A base includes apertures and surface features for precisely aligning central processing units (CPUs) and jackets with each other. Applicator heads are used to exert contact force against respective jackets during adhesive bonding to the CPUs. Each jacket functions as a gripping or handling feature during subsequent positioning or transport of the corresponding CPU. Such CPUs can be inserted into servers or other entities by way of automated mechanisms or manual operations with reduced risk of damage, misalignment or other problems.

An assembly that provides solderless electrical interconnection between two devices provided with electrical contact lands that are distributed in plane Land Grid Arrays (LGA's). One of the devices can be a package containing an electronic or opto-electronic device and the other device can be a PCB. The alignment of the lands of the LGA's is provided by guides that include a frame having vertical walls and centering pins inserted into metallized via-holes provided in the PCB, the dimensions of the frame allowing the sliding insertion and extraction of the package. Electrical connection between the lands of the two LGA's is provided by a contactor pad placed between the package and the PCB. The assembly includes a cover removably attached to the frame by a locking mechanism, the cover being provided with one or more elastic members which exert a downward force over the package compressing it against the contactor pad.

A land grid array (LGA) socket apparatus includes an LGA socket, with two guide rails provided respectively on the inner sides of two opposite side walls of the socket. The height of the top surface of each guide rail from the socket's bottom is greater than the height of socket terminals from the socket's bottom. The length of each guide rail is smaller than the length of the sidewall's inner side. The guide rails support at least two protrusions provided at corners at opposite sides of an integrated circuit chip assembly when the assembly is slid into the socket from a side. The guide rails, when the assembly is slid to the end of the guide rail, enable the at least two protrusions to fall into the gaps between the ends of the guide rail and the respective socket end walls to install the assembly in the socket.

An electrical connector for electrically connecting with a chip module includes an insulating body having a bottom wall, multiple rows of terminals located in the bottom wall for electrically connecting the chip module, and a carrier for carrying the chip module to the insulating body. Two first side walls extend from two opposite sides of the bottom wall upward, and two second side walls extend from the other two opposite sides of the bottom wall upward. There are a first gap between the first side wall and a most peripheral terminal corresponding to the first side wall, and a second gap between the second side wall and a most peripheral terminal corresponding to the second side wall. The first gap is greater than the second gap. The carrier has a buckling portion, received in the first gap, and for buckling a bottom surface of the chip module.

The mezzanine card system and method of use thereof provides a baseboard having opposing sides, each side configured to receive a mezzanine card thereon. A plurality of mezzanine cards are provided having integrated circuits, such as Field Programmable Gate Arrays, fixedly attached thereon. The mezzanine cards of the system reduce reprogramming time from about 15 months to about six weeks. This drastic reduction in reprogramming time provides great advantages for circuitry systems, especially when these systems are used within battlefield and electronic warfare technology. The surfaces of the baseboard are an Electroless Nickel, Electroless Palladium, and Immersion Gold (ENEPIG) plated finish.

An assembly that provides solderless electrical interconnection between two devices provided with electrical contact lands that are distributed in plane Land Grid Arrays (LGA's). One of the devices can be a package containing an electronic or opto-electronic device and the other device can be a PCB. The alignment of the lands of the LGA's is provided by guides that include a frame having vertical walls and centering pins inserted into metallized via-holes provided in the PCB, the dimensions of the frame allowing the sliding insertion and extraction of the package. Electrical connection between the lands of the two LGA's is provided by a contactor pad placed between the package and the PCB. The assembly includes a cover removably attached to the frame by a locking mechanism, the cover being provided with one or more elastic members which exert a downward force over the package compressing it against the contactor pad.

An electrical connector for electrically connecting a chip module, including an insulating body, multiple terminals fixed to the insulating body, a stiffener surrounding the periphery of the insulating body, a carrier for carrying the chip module onto the insulating body, and a load plate for pressing the chip module. The terminals are used for electrically connecting the chip module. The stiffener has a first pivoting portion and a second pivoting portion. The first pivoting portion is located in front of the second pivoting portion, and the first pivoting portion and the second pivoting portion are located on the same side of the insulating body. A rear end of the carrier is pivoted to the first pivoting portion, and a rear end of the load plate is pivoted to the second pivoting portion.

Embodiments disclosed herein include socketing apparatuses with environmental sealing options. In an embodiment, such an apparatus comprises a first substrate, and a second substrate over the first substrate. In an embodiment, a socket structure is provided between the first substrate and the second substrate, where the socket structure comprises a plurality of electrical interconnects between the first substrate and the second substrate. In an embodiment, a die is over the second substrate, and a third substrate is over the die. In an embodiment, a ring is around the socket structure, and the ring is coupled to the first substrate and the third substrate.

An electrical connector includes a contact array of signal pins and an integrated ground plane. In one embodiment, the electrical connector includes an array of contact elements and the integrated ground plane includes openings for contact elements forming signal pins and includes closed portions positioned over contact elements to be connected to the ground potential. The array of contact elements is formed with a subset of the contact elements being trapped or compressed under the integrated ground plane. The trapped contact elements are electrically connected to the ground potential without each being connected to a ground connection external to the connector. The integrated ground plane can be provided integrally within the electrical connector or as a separate element attached to the connector. In another embodiment, an electrical connector includes an array of contact elements formed in a contact element layer incorporating an integrated ground plane.

Disclosed herein is a method for producing a land grid array (LGA) socket connector assembly and the resultant assembly. The method comprises providing a carrier having a first carrier thickness with an array of vias, each having a first diameter, providing pockets around top surfaces of the vias, each having a second diameter and creating a portion of the pockets having a second carrier thickness that is less than the first carrier thickness, providing socket contact springs, each comprising a hole support structure that supports the socket contact spring within the via, and a contact beam configured to contact a conductor of an integrated circuit to be placed within the socket connector assembly, wherein a portion of carrier having a first carrier thickness is configured to prevent the contact beam from inelastically deforming when bent under load. Alternately, a contact feature may be used to prevent the inelastic deformation.