A self-heating solder flux material includes a solder flux material and a multi-compartment microcapsule. The solder flux material includes a solvent carrier, and the multi-compartment microcapsule includes a first compartment, a second compartment, and an isolating structure. The first compartment contains a first reactant, and the second compartment contains a second reactant. The isolating structure separates the first compartment from the second compartment. The isolating structure is adapted to rupture in response to a stimulus.

A method (200) for making a lighting device is provided. The lighting device comprises a carrier having a side on which lighting elements are to be mounted in a selected arrangement in relation to each other using the surface-mount equipment. The method comprises marking (201) on the side of the carrier, using a marking substance comprising an ink composition, indications of the positions on the side of the carrier where the lighting elements are to be placed in order for the lighting elements to become mounted on the side of the carrier according to the selected arrangement of the lighting elements in relation to each other, wherein at least one of the surface-mount equipment or the marking substance is arranged such that the marking substance is detectable by the surface-mount equipment. Using the surface-mount equipment and based on the indications marked on the side of the carrier, the lighting elements are placed (204) on the side of the carrier so that the lighting elements become mounted on the side of the carrier in accordance with the selected arrangement of the lighting elements in relation to each other.

A method and an apparatus for collecting flux in a way that improves the cleanliness inside a furnace by improving flux collection efficiency, reduces flux viscosity to maintain a liquid state even at ordinary temperature, and makes the flux collection unit more easily serviceable includes a rosin particle contained in an atmosphere gas, and vapor of a solvent or an atomized solvent particle are mixed in a mixing section provided upstream of a flux collection unit-side inlet, and a gas containing a mixed particle is cleaned by means of electrostatic precipitation. The solvent particle adheres to the rosin particle, and forms an aggregate of large particle size that can be more easily charged by corona discharge. This improves the flux collection rate of electrostatic precipitation collection, and, because the rosin particle dissolves in the solvent particle, the collected flux can have reduced viscosity.

The disclosure describes techniques for eliminating or reducing non-wet open (NWO) defect formation by using a low activity flux to prevent a solder paste from sticking to ball grid array (BGA) solder balls during reflow soldering. The low activity flux may be configured such that: i) it creates a barrier that prevents the solder paste from sticking to the solder balls of the BGA; and ii) it does not impede the formation of solder joints during reflow. In implementations, a solid coating of the low activity flux may be formed over balls of the BGA, and the BGA may then be bonded to a PCB during reflow. In implementations, the balls of a BGA may be dipped in a low-activity creamy or liquid flux prior to reflow. In some implementations, the flux may applied on a solder paste printed on pads of the PCB, followed by placement of a BGA.

A solder alloy comprises 38.0-42.0 wt % bismuth (Bi), 0.01-2 wt % of at least one further element chosen from the group of manganese (Mn), antimony (Sb) and copper (Cu), the balance being tin (Sn), and is at least substantially free of nickel (Ni), and further preferably substantially free of silver (Ag). The solder alloy may be combined with a halide-free solder flux to constitute a solder paste, solder bath or solder wire. The solder paste is for instance used for soldering electronic component packages such as quad flat non-leaded (QFN) packages or for soldering surface mount devices (SMD), resulting in low void formation. The solder alloy may also be applied by means of wave-soldering or selective soldering.

A substrate includes a substrate body, a flux coating portion which is coated with flux promoting solder fluidity on a surface of the substrate body, a conduction portion which is disposed on the surface of the substrate body to be separated from the flux coating portion and is conductive, and a silk portion which is disposed between the flux coating portion and the conduction portion on the surface of the substrate body and is provided by silk printing.

Provided is a non-electroconductive flux capable of enhancing productivity and impact resistance of a connected structure to be obtained and suppressing occurrence of solder flash. The non-electroconductive flux according to the present invention contains an epoxy compound, an acid anhydride curing agent, and an organophosphorus compound.

A solder composition of the invention includes: a flux composition containing a component (A) in a form of a rosin-based resin, a component (B) in a form of an activator, a component (C) in a form of a solvent and a component (D) in a form of a thixotropic agent; and a component (E) in a form of a solder powder. The component (C) in a form of the solvent contains a component (C1) in a form of a isobornyl cyclohexanol and a component (C2) in a form of a solvent whose viscosity at 20 degrees C. is 10 mPa.Math.s or less and whose boiling point ranges from 220 degrees C. to 245 degrees C.

Provided herein is a resin fluxed solder paste that exhibits a desirable solder bump reinforcement effect without requiring an underfill process. The disclosure also provides a mount structure. The resin fluxed solder paste includes a non-resinic powder containing a solder powder and an inorganic powder; and a flux containing a first epoxy resin, a curing agent, and an organic acid. The non-resinic powder accounts for 30 to 90 wt % of the total, and the surface of the inorganic powder is covered with an organic resin.

A solder paste for the mounting of electronic components and substrates contains a mixture of oxalic acid, adipic acid, and an amine component. An electronic component may be mounted on a substrate through the use of the solder paste. Also, a module may utilize the solder paste.