An electronic-component carrier board includes carrier plates formed in a stack, and insulating layers each disposed between two adjacent ones of the carrier plates. Multiple conductive pins extend through the insulating layers and the carrier plates. Multiple conductive wires equal in length and width are provided. Each conductive wire is connected to one of the conductive pins, covered by one of the insulating layers, disposed between two adjacent ones of the carrier plates, and extends outwardly from the stack of the carrier plates. A wiring method for the electronic-component carrier board is also disclosed.

A printed circuit board includes a front layer including frame ground regions on which connectors to be connected with external apparatuses or communication cables are mounted and which are connected with a ground, a signal ground region which is separated from the frame ground regions at the front layer, on which electronic devices configured to receive signals from the connectors are mounted, and which is connected with a ground, and a static electricity removal ground region separated from the frame ground regions and the signal ground region at the front layer, situated outside the frame ground regions, and connected with a ground.

A connection structure embedded substrate includes: a printed circuit board including a plurality of first insulating layers and a plurality of first wiring layers, respectively disposed on or between the plurality of first insulating layers; and a connection structure disposed in the printed circuit board and including a plurality of internal insulating layers and a plurality of internal wiring layers, respectively disposed on or between the plurality of internal insulating layers. Among the plurality of internal wiring layers, an internal wiring layer disposed in one surface of the connection structure is in contact with one surface of a first insulating layer, among the plurality of first insulating layers.

A method for manufacturing a circuit board comprises steps of providing a single-sided board comprising a first insulating base, a copper layer, and at least one first conductive structure; providing a laminated board comprising a metal layer, a third insulating base, a metal shielding layer, and a second insulating base; forming a wiring layer by the metal layer comprising at least one signal wire and at least one connecting pad; defining at least one second through hole each passing through the second insulating base, the metal shielding layer, and the third insulating base; forming a second conductive structure in each second through hole; providing a double-sided board comprising a wiring layer, a fourth insulating base, a first copper foil; and at least one third conductive structure; pressing the single-sided board, at least one middle structure, and the double-sided board in that sequence to form the circuit board.

A multilayer substrate includes a laminated body including thermoplastic resin layers, a conductor pattern, a level-difference eliminating through hole, and a thickness adjustment member. The conductor pattern is on a main surface of one of the resin layers and is in the laminated body. The level-difference eliminating through hole is located at a position different from the conductor pattern in a planar view of the laminated body and penetrates the resin layer in a thickness direction. The thickness adjustment member is made of the same material as the resin layers, is located in the through hole, and has a thickness greater than a thickness of the resin layer.

A printed circuit board according to one embodiment of the present invention comprises an insulation board and a plurality of metal electrodes disposed on the insulation board, wherein: the plurality of metal electrodes include a first electrode and a second electrode; the first electrode includes a first surface parallel to an upper surface of the insulation board, a second surface facing the first surface, a first side surface disposed between the first surface and the second surface, and a second side surface facing the first side surface; a part of the first side surface and a part of the second side surface protrude toward the outside of the first electrode in the direction parallel to the upper surface of the insulation board; the first side surface protrudes farther in an area adjacent to the first surface than in an area adjacent to the second surface; and the second side surface protrudes farther in the area adjacent to the second surface than in the area adjacent to the first surface.

A multilayer board includes a first insulator layer including a first coil pattern thereon, a second insulator layer including a second coil pattern thereon, a third insulator layer including a third coil pattern thereon, a first terminal on the first insulator layer and connected to one end of the first coil pattern, a first floating pattern on the first insulator layer and not connected to the first coil pattern, and a second terminal on the third insulator layer and connected to one end of the third coil pattern. The first, second, and third insulator layers are sequentially laminated. The first, second, and third coil patterns are respectively electrically connected in sequence. The first floating pattern overlaps the second coil pattern when viewed from a laminating direction.

A printed wiring board and the like in which local deviations of characteristics of a bamse member using a liquid crystal polymer are reduced. A printed wiring board uses a liquid crystal polymer having wiring formed on at least one surface as a bamse member, in which the bamse member has a degree of crystal orientation of the liquid crystal polymer of 0.3 or less in a plane direction.

A printed circuit board includes a front layer including frame ground regions on which connectors to be connected with external apparatuses or communication cables are mounted and which are connected with a ground, a signal ground region which is separated from the frame ground regions at the front layer, on which electronic devices configured to receive signals from the connectors are mounted, and which is connected with a ground, and a static electricity removal ground region separated from the frame ground regions and the signal ground region at the front layer, situated outside the frame ground regions, and connected with a ground.

Resin films, all of which are formed of the same resin material, are laminated to form a laminate. Heat and pressure are applied to the laminate to integrate the resin films into one piece; then the pressure applied to the laminate is released and the laminate is cooled. In a predetermined region of the laminate which is to constitute a bent part, one or more of the resin films are arranged on each of one side and the other side in a lamination direction of the resin films with respect to one conductor pattern; and the total thickness of the one or more resin films arranged on the one side is larger than the total thickness of the one or more resin films arranged on the other side. Consequently, the predetermined region can be bent by utilizing the difference between contraction force generated in the one or more resin films arranged on the one side and contraction force generated in the one or more resin films arranged on the other side during the cooling after the application of heat and pressure.