A hold down member can be surface mounted to a substrate, such that a post of the hold down member extends at least into an interposer. Accordingly, when an on board transceiver is placed in electrical communication with the interposer, a fastener can be inserted at least into the on board transceiver so as to attach to the post, thereby securing the on board transceiver to the interposer and the substrate.

An example semiconductor assembly can include a hingeably-coupled component that receives a semiconductor board. In some examples, the component can be hingeably rotated to an open position to receive the semiconductor board. In some examples, the component can be hingeably detached from the assembly to receive the semiconductor board.

The present invention provides for a structure and a mechanism by which by utilizing additive manufacturing processes electrical connections are created that connect the top and bottom of a block in a customizable pattern. Specifically connection points can be created on the surface of the block and route them to alternate locations transforming the original pattern to a smaller, larger, or alternate pattern.

An electrical connector, configured to electrically connect to a chip module, includes: a body, used to carry upward the chip module, and provided with multiple accommodating holes; and a plurality of terminals, respectively correspondingly accommodated in the accommodating holes. Each terminal includes a base, a first arm and a second arm, the base is configured to be connected to a strip, the first arm is formed by extending upward from the base, and the second arm is formed by extending upward from the first arm and is configured to abut the chip module. One side of the first arm is formed by tearing from the strip, and two opposite sides of the second arm are both formed by blanking the strip.

A plurality of contact are received within the corresponding passageways of the insulative housing of an electrical connector, respectively. Each contact has juxtaposed first body and second body angled with each other via a connecting section linked therebetween. A resilient contacting section extends upwardly from the first body. The bottom portion of the second body forms sideward spaced first blade and second blade with a slit therebetween, wherein a soldering tail further extends from the first blade, and the second blade is sideward farther from the first body than the first blade is. The bottom edge of the first body is lower than the bottom edge of the connecting sections o as to form another slit between the first body and the second body under the connection section.

An electrical connector includes a fastener plate, a rail frame pivotally mounted to one end of the fastener plate, a carrier frame assembled to the rail frame in a sliding manner, and a load plate pivotally mounted to the end of the fastener plate outside of the rail frame. The carrier frame includes latches to retain the CPU thereon. The rail frame includes a pair of opposite sliding channels extending in the front-to-back direction, along which the carrier frame is moveable. A front transverse bar is located in front of the sliding channels. A pair of protection blocks are located in front of the pair of sliding channels for protecting the latches of the carrier frame or the CPU.

When each signal line contact terminal (10ai) is installed in a base member (30), an upper housing (28), and a lower housing (26), the upper housing (28) is installed together in such a way as to be sandwiched between the base member (30) and the lower housing (26). Here, collars (16) are fitted on outer peripheral portions of a first extending portion (52A) and a second extending portion (52C) of the signal line contact terminal (10ai), respectively. Moreover, air layers are formed between an outer peripheral portion of a drum portion (52B) of the signal line contact terminal (10ai) and an inner peripheral surface forming a hole (28b), between an outer peripheral portion of the first extending portion (52A) and an inner peripheral surface forming a hole (30b), between an outer peripheral portion of the second extending portion (52C) and an inner peripheral surface forming a hole (26b), and between an outer peripheral portion of a plunger (56) and an inner peripheral surface forming a hole (26e).

An electrical connector includes a reinforcing plate, which is encapsulated by an insulating body by injection molding. Positioning structures are provided in terminal slots of the insulating body. The insulating body is made of an elastic insulating material. Multiple terminals are mounted on the positioning structures. Each metal terminal is provided with an upper contact portion and a lower contact portion. When the upper contact portions is in contact with a chip module, and the lower contact portions is in contact with a circuit board, each of the metal terminals interferes with an inner wall of the corresponding terminal slot, so as to solve the metal fatigue of the metal terminals and to ensure the strength of the metal terminals.

Embodiments include a carrier assembly, a method of forming the carrier assembly, and a semiconductor package. A carrier assembly includes a socket on a package substrate, and a carrier having a transparent material, a first opening, first alignment openings, and barbs. The carrier assembly also includes an electronic device embedded into the first opening of carrier and coupled to the carrier by barbs. The carrier assembly further includes a bolster plate on the package substrate, the bolster plate having a second opening, loading studs, and second alignment openings, and the second opening surrounds the socket. Each loading stud is positioned on a corner edge of the bolster plate. The carrier assembly may align the first alignment openings above the second alignment openings to couple the carrier onto the bolster plate. The carrier assembly may include a heat sink disposed on the electronic device, carrier, and bolster plate.

A surface-mountable socket has a wiping function. A socket 100 of the present technology can be surface-mounted to a board 210. The socket 100 includes a plurality of contacts 110, and each contact 110 includes a contact portion 112 that can contact a terminal of a semiconductor device, a locking portion 116 connected to the contact portion 112, and a board-side contact portion 118 that extends from the locking portion 116 and can contact a conductive region formed on a board surface. The socket 100 further includes a stopper member 120 that holds the locking portion 116 of the plurality of contacts 110 and a guide member 180 that is disposed so as to oppose the stopper member 120, and the guide member 180 is formed with a plurality of through holes 184 that houses a board-side contact 118 protruding from the stopper member.