In examples, provided are leadless power couplers that include (1) a thermal insulating system having an outer wall and an inner wall, (2) a first electrically conductive winding located outside the thermal insulating system, where the first electrically conductive winding is configured to create a varying magnetic field, (3) a plurality of second electrically conductive windings located inside the thermal insulating system and configured to couple to the varying magnetic field, the plurality of second electrically conductive windings being superconductors, (4) a plurality of cryogenic rectifiers, each cryogenic rectifier being coupled to a respective second electrically conductive winding in the plurality of second electrically conductive windings, and (5) a plurality of cryogenic cables coupled between respective outputs of the plurality of cryogenic rectifiers and respective loads.

A system provides a network interface to electronic components. The system comprises a rack, having a plurality of rack stages, each of which is configured to receive a corresponding electronic component. One peripheral component interconnect express (PCIe) connector corresponds to each rack stage and is connectable to the corresponding electronic component when received in the rack stage. The PCIe connectors are assembled in a PCIe connector group. Each PCIe connector of the PCIe connector group has a same number of active serial links. The system also comprises a network adaptor that provides a serial link termination for each active serial link of the PCIe connector group. The network adaptor comprises a communication interface for communicating with a network. The network adaptor is configured to multiplex signals exchanged between the network and the PCIe connectors of the PCIe connector group.

Active cables and communication methods can provide data path redundancy with power sharing. In one illustrative cable implementation, the cable includes a first connector with contacts to supply power to circuitry in the first connector; a second connector with contacts to supply power to a component of the circuitry in the first connector via a first connection that prevents reverse current flow; and a third connector with contacts to supply power to the same component via a second connection that prevents reverse current flow. An illustrative method implementation includes: using contacts of a first connector to supply power to circuitry in the first connector; and using contacts in each of multiple redundant connectors to supply power to a component of said circuitry in the first connector via a corresponding diodic or switched connection that prevents reverse current flow.

A bus bar assembly comprises a first bus bar and a second bus bar. Each bus bar comprises a bridge flange having a first side and a second side, top and bottom flanges extending from the first side of the bridge flange, and an interface flange extending from the second side of the bridge flange. The bus bar assembly further comprises a first insulation layer positioned between the top flanges of the first and second bus bars and a second insulation layer positioned between the bottom flanges of the first and second bus bars. Each of the top and bottom flanges comprises a plurality of mating devices coupled thereto. The top flanges of the first and second bus bars and the first insulation layer are fixedly joined together. The bottom flanges of the first and second bus bars and the second insulation layer are fixedly joined together.

A power distribution assembly is disclosed for use with at least one computer in a data centre. The power distribution assembly (11) comprises i) at least one controller (14) comprising at least one heat sensitive component (16) and ii) at least one cooling arrangement (17) comprising a casing (18) configured to contain a coolant (19). At least a portion of the coolant (19) is configured to come into contact with at least part of the controller (14) and/or at least one component for transferring heat away from the at least one controller (14)/component (16) towards at least one wall of the casing (18). This arrangement ensures that even in increased temperature data centres, there is provided consistent and reliable operation of heat sensitive components in smart power strips through dedicated cooling of the components (16).

Technologies for switching network traffic include a network switch. The network switch includes one or more processors and communication circuitry coupled to the one or more processors. The communication circuitry is capable of switching network traffic of multiple link layer protocols. Additionally, the network switch includes one or more memory devices storing instructions that, when executed, cause the network switch to receive, with the communication circuitry through an optical connection, network traffic to be forwarded, and determine a link layer protocol of the received network traffic. The instructions additionally cause the network switch to forward the network traffic as a function of the determined link layer protocol. Other embodiments are also described and claimed.

This disclosure provides storage chassis including base storage sub-assemblies and partitions. Base includes bottom plate, top plate, first side plate and second side plate. Front side of bottom plate is opposite to back side of bottom plate. Bottom plate is located opposite to top plate. First side plate is located opposite to second side plate. First side plate and second side plate are connected to and located between bottom plate and top plate. Storage sub-assemblies are movably disposed between first side plate and second side plate. Partitions are disposed between first side plate and second side plate. Opposite ends of each partition are respectively connected to top plate and bottom plate. Partitions separate storage sub-assemblies from one another so that storage sub-assemblies are respectively located in airflow channels that are independent to one another.

Scalable-bandwidth aggregation boxes are disclosed that allow scalable electrical connection bandwidth of multiple servers in a rack to aggregation modules and compact bifurcatable optical cables to connect the aggregation modules to switches, while minimizing switch faceplate connector area requirements by using optical connectors. Users of a system including scalable-bandwidth aggregation boxes can choose a desired bandwidth cable to connect a server to a switch via an aggregation box. An aggregation box may include a scalable-bandwidth electrical connector on a faceplate, signal lines coupled between the scalable-bandwidth electrical connector and a board connector in the housing, and a serviceable bandwidth-aggregation module removably disposed in the housing.

Blind mate connection techniques and associated connectors are disclosed. Blind mate connectors provide connections where visual inspection at time of connection may not be available. Stacking tolerance increases when connectors have a different set of datums (e.g., a different relative orientation) relative to adjacent connectors. Different datums permit twinning two printed circuit boards (“PCBs”) prior to insertion into a slot of a chassis. Each connector may be attached to a respective PCB utilizing a spring and offset feature to provide a standoff on a respective PCB. Control of standoff and rotational movement (e.g., via brackets) allows each individual connector to have a “float” for improved insertion tolerance. Connector pairs may connect through an opening in a midplane while simultaneously connecting to the midplane. Switch trays and node trays may be inserted through opposing sides of a chassis and be connected through the midplane of that chassis.

Methods, systems, and devices for distributing power in a computing environment such as a rack in data center are disclosed. The disclosed methods and systems may provide for a high degree of power distribution reliability in a liquid cooling rack. To provide for power distribution reliability, the power distribution components such as busbars and power clips may be segregated from other components such as cooling fluid distribution components. By segregating these components from one other, the magnitude of damage or impact such as short circuits due to leaked cooling fluid may be eliminated and prevented to a large extend.