An electronic assembly includes an electronic package having an integrated circuit component and interposer assemblies with compressible interposer contacts electrically connected thereto. Cable connector modules are coupled to the interposer assemblies. A cover assembly is coupled to the upper surface of the electronic package over the cable connector modules. The cover assembly includes bridge assemblies having plates in a plate stack that are independently movable. A load plate engages upper edges of the plates of the bridge assemblies and press against the plates to drive the bridge assemblies into the cable connector modules using compression hardware. The cable connector modules compress the interposer contacts of the interposer assemblies when the load plate presses the plates of the bridge assemblies into the cable connector modules.

A microelectronic system may include a microelectronic component having electrically conductive elements exposed at a first surface thereof, a socket mounted to a first surface of the microelectronic component and including a substrate embedded therein, one or more microelectronic elements each having active semiconductor devices therein and each having element contacts exposed at a front face thereof, and a plurality of socket pins mounted to and extending above the substrate, the socket pins being ground shielded coaxial socket pins. The one or more microelectronic elements may be disposed at least partially within a recess defined within the socket. The socket may have a land grid array comprising top surfaces of the plurality of the socket pins or electrically conductive pads mounted to corresponding ones of the socket pins, and the element contacts of the one or more microelectronic elements may be pressed into contact with the land grid array.

A back plate assembly includes a base plate formed with a groove having a bottom wall and a pair of side walls opposite to each other in a first horizontal direction, and an arch plate assembled into the groove and having a pair of opposite ends in the first horizontal direction. A pair of end surfaces of the ends of the arch plate abut against the side walls and a part of a middle portion of the arch plate between the ends is not in contact with the bottom wall of the groove.

A retainer assembly includes a CPU and a retaining clip assemble together along an insertion/withdrawal direction perpendicular to a vertical direction of the CPU wherein the CPU forms a pair of sliding grooves, and the retaining clip forms a receiving space, an opening communicating the receiving space with an exterior, and a pair of retaining arms located by two sides of the receiving space and moveable along the pair of sliding grooves for allow the CPU to be received within the receiving space via said opening. The retaining arm may further optimally form a recess to receive a block of the CPU for retaining the CPU with regard to the retaining clip in the insertion/withdrawal direction. The retaining clip may or may not be mounted to the printed circuit board on which an electrical connector is mounted.

The test socket includes a fifth housing 15 located in a central part of contact terminals 21 in an axial direction and having electrical conductivity, plural through-holes 15c being formed in the fifth housing 15 to pass the respective contact terminals 21 therethrough; a sixth housing 16 stacked in the axial direction on the fifth housing 15, passage holes being formed in the sixth housing 16, the passage holes being configured to position the contact terminals 21 in a direction orthogonal to the axial direction; and an eighth housing 18 having electrical conductivity and stacked in the axial direction by sandwiching the sixth housing 16 between the eighth housing 18 and fifth housing 15, wherein the sixth housing 16 is provided with through-vias configured to form a conductive path in the axial direction.

Embodiments include a transmission line-land grid array (TL-LGA) socket assembly, a TL-LGA socket, and a package substrate. The TL-LGA socket assembly includes a TL-LGA socket having an interconnect in a housing body, the interconnect includes a vertical portion and a horizontal portion. The housing body has a top surface and a bottom surface, where the top surface is a conductive layer. The TL-LGA socket assembly also includes a package substrate having a base layer having a signal pad and a ground strip. The base layer is above the conductive layer of the housing body of the TL-LGA socket. The ground strip is above the horizontal portion of the interconnect and adjacent to the signal pad. The horizontal portion is coupled to the signal pad on the base layer. The package substrate may have a pad with a reduced pad area.

An electric contact used to electrically connecting an IC socket to a PCB, comprises an upper contact, a lower contact and an elastic member between them. The upper contact comprises a first connecting portion to be connected to the IC socket and a first contacting portion with less length than the first connecting portion. The lower contact comprises a second connecting portion and a second contacting portion connecting with the second connecting portion. The second connecting portion includes an expanding portion adjacent to the second contacting portion. The second contacting portion forms a receiving space for the first contacting portion. The first connecting portion also defines a protruding portion projecting along a thickness direction.

A plurality of contact are received within the corresponding passageways of the insulative housing of an electrical connector, respectively. Each contact has juxtaposed first body and second body angled with each other via a connecting section linked therebetween. A resilient contacting section extends upwardly from the first body. The bottom portion of the second body forms sideward spaced first blade and second blade with a slit therebetween, wherein a soldering tail further extends from the first blade, and the second blade is sideward farther from the first body than the first blade is. The bottom edge of the first body is lower than the bottom edge of the connecting sections o as to form another slit between the first body and the second body under the connection section.

A workpiece component is gripped by a gripper of a robot in a state that a specific part protrudes outward, and a dummy component, which has a corresponding part with the same shape as the shape of the specific part of the workpiece component and exhibits rigidity, is mounted on a location in the gripper and away from the gripped workpiece component and protrudes outward. The corresponding part of the dummy component is inserted into the slot or the hole through compliance control which is based on the output of a force sensor. The position and the posture of the slot or the hole is recognized. The specific part of the workpiece component is inserted into the slot or the hole through position control based on the position and the posture of the slot or the hole.

A semiconductor die is mounted at a die area of a ball grid array package that includes an array of electrically-conductive ball. A power channel conveys a power supply current to the semiconductor die. The power channel is formed by an electrically-conductive connection plane layers extending in a longitudinal direction between a distal end at a periphery of the package and a proximal end at the die area. A distribution of said electrically-conductive balls is made along the longitudinal direction. The electrically-conductive connection plane layer includes subsequent portions in the longitudinal direction between adjacent electrically-conductive balls of the distribution. Respective electrical resistance values of the subsequent portions monotonously decrease from the distal end to the proximal end. A uniform distribution of power supply current over the length of the power channel is thus facilitated.