An electrical connector assembly includes a carrier having an upper surface and a lower surface and having a plurality of contact openings therethrough. The electrical connector assembly includes contacts received in corresponding contact openings forming a contact array. Each contact has a conductive polymer column extending between an upper mating interface and a lower mating interface. The contacts in the contact array have variable heights to vary relative positions of at least one of the upper mating interfaces or the lower mating interfaces of the contacts.

An electrical connector includes a connection main part surrounded by the seat frame, and a CPU carrier for carrying the CPU and a load plate for downwardly pressing the CPU respectively pivotally located at two opposite ends of the seat frame in the front-to-back direction. A set of rotation mechanism is rotatably assembled upon one end to receive the CPU carrier. A pair of supporting arms are unitarily formed with one end of the seat frame, forming a pair of locking recesses having one open side. The seat frame includes a stopper opposite to the pair of locking recesses in the lengthwise direction. The rotation mechanism is pre-assembled as one piece and successively assembled upon the seat frame along the lengthwise direction with the pivot engaged within the pair of locking recesses and a middle section of the torsion spring engaged with the stopper.

An electrical connection device and a chip module connection device are disclosed. The electrical connection device includes: an insulating body, provided with multiple accommodating holes; multiple terminals, correspondingly accommodated in the accommodating holes; and multiple solder balls. Each accommodating hole is provided with a stopping portion. Each terminal has two arm portions and a stopping block located lower than the two arm portions, and the stopping block is formed by tearing downward from the accommodating groove. An accommodating groove is formed between the two arm portions and is located higher than the stopping block. The stopping portion is located on an upward moving path of the stopping block. A gap is formed between the stopping block and the stopping portion. The solder balls are correspondingly accommodated in the accommodating grooves of the terminals.

A back plate assembly includes a base plate formed with a groove having a bottom wall and a pair of side walls opposite to each other in a first horizontal direction, and an arch plate assembled into the groove and having a pair of opposite ends in the first horizontal direction. A pair of end surfaces of the ends of the arch plate abut against the side walls and a part of a middle portion of the arch plate between the ends is not in contact with the bottom wall of the groove.

An electrical connector comprises a plurality of substrates, a first plurality of spacers, a second plurality of spacers, a plurality of pitch transformation routing assemblies, and a plurality of contact assemblies. The plurality of substrates each extends along a first direction. Each of the second plurality of spacers and a respective spacer of the first plurality of spacers connect a respective substrate of the plurality of substrates to a respective adjacent substrate of the plurality of substrates. Each of the plurality of pitch transformation routing assemblies is surrounded by a corresponding substrate of the plurality of substrates, a corresponding spacer of the first plurality of spacers, a corresponding adjacent substrate of the plurality of substrates, and a corresponding spacer of the second plurality of spacers.

Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board having a surface, an electrical component mounted on the surface, a pin mounted on the surface, and an interposer printed circuit board mounted on the surface. The electrical component may have a first height orthogonal to the surface. The pin may have a second height orthogonal to the surface, where the second height is greater than the first height. The interposer printed circuit board may comprise a pad and an outer solder bump positioned on the pad. The outer solder bump may have a third height orthogonal to the surface, where the third height is greater than the first height.

An opening/closing mechanism that allows a cover member to be biased according with the degree of opening. A solution is that an opening/closing mechanism of an opening/closing body, comprises: a cover member 15 opening and closing around a shaft center of a third shaft 33 and disposed on a base portion 23, and an opening/closing body 10 in which the cover member 15 is biased toward an opening direction by a biasing force of a spring member 21 wherein a spring support portion 35 is provided on the base portion 23, and a spring receiver 37 is provided on the cover member 15, and in accordance with more opening of the cover member 15, a distance from the spring base portion 41b of the spring member 21 to an abutting position in the spring extending portion 41a with the spring receiver 37 becomes longer and the biasing force decreases.

A loading assembly includes a base plate configured to support a circuit board placed thereon, a pressing plate configured to press an electrical member on the circuit board, and a first connection assembly connecting the pressing plate to the base plate and pressing the electrical member on the circuit board through the pressing plate. The first connection assembly includes a first nut fixed on the base plate, a first bolt passing through the pressing plate and screwed to the first nut, and a first spring sleeved on the first bolt and compressed between a head of the first bolt and the pressing plate. A first locking part is formed on the first bolt. The first locking part is pressed against an end face of the first nut when the first bolt is screwed to an installation position to prevent the first bolt from being rotated relative to the first nut.

A module. In some embodiments, the module includes a substrate; a plurality of electronic components, secured to an upper surface of the substrate; a thermally conductive heat spreader, on the electronic components and in thermal contact with an electronic component of the plurality of electronic components; a standoff, between the substrate and the heat spreader; an alignment element, extending into the substrate; a hard stop, under the substrate; and a plurality of compressible interconnects, under the substrate, and extending through the hard stop. The electronic components may be within a sight area of the substrate. The module may be configured to transmit a compressive load from an upper surface of the standoff to a lower surface of the substrate through a load path not including any of the electronic components.

An electrical connector for connection between the CPU and the PCB includes an insulative housing, an insulative plate below the housing and a plurality of contacts retained to the housing and the plate. The housing forms a receiving cavity for receiving the CPU, and the plate forms a mounting face confronting the PCB. Each contact includes an upper part and a lower part discrete and independent from each other. The upper part includes an upward resilient arm extending into the receiving cavity for mechanically and electrically connecting to the CPU, and a bottom connecting section. The lower part includes a downward resilient arm extending toward the PCB for mechanically and electrically connecting to the PCB, and a top connecting section. The bottom connecting section and the top connecting section are mechanically and electrically connected to each other.