the component is materially bonded to the heat sink.

The present invention comprises: a base film on which a first element mounting part and a second element mounting part are defined; wiring patterns formed by extending from each of the first element mounting part and the second element mounting part on the base film, wherein the wiring patterns include a first terminal part in the first element mounting part and a second terminal part in the second element mounting part; and a first plating layer formed on the second terminal part, wherein the first plating layer includes a pure metal plating layer, and the first plating layer is not formed on the first terminal part.

A temperature-dependent switch includes a housing with a top face and an outer face that runs transversely to the top face. The switch includes a first outer contact area that is arranged on the top face. The switch includes a second outer contact area that is arranged at the housing. The switch includes a temperature-dependent switching mechanism that is arranged in the housing and configured to establish or open an electrically conductive connection between the first and the second outer contact area depending on a temperature of the switching mechanism. The housing is disposed in a metal mounting cap that includes a wall. An upper rim of the wall protrudes beyond the top face of the housing. An inner side of the wall bears at least partially against the outer face of the housing.

A power electronic assembly with a sleeve that has a virtual longitudinal axis and a circuit carrier. The sleeve has a tube-shaped plug-in section which runs around the longitudinal axis, and a first base section arranged at a first end of the plug-in section and runs around the longitudinal axis and extends away from the longitudinal axis. The first base section has at its end a flat first contact surface which runs around the longitudinal axis in a closed manner and which runs in a first plane which runs perpendicular to the longitudinal axis. The first base section has an edge surface which runs around the longitudinal axis in a closed manner and the first base section has a second contact surface which runs from the first contact surface and away from the first plane in the direction towards the edge surface.

An electronic device includes a bus bar that includes a first terminal and a second terminal and extends between the first terminal and the second terminal on a side of a first surface of a substrate; first solder configured to pass through the substrate in a thickness direction and connect a first through terminal connected to a first electronic component that is disposed on a second surface side of the substrate and the first terminal; and second solder configured to pass through the substrate in the thickness direction and connect a second through terminal connected to a second electronic component disposed on the second surface side of the substrate and the second terminal.

An electronic circuit has three circuit carriers and two semiconductor components. A first semiconductor component contacts with its upper side an underside of a first circuit carrier, and with its underside an upper side of a second circuit carrier. The first circuit carrier has vias, with a first via connecting the first semiconductor component to a first conducting path and a second via connecting a connection element forming a second conducting path providing an integral connection between the circuit carriers. A second semiconductor component contacts the underside of the first circuit carrier and is electrically connected to the first or second conducting path. An underside of the second semiconductor component contacts an upper side of the third circuit carrier. A lateral thermal expansion coefficient of the first circuit carrier is greater than a lateral thermal expansion coefficient of both the second and the third circuit carrier.