A mobile terminal is provided, which includes: a housing, having a tray installation hole; a circuit board, disposed inside the housing; a tray retention portion, disposed inside the housing, where the tray retention portion faces toward the circuit board; a card holder, disposed on the circuit board; a tray, movably disposed in the tray installation hole and movably mating with the tray retention portion, at least the tray or the housing is provided with an ejection hole; and a toggle piece, rotatably disposed at the tray retention portion and located between the card holder and the ejection hole, one end of the toggle piece is an ejector pin action receiving end, the other end of the toggle piece is a tray ejection end, and the tray ejection end is used to apply an ejection force to the tray after a force is applied to the ejector pin action receiving end.

A mounting frame apparatus is provided for embedding cards within an electronics system and includes a multi-card swappable subsystem. The apparatus further includes a chassis for containing the multi-card swappable subsystem. One or more heatsinks are used for cooling cards disposed in the four-card swappable subsystem.

The present disclosure provides a card tray, a card tray plug-in device, and a terminal. The card tray may include a first supporting portion and a second supporting portion connected with the first supporting portion. The first and the second supporting portions may both be configured for placing data cards, and configured on a same side of the card tray along a thickness direction of the card tray. The card tray may include an electrical connection portion, a data card supported on the first supporting portion and/or another data card supported on the second supporting portion may electrically connect with a card holder of a terminal through the electrical connection portion.

An apparatus for preventing over-discharging according to various embodiments of the present invention may comprise: a housing including a first opening; a first electronic component disposed inside the housing; a second electronic component electrically connected to the first electronic component; and a switch for electrically connecting or disconnecting the first electronic component and the second electronic component through an external force by a pin inserted through the first opening. In addition, various embodiments may be possible.

A server system comprises a base, a front panel (13) arranged on the base and defining a collecting space; two doors (16) arranged on opposite sides of the base, and being perpendicular to the front panel; two storage cases (171) arranged between the doors in a back to back arrangement, and configured to receive multiple rows and columns of a plurality of storage drives horizontally, wherein two first corridors are each defined between one of the doors and one of the storage case facing the one door; two circuit boards (18) arranged between the two storage cases, wherein the two circuit boards comprise a plurality of slits, wherein a second corridor is defined between the two circuit boards; a storage cover (121) disposed above the base over the two first corridors, the second corridor, the two storage cases, and the two circuit boards.

Embodiments of the present invention are directed to systems, devices, lockable enclosures, and methods for data centers. In one example, a lockable enclosure for a data drive is provided. The lockable enclosure includes a housing configured to retain a first data drive and a latch contained within the housing and configured to receive a second data drive, wherein the latch is configured to move within the housing for dispensing the first data drive from the housing while the second data drive remains secured therein.

In some examples, a printed circuit board assembly can include a printed circuit board having four (4) central processor unit (CPU) sockets disposed thereon and sixty four (64) dual in-line memory modules (DIMMs) disposed thereon. The printed circuit board can have a top surface and a bottom surface with two (2) CPU sockets and thirty two (32) DIMMs disposed on the top surface and two (2) CPU sockets and thirty two (32) DIMMs disposed on the bottom surface.

A carrier assembly for installing a hard disk drive (HDD) rapidly without tools or screws or other fasteners disk includes a bracket and a carrier. The carrier is movably disposed within the bracket. The hard disk drive is disposed with the carrier. The bracket includes a side plate and a plurality of first protrusions arranged on the side plate along with electrical connectors. The side plate defines interconnecting slots, a vertical first slot and a horizontal second slot. The carrier includes a lateral plate, a rotating handle connected to the lateral plate, and second protrusions arranged on the lateral plate. When the rotating handle is manually rotated, the second protrusion becomes locked within the first slot or the second slot to fix the HDD in place.

An apparatus case includes a first casing member, a second casing member, a driving portion, a blocking portion, and a rotary shaft. The first casing member and the second casing member are detachably engaged with each other. The driving portion is disposed on the first casing member. The blocking portion and the rotary shaft are rotatably disposed on the second casing member and connected with each other. A server includes the apparatus case and a circuit board disposed on the first casing member of the apparatus case. When the second casing member moves from a first position to a second position relative to the first casing member, the driving portion drives the rotary shaft to rotate so that the rotary shaft drives the blocking portion to rotate above an expansion slot of the circuit board.

Systems (300) and methods (1200) for inserting an electronic module in a structure. The methods comprise: sliding at least one glide mechanism on a rail of the structure or a surface of the electronic module as the electronic module is being inserted into the structure; actuating a coupler to secure the electronic module to the rail and compress a thermal interface material between the electronic module and the rail; thus causing the glide mechanism to be retracted into the electronic module or rail while the coupler is being actuated. The thermal interface material first comes in contact with the rail while the coupler is being actuated. The glide mechanism is integrated with the electronic module or the rail and is resiliently biased in a direction away from the electronic module or rail so as to partially extend out from the electronic module in a direction towards the electronic module or rail.