A printed circuit board includes a rigid part including a central insulating layer for insulation, inner copper foil layers including a first conductive circuit portion, outer insulating layers for insulation, and outer copper foil layers including a second conductive circuit portion, wherein ones of the inner copper foil layers, the outer insulating layers, and the outer copper foil layers are symmetrically positioned on opposite sides of the central insulating layer and are sequentially laminated, and a flexible part formed by selectively removing a portion of the rigid part up to one side of the central insulating layer.

A transmission circuit board includes a bendable area, a first transmission areas, and a second transmission areas. The first and second transmission areas are connected to the bendable area. The inner circuit substrate board further includes a substrate layer and an inner circuit layer formed on the substrate layer and including a first signal circuit. The transmission circuit board further includes a first dielectric layer formed on the inner circuit layer, a first outer circuit layer formed on the first dielectric layer, a first protecting layer formed on the first outer circuit layer, and a first shielding layer formed on the first protecting layer. The first dielectric layer lies the first and second transmission areas. Two ends of the first signal circuit are connected to the first outer circuit layer. The first shielding layer is connected to the first outer circuit layer and lies the bendable area.

Methods for forming electrical circuitries on three-dimensional (3D) structures and devices made using the methods. A method includes forming selectively shaped 3D structures using additive manufacturing. The method includes forming undercuts on upper-level pedestals of the 3D structures that effectively act as overhanging deposition masks for selectively preventing deposition of a selected material on a corresponding portions of lower levels. The method includes simultaneously forming and electrically isolating materials directionally deposited on the 3D structure.

A reel-to-reel lamination method to laminate a metal foil or circuitry pattern on the fly. The method includes applying a UV laminate or thermoset laminate to the metal foil or the circuitry pattern reel to reel, and then apply a UV radiation or heat to the laminate. There can be an optional enclosure connected to a suction source. The enclosure can have a flexible bladder that physically compresses the laminate.

A lighting device includes a light emitting element having element electrodes; a light guide member to receive incoming light from the light emitting element and to emit light spreading along a plane; and a substrate including a base substitute. Conductors are formed on a first surface of the base substrate. An adhesive member is formed on a second surface of the base substrate, and through-holes penetrating the substrate in a thickness direction of the substrate. The substrate is provided on the light emitting element via the adhesive member of the substrate such that a surface of the light emitting element is exposed through each of the through-holes to define a bottomed hole. Each of the element electrodes is connected to each of the conductors via a filler filling the bottomed hole. The filler has a lower surface than a surface carrying the conductors of the substrate in a cross-sectional view.

A rigid-flexible circuit board which can be simply and easily manufactured includes a wiring substrate, two adhesive layers, and two outer conductive wiring layers. The wiring substrate defines an opening penetrating and splitting the wiring substrate. The two outer conductive wiring layers are stacked on opposite surfaces of the wiring substrate. Each of the two adhesive layers is bonded between one of the two outer conductive wiring layers and the wiring substrate and infills the opening. A simplified method for manufacturing the rigid-flexible circuit board is also disclosed.

A uniform thickness flex circuit is taught that uses more than one dielectric layer. A first dielectric layer is more flexible and capable of reliably bending at a radius of curvature at which a second dielectric layer cannot be reliably bent. The second dielectric layer has at least one more desirable electrical characteristic than the first dielectric area, for example leakage. Use of the uniform thickness flex circuit to protect sensitive material in an electronic enclosure is also described.

A method of manufacturing a press pad is disclosed. The method includes: providing a planar pad having a first surface and a second surface opposite to the first surface and a release film sheet, the release film sheet including a polyimide-based film; cleaning the planar pad, the cleaning including electrostatically removing particulates from surfaces of the planar pad; and attaching a release film sheet to the first surface of the planar pad, the release film sheet being attached to the first surface using an acrylic-based adhesive containing thermoplastic polyolefin and methyl acrylate.

A method for manufacturing a flexible circuit board includes providing a first laminated structure, the first laminated structure including two first wiring boards, a first adhesive layer sandwiched between the two first wiring boards, and a first conductive structure. The first conductive structure penetrates the two first wiring boards and the first adhesive layer and electrically connects the two first wiring boards. The first adhesive layer defines a first opening, the first opening includes a first edge away from the first conductive structure. The first laminated structure is cut along the first edge and then the two first wiring boards are unfolded. A flexible circuit board manufactured by such method is also disclosed.

At least one embodiment of a power supply includes a printed circuit board formed from a plurality of double-sided laminates and a plurality of thermally conductive, electrically insulating pre-preg sheets interleaved with the plurality of double-sided laminates. Each double-sided laminate illustratively includes an electrically insulating core, a first patterned layer of electrically conductive material arranged on a first side of the electrically insulating core, and a second patterned layer of electrically conductive material arranged on a second side of the electrically insulating core opposite the first side. The printed circuit board illustratively further includes a thermally conductive, electrically insulating additive resin filling spaces between the electrically conductive material in both the first and second patterned layers of each of the plurality of double-sided laminates, such that the electrically conductive material and the additive resin together form planar surfaces that contact the plurality of pre-preg sheets.