A printed circuit board including a set of five layers encompassing a breakout area is described. The set includes a first ground layer, a first signal layer having a first conductive layer within the breakout area, a second ground layer having conductive material, a second signal layer having a second conductive layer within the breakout area, and a third ground layer. The second ground layer having a void forming a differential pair being two parallel traces, and being separated into a first portion positioned within the breakout area and a second portion outside of the breakout area. The differential pair having a first width and a first spacing within the breakout area and a second width and second spacing outside of the breakout area, with the second width greater than the first width. The first and second conductive layers forming a first ground plane and a second ground plane.

The method for producing a laminate having a patterned metal foil includes masking the whole surface of a first metal foil in a laminate having the first metal foil, a first insulating resin layer having a thickness of 1 to 200 m and a second metal foil laminated in this order, and patterning the second metal foil.

A method to remove slugs from a circuitry pattern on the fly during the fabrication of a flexible printed circuit, the method includes applying a coverlay reel-to-reel onto one side of the metal foil on the fly and applying a sacrificial liner reel-to-reel onto another side of the metal foil on the fly. Then, after the slugs and circuitry patterns are created from laser ablation, the slug can be removed by applying compressed air to the slugs and/or peeling off the sacrificial liner from the circuitry pattern reel-to-reel.

A component carrier which includes a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure, and electrically conductive wiring structures being part of the at least one electrically conductive layer structure, wherein a value of the passive intermodulation for signals propagating along the electrically conductive wiring structures is less than 153 dBc.

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, at least one first electrically conductive track extending from a vertical level defined by one of the layer structures up to a first height, at least one second electrically conductive track extending from the vertical level defined by the one of the layer structures up to a second height being larger than the first height, and at least one further electrically insulating layer structure in which the at least one first electrically conductive track and the at least one second electrically conductive track are embedded.

A laminated circuit board includes a base having a first surface, and a second surface on an opposite side from the first surface, a first metal layer provided in the base and including a first electrode exposed from the first surface, and a second metal layer provided in the base and including a second electrode exposed from the second surface. The first metal layer includes an inductor electrically connected to the first electrode, and the first electrode and the second electrode are bonded and electrically connected to each other.

A lamination circuit board structure lamination circuit board structure includes a printed circuit board substrate including conductive wiring traces on at least a first wiring face, a prepreg layer formed over the first wiring face, and a patch having an area smaller than 1,000 mm.sup.2. The patch includes conductive wiring traces formed on a wiring face and is laminated to the printed circuit board substrate over the prepreg layer, oriented with the wiring face in contact with and pressed into the prepreg layer. Portions of the prepreg layer fill interstices between the conductive wiring traces

A multilayer board level shield includes an electrically-conductive shielding layer disposed between inner and outer dielectric layers. The multilayer board level shield may have an overall thickness of about 25 microns or less. The multilayer board level shield may have sufficient flexibility to be reconfigurable generally over one or more components on a substrate to thereby provide board level shielding for the one or more components. One or more dielectric joints may be defined between the printed circuit board and the outer dielectric layer that attach the multilayer board level shield to the printed circuit board.

A flexible printed wiring board according to an embodiment is a flexible printed wiring board having a bent region provided with air layers, including a signal line passing through the bent region; and ground layers provided in a layer different from the signal line via an insulating layer, in which the ground layers are not provided in at least a part of a portion overlapping the signal line in the bent region when the flexible printed wiring board is viewed in a thickness direction.

Disclosed is a wiring board having at least one insulating layer and at least one wiring layer arranged to overlap the insulating layer. The insulating layer includes: an arrangement portion at which the wiring layer is arranged; and a side wall portion which surrounds at least a part of the wiring layer arranged at the arrangement portion in a plane direction. The side wall portion has a planar shape that restricts movement and rotation of the wiring layer in the plane direction.