An electronic device may include an electronic device chassis having first fastener openings, and circuit boards, each circuit board having opposing sides. The electronic device may include a respective heat sink flange extending outwardly from each opposing side of each circuit board. Each heat sink flange may have second fastener openings. The electronic device may have a respective fastening arrangement coupling each heat sink flange to adjacent portions of the electronic device chassis. Each fastening arrangement may include a fastener receiving strip having fastener receiving passageways, and fasteners extending through respective ones of the first and second fastener openings into corresponding ones of the fastener receiving passageways in the fastener receiving strip.

A wedge clamp is provided. The wedge clamp includes wedge members aligned with a shaft and in sliding contact with surfaces of the neighboring wedge members. Some of wedge members each include a finger and a void, with the finger of a first member slidably inserted within the void of a second wedge member and vice versa. The fingers and voids extend at an acute angle, and the fingers and voids of other wedge members extend at another acute angle on an opposite side of a vertical axis. When the shaft is rotated some wedge members vertically translate with respect to the remaining wedge members. When the shaft is rotated in the reverse direction the wedge members translate vertically in the opposite direction returning to an original position. The interaction of the fingers and voids mechanically drive the moved wedge members into the original state.

An electronic module assembly includes a circuit card assembly (CCA) including heat generating electronic components. A connector is electrically connected to the heat generating electronic components. The connector is positioned at a connection end of the CCA. A heatsink is mounted to the CCA and is connected in thermal communication with the electronic components. A wedge feature is defined along a lateral edge of the heatsink relative to the connector.

A method of maintaining a circuit card in a card rack and a circuit card rack system are disclosed. A card rack including a laterally oriented clamping slot is provided. The clamping slot is at least partially formed from a temperature-contractible material. A circuit card having a clamped side region is provided. At least a portion of the clamped side region is inserted into the clamping slot. A predetermined temperature differential is applied to the clamping slot to reduce a longitudinal dimension of at least a portion of the clamping slot. A compressive force is exerted on the portion of the clamped side region which is located longitudinally within the clamping slot, via thermal expansion of the clamping slot.

A guide assembly an enclosure-based device such as a computer provided in a rack-mountable chassis. The guide assembly is configured to facilitate blind connector mating such as electrical interconnection between a receiving connector on a previously-mounted board and an edge connector on a circuit board supported in a housing of a module that is slid or inserted into the interior space of the enclosure or chassis. The guide assembly (and devices that include a guide assembly) address the two design challenges discussed above of increasing numbers of circuits in devices that need to be connected and of decreasing pitch between the connectors. The guide assembly is configured, with its mechanical features, to decouple the degrees of freedom (DOFs) between the module being inserted into the chassis and the receiving/mating connector on the previously-mounted board. The guide assembly constrains five out of the six DOFs, which effectively ensures proper connector mating.

Card locks for securing electronics card in card slots within cages and designed and configured to allow each card lock to impart high uniform pressure between an electronics card and the corresponding card slot to maximize heat transfer from the electronics card to the card cage to efficiently sink heat generated onboard the electronics card. In some embodiments, a high-pressure card lock of the present disclosure has a pair of low-angle wedges and a locking mechanism that effectively pushes one of the wedges along the other wedge to put the high-pressure card lock into its locked, high-pressure-exerting state. In other embodiments, a high-pressure card lock of the present disclosure has a pair of low-angle wedges and a locking mechanism that effectively draws one of the wedges along the other wedge to put the high-pressure card lock into its locked, high-pressure-exerting state.

A device includes a body, a front wedge, a body wedge, a ratchet, an internal thread, a first end, a second end, and a longitudinal axis. The front wedge is positioned at the first end of the body. The body wedge has a first face and a second face and is positioned adjacent the front wedge and adjacent the body. Motion of the front wedge toward the second end of the body causes motion of the body wedge away from the body perpendicular to the longitudinal axis. The ratchet is positioned within the holes of the body the front wedge. Motion of the ratchet toward the second end of the body causes motion of the front wedge toward the second end of the body. Rotation of the ratchet about the longitudinal axis in a first direction causes the ratchet to move toward the second end of the body.

An edge sealing heat-dissipating film includes a heat radiation emitting film, a metal film and a heat radiation receiving film. The heat radiation emitting film has a first opening. The metal film is disposed to the heat radiation emitting film and the metal film has a second opening. The second opening is positioned corresponding to the first opening. The heat radiation receiving film is disposed to the metal film and the heat radiation receiving film has a third opening. Wherein, the shape of the heat radiation emitting film is the same as the shape of the heat radiation receiving film. And the area of the metal film is slightly smaller than the area of the heat radiation receiving film and the heat radiation emitting film. Therefore, the outer periphery of the heat radiation emitting film and the outer periphery of the heat radiation receiving film could be closely bonded together.

An example bracket unit to control installation of an electronic module is provided herein. The bracket unit includes a bracket body, a bracket plate, and a fastener. The bracket plate includes a receiving member and an alignment indicator. The receiving member to engage with a rail unit and move between an equilibrium position and a displaced position based on a movement of the rail unit. The alignment indicator connected to the receiving member, such that movement of the alignment indicator corresponds to the movement of the receiving member. The fastener to slideably connect the bracket plate and the bracket body together.

A card edge connector assembly includes a card edge connector having a housing defining a card slot configured to receive a paddle card of a pluggable module and having a mounting lug having a datum surface. The card edge connector assembly includes support hardware coupled to the housing having a base including a locating cavity having a locating surface that receives the mounting lug such that the locating surface engages the datum surface of the mounting lug to locate the support hardware relative to the housing at a support location. The support hardware has a support beam extending from the base having a support surface for supporting the pluggable module independent of the card edge connector such that the paddle card is oriented in the card slot relative to the contacts for electrical connection therewith.