A novel method and interface are provided to generalize power delivery (PD) solutions and allow OEMs and suppliers to easily replace PD solutions using the same design and layout without having to re-spin the motherboard. This is achieved by defining a new interface and ball-out which support dual port PD solution that meet the system requirements. The embodiments employ an interposer to unify different PD solutions. The interposer is part of a unique Land Grid Array (LGA) soldered down solution with pre-defined interface employing a generic pinout to support PD solutions for dual type-C ports from different vendors. The interposer includes an LGA having a pattern of pads that is coupled to a LGA on a platform PCB with a matching pattern.

A method for forming a silicon carbide module integrated structure includes a heat sink and a silicon carbide module, which is fixedly connected with the heat sink. The solder paste is arranged between the heat sink and the silicon carbide module, and the heat sink and the silicon carbide module are hot pressed through a welding process to weld the silicon carbide module and the heat sink together.

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

A method and an apparatus for collecting flux are disclosed. A rosin particle contained in an atmosphere gas, and a vapor of a solvent or an atomized solvent particle are mixed in a mixing section upstream of a flux collection unit-side inlet, and a gas containing a mixed particle is cleaned by electrostatic precipitation. The solvent particle adheres to the rosin particle, and forms an aggregate of larger particle size.

An electronic component mounting substrate includes an electronic component and a substrate that are electrically connected at a plurality of places on a bottom surface of the electronic component. At least two places of the plurality of places are electrically connected by bonding using a conductive adhesive, and places other than the at least two places of the plurality of places are electrically connected by soldering using a paste solder.

A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt. % of the metal complex, based on the total weight of the sintering composition; and the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition.

A board, including a first pad area, a second pad area, a first micro heater, a second micro heater, a first heater terminal pad, a second heater terminal pad, and a third heater terminal pad, is provided. The first pad area and the second pad area respectively include at least one pad. The first micro heater and the second micro heater are respectively disposed corresponding to the first pad area and the second pad area. The first heater terminal pad and the second heater terminal pad form a loop with the first micro heater by being electrically connected to an outside, so that the first micro heater generates heat. The second heater terminal pad and the third heater terminal pad form another loop with the second micro heater by being electrically connected to the outside, so that the second micro heater generates heat. A circuit board and a fixture are also provided.

The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5. Also provided herein are methods of forming an interconnect including a) depositing a hybrid conductive ink on a conductive element positioned on a substrate, wherein the hybrid conductive ink comprises silver nanoparticles and eutectic low melting point alloy particles, the eutectic low melting point alloy particles and the silver nanoparticles being in a weight ratio from about 1:20 to about 1:5; b) placing an electronic component onto the hybrid conductive ink; c) heating the substrate, conductive element, hybrid conductive ink and electronic component to a temperature sufficient i) to anneal the silver nanoparticles in the hybrid conductive ink and ii) to melt the low melting point eutectic alloy particles, wherein the melted low melting point eutectic alloy flows to occupy spaces between the annealed silver nanoparticles, d) allowing the melted low melting point eutectic alloy of the hybrid conductive ink to harden and fuse to the electronic component and the conductive element, thereby forming an interconnect. Electrical circuits including conductive traces and, optionally, interconnects formed with the hybrid conductive ink are also provided.

An apparatus and method for providing an artificial standoff to the bottom of leads on a QFN device sufficient to provide a gap that changes the fluid dynamics of solder flow and create a unique capillary effect that drives solder up the of leads of a QFN device when it is attached to a printed wiring board (PWB).

A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.