A connector assembly includes a connector module having a connector body with side edges and end edges. The connector body has contact channels holding contacts. The connector assembly includes a mounting frame having side walls and an end wall opposite a window between the side walls. The window is open to and provides access to a passage that receives the connector module. The mounting frame includes a connector module support structure for supporting the connector module in the passage that defines a confined space oversized relative to the connector body of the connector module to allow a limited amount of floating movement in the confined space in a lateral direction that is perpendicular to the mating direction.

A slot cover and an integrated circuit access device having the slot cover are provided. The slot is used to be removably inserted into a slot of an electronic device and includes a frame, a positioning portion, an engaging portion, and at least one conductive elastic plate. The frame includes a center sheet, a first-side sheet configured to connect to an integrated circuit access module, and a second-side sheet. The first-side sheet and the second-side sheet are respectively located at a first side and a second side of the center sheet. The positioning portion and the engaging portion are respectively located above and below the center sheet. The at least one conductive elastic plate is disposed at the second-side sheet. When the slot cover is inserted in the slot of the electronic device, the center sheet blocks an opening of the slot.

The present invention provides a device for aligning a plurality of line card connectors with a plurality of fabric card connectors using a lattice having a plurality of intersecting strips defining an array of framed slots.

A mechanism to mitigate assembly torsion on an electronics assembly is provided. The mechanism including an electronics assembly and a first connector, mounted to the electronics assembly with a lower portion of the first connector proximal to the electronics assembly and an upper portion of the first connector distal to the electronics assembly. The mechanism includes a spring, mounted so as to press the upper portion of the first connector and preload the first connector against assembly force imparted by assembly of the first connector to a second connector. A method to mitigate assembly torsion on an electronics assembly is also provided.

An information processing apparatus includes a substrate that includes a first connector and a second connector, a backplane that includes a third connector coupled to the first connector and a fourth connector coupled to the second connector, and a metal plate attached to the backplane, wherein the metal plate has an opening to which the fourth connector is attached, wherein the first connector is arranged near a central part of the substrate on an end side inserted into the backplane and the second connector is arranged on each side of the first connector, and wherein a clearance between the opening of the metal plate and the fourth connector increases as a distance from the third connector to the fourth connector increases.

A sled is provided to facilitate connection of the electrical components housed therein to a backplane located in a chassis. The sled includes a housing with a front portion and a rear portion connected by a base portion. The base portion includes a plurality of electronic unit modules. The sled also includes a connector laterally slidable with respect to the front portion of the housing. The connector is slidably configured to connect the electronic unit modules to a backplane located in the server rack.

Some embodiments are directed to a patch panel including a frame, at least one plug-in module including connectors, arranged in such a way as to slide between a pushed-in position in which the plug-in module is placed in a housing in the frame and an extracted position in which the plug-in module is outside the housing, the panel further including a device for attaching the plug-in module to the frame, the attachment device including: at least one flexible elongate body arranged in such a way as to slide with respect to the frame and/or to the plug-in module; a first end designed to attach the plug-in module to the attachment device when the plug-in module is in the extracted position; and a second end designed to attached the attachment device to the frame when the plug-in module is in the extracted position.

A guide assembly an enclosure-based device such as a computer provided in a rack-mountable chassis. The guide assembly is configured to facilitate blind connector mating such as electrical interconnection between a receiving connector on a previously-mounted board and an edge connector on a circuit board supported in a housing of a module that is slid or inserted into the interior space of the enclosure or chassis. The guide assembly (and devices that include a guide assembly) address the two design challenges discussed above of increasing numbers of circuits in devices that need to be connected and of decreasing pitch between the connectors. The guide assembly is configured, with its mechanical features, to decouple the degrees of freedom (DOFs) between the module being inserted into the chassis and the receiving/mating connector on the previously-mounted board. The guide assembly constrains five out of the six DOFs, which effectively ensures proper connector mating.

The disclosed apparatus may include (1) at least one receptacle that (A) is coupled to a line card that facilitates communication among computing devices and (B) mates with at least one member coupled to a backplane of a telecommunications system to physically support the line card upon installation in the telecommunications system and (2) at least one spring that (A) is coupled to the receptacle and (B) applies, when the member is inserted into the receptacle, a force on the member to lift the line card in an upward direction. Various other apparatuses, systems, and methods are also disclosed.

Switch sub-chassis systems and methods for rack-scale servers are disclosed. A switch sub-chassis is arranged for modular installation in an enclosure and includes structural support features that allow multiple hot-serviceable line-cards and an integrated high-density optical fiber connectivity within the sub-chassis. Various features of the switch sub-chassis and associated line-cards allow liquid-electro-optical blindmate of the line-cards so that the line-cards are serviceable, allow high-density and complex fiber shuffle assemblies support, and facilitate ease of installation and/or servicing of fiber assemblies.