Ruggedized avionics assemblies for use on kinetically launched space vehicles are disclosed. The avionic assemblies are able to maintain structural integrity and functionality under high acceleration forces generated during kinetic launch, including acceleration forces of >5,000 times Earth's gravity in a single direction of loading. The avionics assembly is ruggedized to withstand this level of acceleration force during launch via a plurality of constraining elements to constrain a plurality of printed circuit boards aligned in parallel to an acceleration vector. Further, a high specific strength and stiffness composition of the plurality of constraining elements aids in supporting the printed circuit boards and preventing them from bending and dislodging electronic components mounted to the printed circuit boards.

A system is disclosed which utilizes a stabilization disk 30 or rigid cup containing adhesive which is bonded to an underside of a circuit board and then bolted to a chassis of a piece of military electronic equipment, so as to create a mounting location between the circuit board and the chassis where the circuit board is lacking a regular fastener receiving mounting hole therethrough.

A thermal interface is provided. The thermal interface includes a shape memory material and a thermally-conductive material. The thermal interface is configured to be formed as a compressed thermal interface and as an expanded thermal interface. The compressed thermal interface is configured to partially fill a thermal gap between a first component and a second component. The expanded thermal interface is configured to substantially fill the thermal gap between the first and second components.

An electronic device includes an accommodation and an electronic module. The accommodation has an acceptor, a first connector, a second connector and an elastic. The elastic is between the first connector and the second connector. The second connector is on the acceptor. The first connector and the second connector have a bump and a track respectively. The first connector and the second connector are linearly relatively movable with the bump and the track. The electronic module connects to the acceptor. With a pre-designed path of the track, the electronic device allows the electronic module to be easily stored in the accommodation, and be taken out of the accommodation by a simple pressing action.

A system is disclosed which utilizes a stabilization disk 30 or rigid cup containing adhesive which is bonded to an underside of a circuit board and then bolted to a chassis of a piece of military electronic equipment, so as to create a mounting location between the circuit board and the chassis where the circuit board is lacking a regular fastener receiving mounting hole therethrough.

A system is disclosed which utilizes a stabilization disk 30 or rigid cup containing adhesive which is bonded to an underside of a circuit board and then bolted to a chassis of a piece of military electronic equipment, so as to create a mounting location between the circuit board and the chassis where the circuit board is lacking a regular fastener receiving mounting hole therethrough.

A component mounting apparatus for holding a rigid component in a downhole bore or a downhole collar based application includes a first body including first and second parallel spaced apart component holders disposed in a first common plane and a first support connecting the component holders together. The first and second parallel spaced apart component holders are operable to receive and grip a rigid component between the first and second parallel spaced apart component holders. Various component mounting assemblies and configurations may be realized using the component mounting apparatus described. The component mounting apparatus and various mounting assemblies may be used to mount a printed circuit board in a cylindrical enclosure or tubular housing, for example.

Systems (100) and methods (1500) for using a pressure vessel. The methods comprise: obtaining the pressure vessel comprising a shell and an insert having an interference fit with the shell whereby the insert is locked in place within the shell via interfacial pressure; inserting at least one electronic component in a first hollow cavity formed in the insert; mechanically supporting the at least one electronic component using a structural feature of the insert; and transferring heat from the electronic component to an external environment via a heat transfer path that comprises a full surface area of the insert's outer surface abutting the shell's inner surface.

A non-contact high voltage sensor includes a sensing head and a battery holder. The sensing head includes a control circuit board, a metal sensing plate and an insulating housing, and the insulating housing encloses the control circuit board and the metal sensing plate. The control circuit board is electrically connected to the metal sensing plate to sense high voltages in a surrounding environment, and the metal sensing plate includes a central flat portion and an arc-shaped portion, and the arc-shaped portion is extending from a boundary of the central flat portion and bent towards the control circuit board.

An electronic assembly support system includes a frame having a plurality of side rails side rails to be positioned along a longitudinal axis of an electronic assembly, a plurality of cross rails connected between the side rails, positioned to surround predetermined components of the electronic assembly, and a first fastener interface for attaching the plurality of side rails and cross rails to the electronic assembly.