A circuit retaining system can include a contact monitoring system configured to determine if a retainer is providing at least a selected force and/or pressure to a circuit board when the retainer is retaining the circuit board. The contact monitoring system can include a force and/or pressure sensor configured to be disposed between the retainer and the circuit board and to output a force and/or pressure sensor signal indicating a contact force and/or pressure.

A release mechanism is disclosed that can facilitate safely and efficiently removing an expansion card from a computing device. The release mechanism can be installed on a motherboard around an expansion slot, and can include an opening that permits access to the expansion slot to allow an expansion card to be installed therein. When removal of the expansion card is desired, a handled of the release mechanism can be pulled, causing contact surfaces of the release mechanism to push the expansion card away from the expansion slot with even force, removing the need to tilt the expansion card.

A chassis includes a housing of an expansion card receiver adapted to house an expansion card and limit removal of the expansion card to a removal path; and a card holder of the expansion card. The card holder, while a retention member of the card holder is disposed in the removal path, receives a translation force directed away from the expansion card along the removal path; in response to receiving the translation force: translates the retention member along the removal path away from the expansion card until the retention member reaches a translation limiter to transition the retention member from a translatable state to a rotatable state, while the retention member is in the rotatable state and not in the translatable state: receives a rotation force directed out of the removal path; and in response to receiving the rotation force, rotate the retention member out of the removal path.

A release mechanism is disclosed that can facilitate safely and efficiently removing an expansion card from a computing device. The release mechanism can be installed on a motherboard around an expansion slot, and can include an opening that permits access to the expansion slot to allow an expansion card to be installed therein. When removal of the expansion card is desired, a handled of the release mechanism can be pulled, causing contact surfaces of the release mechanism to push the expansion card away from the expansion slot with even force, removing the need to tilt the expansion card.

An electronic device is provided. The electronic device includes a device housing, a circuit board, and a board module. The device housing includes a restriction unit. The circuit board includes a circuit board connector, wherein the circuit board is disposed in the device housing. The board module includes a module housing, a module board, a module connector, and a preload unit. The module connector is disposed on the module board. The preload unit and the module board are disposed on the module housing. The preload unit is connected to the restriction unit and applies a first elastic force toward the restriction unit. The module connector can thus be sufficiently connected to the circuit board connector.

An electronic module assembly includes a circuit card assembly (CCA) with heat generating electronic components. A connector is electrically connected to the heat generating electronic components, wherein the connector is positioned at a connection end of the CCA. A heatsink is mounted to the CCA, connected in thermal communication with the electronic components. An undulating channel feature is defined along a lateral edge of the heatsink relative to the connector. One or more channels of the undulating channel feature are aligned with an insertion axis defined by the connector.

An assembly includes a circuit card assembly (CCA) module including a CCA with heat generating electronic components and a connector electrically connected to the heat generating electronic components. A chassis including an electrical interface is included. The connector of the CCA module is electrically connected to the electrical interface. The chassis includes a removable cover. A heat transfer element is included between the cover of the chassis and an edge of the CCA module for heat sinking heat from the heat generating electronic components through the heat transfer element to the cover of the chassis.

A releasable clamping device is provided. The device includes a plurality of wedge members that slidably are disposed upon a carrier, with an input disposed in conjunction with a first wedge member. The input interacts with a projection and when the input is moved the first wedge members slides along the carrier. Motion of the first wedge member causes vertical motion of the second and fourth wedge members, which in combination cause the thickness of the releasable clamping device to increase, which frictionally retains the carrier and associated components thereon (such as a PCB) within a housing. The input may be moved in an opposite direction which causes the first wedge member to slide along the carrier in an opposite direction and causes the second and fourth wedge members to vertically move toward the carrier thereby narrowing the overall thickness of the device to allow removal of the carrier.

An electronic device is provided. The electronic device includes a device housing, a circuit board, and a board module. The device housing includes a restriction unit. The circuit board includes a circuit board connector, wherein the circuit board is disposed in the device housing. The board module includes a module housing, a module board, a module connector, and a preload unit. The module connector is disposed on the module board. The preload unit and the module board are disposed on the module housing. The preload unit is connected to the restriction unit and applies a first elastic force toward the restriction unit. The module connector can thus be sufficiently connected to the circuit board connector.

An electronic module assembly includes a circuit card assembly (CCA) with heat generating electronic components. A connector is electrically connected to the heat generating electronic components, wherein the connector is positioned at a connection end of the CCA. A heatsink is mounted to the CCA, connected in thermal communication with the electronic components. An undulating channel feature is defined along a lateral edge of the heatsink relative to the connector. One or more channels of the undulating channel feature are aligned with an insertion axis defined by the connector.