A modular electronic housing includes: a housing series body whose receiving chamber houses an electronic component; and a maintaining device for maintaining the electronic component on the housing series body, the maintaining device having at least one holding body for the electronic component, which holding body is materially bonded to the housing series body in a bonding position.

A fastener includes a base having a joint plate extended therefrom toward a first direction, a joint plate extended from the joint plate toward a second direction and configured to secure to an electronic base board, and a fastening member protruded thereon toward a third direction. The fastener includes an elastic compressive unit connected to the joint plate and including a pushing part configured to abut with a circuit board downwardly rotated. Subject to the stress in the first direction and applied by the circuit board, the pushing part is moved back and the elastically-compressive unit is compressed to make the circuit board rotate to the bottom side of the pushing part, and an edge of the circuit board can be inserted into and abutted thereon the fastening member, and the circuit board is accommodated in a fastening space formed on the outside of the fastening member.

A standing clip for supporting an object in an upright position includes a flexible grip having an upper lever arm, a lower lever arm, and first and second support legs. The first support leg extends from the upper lever arm at a second end of the flexible grip, and the second support leg extends from the lower lever arm at the second end of the flexible grip. The first and second support legs include complimentary clamping surfaces configured for clamping the object therebetween, and are spaced apart from each other by a gap. The flexible grip is depressible from a first state in which the gap is a first size to a second state in which the gap is a second size. The first and second support legs are oriented substantially vertically in the second state to clamp and suspend the object above a desired surface.

A computer includes a chassis, a circuit board installed in the chassis, and a support member. The support member includes a support portion, a first clamping portion, and a second clamping portion. The first clamping portion and the second clamping portion are respectively located at two ends of the support portion. The first clamping portion is configured to clamp the circuit board. The second clamping portion is configured to clamp the chassis.

A deep-water submersible system is disclosed. The system can include a pressure vessel and an internal assembly. The internal assembly can include a housing and a wedge lock assembly coupleable to the housing. The wedge lock assembly can include a plurality of wedge members arranged along a longitudinal axis and including end wedge members at each end and one or more intermediate wedge members between the end wedge members. The wedge lock assembly can also include a displacement device along the longitudinal axis and connecting the end wedge members. The displacement device can be actuatable in one direction to move the end wedge members toward one another to displace adjacent wedge members relative to one another in a direction transverse to the longitudinal axis to engage and apply a clamping force to the housing and the pressure vessel. In addition, the wedge lock assembly can include a variable gap compensation mechanism operable to exert a biasing force on the plurality of wedge members to accommodate the relative transverse movement of the adjacent wedge members and maintain the clamping force on the housing and the pressure vessel within a predetermined range as a distance between the housing and the pressure vessel varies.

An electronic assembly includes a printed wiring board (PWB), and a stiffener secured to the PWB. The stiffener includes one or more tray sections. One or more electronic modules is secured respectively to the one or more tray sections of the stiffener.

An assembly includes a circuit card assembly (CCA) module including a CCA with heat generating electronic components and a connector electrically connected to the heat generating electronic components. A chassis including an electrical interface is included. The connector of the CCA module is electrically connected to the electrical interface. The chassis includes a removable cover. A heat transfer element is included between the cover of the chassis and an edge of the CCA module for heat sinking heat from the heat generating electronic components through the heat transfer element to the cover of the chassis.

An electronic module assembly includes a circuit card assembly (CCA) including heat generating electronic components. A connector is electrically connected to the heat generating electronic components. The connector is positioned at a connection end of the CCA. A heatsink is mounted to the CCA and is connected in thermal communication with the electronic components. A wedge feature is defined along a lateral edge of the heatsink relative to the connector.

Systems and methods. The methods comprise: causing bellows to transition from expanded states to collapsed states by removing a first fluid therefrom (the bellows being coupled to opposing sidewalls of a chassis configured to structurally support at least one circuit card); receiving the at least one circuit card in a cavity of the chassis; causing the bellows to transition from the collapsed states to at least partially expanded states by allowing the first fluid to enter the bellows; applying a pushing force by each said bellow to an intermediary structure disposed between the bellow and the circuit card; and creating a seal between the intermediary structure and the circuit card when the bellow is in the at least partially expanded state.

An electronic device configured to be mounted in a housing of a cluster, the device comprising a rear body housing at least one mother board configured to be powered by the cluster, a front tray housing at least one electronic board having at least one socket, the front tray comprising at least one fastening member for mounting an expansion card having an edge connector and a fastening portion, the electronic board being connected to the mother board by at least one flexible cable, the front tray being mounted slidable relatively from the rear body between a close position and an open position in which the front tray is at least partially removed from the cluster housing while keeping the rear body into the cluster housing so that an expansion card can be mounted/unmounted from the electronic board without powering off the device.