Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board having a surface, an electrical component mounted on the surface, a pin mounted on the surface, and an interposer printed circuit board mounted on the surface. The electrical component may have a first height orthogonal to the surface. The pin may have a second height orthogonal to the surface, where the second height is greater than the first height. The interposer printed circuit board may comprise a pad and an outer solder bump positioned on the pad. The outer solder bump may be positioned at a third height orthogonal to the surface, where the third height is greater than the first height.

A socket used to connect a processor assembly to a PCB is protected during handling and/or processor installation using a laterally removable pin cover. To install the processor assembly, the processor assembly is paced in a cover removal position. While the processor assembly is in the cover removal position, the laterally removable pin cover is laterally removed from the socket. The processor assembly may then be placed into the installed position without ever exposing the connector pins on the socket.

The test socket includes a fifth housing 15 located in a central part of contact terminals 21 in an axial direction and having electrical conductivity, plural through-holes 15c being formed in the fifth housing 15 to pass the respective contact terminals 21 therethrough; a sixth housing 16 stacked in the axial direction on the fifth housing 15, passage holes being formed in the sixth housing 16, the passage holes being configured to position the contact terminals 21 in a direction orthogonal to the axial direction; and an eighth housing 18 having electrical conductivity and stacked in the axial direction by sandwiching the sixth housing 16 between the eighth housing 18 and fifth housing 15, wherein the sixth housing 16 is provided with through-vias configured to form a conductive path in the axial direction.

Embodiments include a transmission line-land grid array (TL-LGA) socket assembly, a TL-LGA socket, and a package substrate. The TL-LGA socket assembly includes a TL-LGA socket having an interconnect in a housing body, the interconnect includes a vertical portion and a horizontal portion. The housing body has a top surface and a bottom surface, where the top surface is a conductive layer. The TL-LGA socket assembly also includes a package substrate having a base layer having a signal pad and a ground strip. The base layer is above the conductive layer of the housing body of the TL-LGA socket. The ground strip is above the horizontal portion of the interconnect and adjacent to the signal pad. The horizontal portion is coupled to the signal pad on the base layer. The package substrate may have a pad with a reduced pad area.

A loading assembly includes a base plate configured to support a circuit board placed thereon, a pressing plate configured to press an electrical member on the circuit board, and a first connection assembly connecting the pressing plate to the base plate and pressing the electrical member on the circuit board through the pressing plate. The first connection assembly includes a first nut fixed on the base plate, a first bolt passing through the pressing plate and screwed to the first nut, and a first spring sleeved on the first bolt and compressed between a head of the first bolt and the pressing plate. A first locking part is formed on the first bolt. The first locking part is pressed against an end face of the first nut when the first bolt is screwed to an installation position to prevent the first bolt from being rotated relative to the first nut.

In one embodiment, an apparatus includes an integrated circuit (IC) socket and an interposer. The IC socket includes a cavity to receive an IC package including first and second sets of IC contacts, the cavity defined by a base including a set of IC socket interconnects and a frame extending from the base with at least one opening through the frame. The interposer includes a cavity portion disposed adjacent the base of the IC socket, an external portion extending from the cavity portion through one of the at least one opening, at least one connector disposed on the external portion, a first set of interposer interconnects to electrically couple each of the first set of IC contacts with a corresponding one of the set of IC socket interconnects, and a second set of interposer interconnects to electrically couple each of the second set of IC contacts with one of the at least one connector. Other embodiments are described and claimed.

Embodiments include a carrier assembly, a method of forming the carrier assembly, and a semiconductor package. A carrier assembly includes a socket on a package substrate, and a carrier having a transparent material, a first opening, first alignment openings, and barbs. The carrier assembly also includes an electronic device embedded into the first opening of carrier and coupled to the carrier by barbs. The carrier assembly further includes a bolster plate on the package substrate, the bolster plate having a second opening, loading studs, and second alignment openings, and the second opening surrounds the socket. Each loading stud is positioned on a corner edge of the bolster plate. The carrier assembly may align the first alignment openings above the second alignment openings to couple the carrier onto the bolster plate. The carrier assembly may include a heat sink disposed on the electronic device, carrier, and bolster plate.

Embodiments disclosed herein include assemblies. In an embodiment, an assembly comprises a socket and a bolster plate on a board, where the bolster plate has load studs and an opening that surrounds the socket; a shim having first and second ends; and a carrier on the bolster plate, where the carrier has an opening and cutouts. The shim may have an opening through the first end as the second end is affixed to the carrier. The opening of the shim entirely over one cutout from a corner region of the carrier. In an embodiment, the assembly comprises an electronic package in the opening of the carrier, where the electronic package is affixed to the carrier, and a heatsink over the electronic package and carrier, where the first end is directly coupled to a surface of the heatsink and a surface of one load stud of the bolster plate.

An electrical connector including a substrate, a pitch transformation routing assembly formed on the substrate and including pitch transformation routing members, a first set of contact members, each contact member extends away from a first end of a corresponding pitch transformation routing member, and a second set of contact members, each contact member extends away from a second end of a corresponding pitch transformation routing member. A first subset of the pitch transformation routing members each includes a first routing section extending in a first direction and a second routing section extending in a second direction. A pitch of the first set of contact members associated with the first subset of the pitch transformation routing members is different from a pitch of the second set of contact members associated with the first subset of the pitch transformation routing members.

An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package. The carrier assemblies are separately removable from the electronic package to separate the interposer assemblies from the electronic package.