A method for manufacturing a flexible circuit board includes providing a first laminated structure, the first laminated structure including two first wiring boards, a first adhesive layer sandwiched between the two first wiring boards, and a first conductive structure. The first conductive structure penetrates the two first wiring boards and the first adhesive layer and electrically connects the two first wiring boards. The first adhesive layer defines a first opening, the first opening includes a first edge away from the first conductive structure. The first laminated structure is cut along the first edge and then the two first wiring boards are unfolded. A flexible circuit board manufactured by such method is also disclosed.

An electronic device includes a first component carrier with a first stack having at least one first electrically conductive layer structure forming an antenna structure and at least one first electrically insulating layer structure; at least one electronic component, and a second component carrier having at least one second electrically conductive layer structure and/or at least one second electrically insulating layer structure. The second component carrier further includes a heat removal structure. The first component carrier and the second component carrier are connected so that the antenna structure is positioned at one side of the electronic device for emitting and/or receiving electromagnetic radiation and the heat removal structure is positioned at an opposing other side of the electronic device.

An electronic component module includes a first board comprising a component insertion portion, at least one heat-generating component mounted on a first surface of the first board and in which at least a portion of an active surface is exposed through the component insertion portion, a radiating component inserted into the component insertion portion and mounted on the active surface of the heat-generating component, a second board mounted on a second surface of the first board and configured to electrically connect the first board to an external source, and a connection conductor disposed on an inactive surface of the radiating component and configured to allow contact between the inactive surface of the radiating component and a main board.

Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.

Described herein are a component carrier, wherein the component carrier comprises: a stack comprising a plurality of electrically conductive layer structures and at least one electrically insulating layer structure, wherein at least two of said electrically conductive layer structures are connected through a plurality of (electrical) conductive nanowires.

A method for manufacturing a circuit board comprises steps of providing a single-sided board comprising a first insulating base, a copper layer, and at least one first conductive structure; providing a laminated board comprising a metal layer, a third insulating base, a metal shielding layer, and a second insulating base; forming a wiring layer by the metal layer comprising at least one signal wire and at least one connecting pad; defining at least one second through hole each passing through the second insulating base, the metal shielding layer, and the third insulating base; forming a second conductive structure in each second through hole; providing a double-sided board comprising a wiring layer, a fourth insulating base, a first copper foil; and at least one third conductive structure; pressing the single-sided board, at least one middle structure, and the double-sided board in that sequence to form the circuit board.

Provided is a manufacturing method of circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The third substrate has an opening and includes a first dielectric layer. The opening penetrates the third substrate, and the first dielectric layer fills the opening. Multiple conductive structures are formed so that the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate. The conductive via structure is electrically connected to the first substrate and the fourth substrate to define a signal path, and the ground path surrounds the signal path.

Described herein is a multilayer flex circuit having a first dual flex circuit and a second dual flex circuit where each one comprises an outer metal layer, a base insulation layer, and an inner metal layer. The base insulation layer is disposed between the outer metal layer and the inner metal layer. The inner metal layer of the first dual flex circuit is configured to face toward the inner metal layer of the second dual flex circuit. The multilayer flex circuit also includes a coupling layer that adhesively couples the inner metal layer of the first dual flex circuit to the inner metal layer of the second dual flex circuit. The multilayer flex circuit also comprises an electrically conductive material that electrically connects the inner metal layer of the second dual flex circuit to the inner metal layer of the first dual flex circuit.

A device-embedded board includes a board main body, conductor wiring layers formed inside or on a surface of the board main body, and device formation layers formed inside the board main body so as to be in contact with a portion of the conductor wiring layers. The device formation layer is configured in an insulating region in which functional filler for forming a devices is dispersed.

A method for manufacturing a flexible circuit board includes providing a first laminated structure, the first laminated structure including two first wiring boards, a first adhesive layer sandwiched between the two first wiring boards, and a first conductive structure. The first conductive structure penetrates the two first wiring boards and the first adhesive layer and electrically connects the two first wiring boards. The first adhesive layer defines a first opening, the first opening includes a first edge away from the first conductive structure. The first laminated structure is cut along the first edge and then the two first wiring boards are unfolded. A flexible circuit board manufactured by such method is also disclosed.