An air deflection plug-in unit includes a housing and a flow guiding structure. The housing is provided with a first air intake vent and a first air exhaust vent, and there is an included angle between planes on which the first air intake vent and the first air exhaust vent are located. The flow guiding structure is located in the housing. The flow guiding structure is configured to guide an airflow flowing into the first air intake vent to the first air exhaust vent. This disclosure can improve a heat dissipation capability of an electronic component.

An electronic device includes an enclosure, an air mover assembly, and a printed circuit board. The enclosure houses electrical components. The air mover assembly includes at least a portion of a motor, and the printed circuit board is spaced from the enclosure and includes stator coils of the motor within the printed circuit board.

A heat dissipation structure for the reactor includes a housing, a reactor body, and one or more heat dissipation pipes. Each of the one or more heat dissipation pipes is disposed in a cavity of the housing and is connected to the housing in a leak-tight manner, a closed cavity is formed between the one or more heat dissipation pipes and the housing, and the reactor body is disposed in the closed cavity. The above heat dissipation structure for the reactor allows to improve the heat dissipation effect of the reactor under the premise that protection requirements are met. The current carrying density of the coil of the reactor body can be increased and the diameter of copper wires can be reduced under the same conditions, thereby reducing the usage of copper and effectively reducing the cost and weight.

A riser of an information handling system having an adjustable baffle that blocks air flowing through the riser from by-passing components of an expansion card, such as a PCIe card, installed in the riser. The baffle directs the flowing air across components of the expansion card to lower the operating temperature of the expansion card by convection. In some embodiments, part of the baffle is coupled to an angled slot of the riser body and another part of the baffle is coupled to a card holder so that movement of the card holder automatically adjusts the position of the baffle to direct otherwise by-passing air toward the components of the installed expansion card.

A charger includes a housing, a fan, and a circuit board assembly. The housing is formed with an air inlet and an air outlet. The fan is disposed in the housing and used for generating a heat dissipation. A heat dissipation channel for the heat dissipation airflow to flow through is further formed in the housing and includes a first channel and a second channel. A first port of the first channel facing the air inlet has a larger cross-sectional area than the second channel so that the heat dissipation airflow flowing through the first channel is capable of accelerating through the second channel.

A heat dissipation device is provided and includes a frame body having an airflow channel therein; a first partition plate and a second partition plate for separating the airflow channel into a first channel, a second channel, a third channel and a fourth channel; a first flow guiding structure for isolating the fourth channel from the second channel; and a second flow guiding structure for isolating the first channel from the third channel. The first partition plate, the first flow guiding structure, the second flow guiding structure and the second partition plate collectively form a first flow channel communicating the first channel and the fourth channel and a second flow channel communicating the second channel and the third channel, where the first flow channel and the second flow channel are separate from one another.

The present invention provides a heat management arrangement for an electronic device, in particular for a handheld electronic device. The heat management arrangement comprises an active cooling means comprising a heat sink and at least one airflow channel configured for convective heat transport to an environment by an airflow. Furthermore, the heat management arrangement comprises a passive cooling means configured to be arranged between the heatsink and a surface of the electronic device and comprising a highly heat conductive substance. The passive cooling means is configured to contact the surface of the electronic device and to enhance heat conduction between the surface of the electronic device and the heat sink. In addition or alternatively, the passive cooling means is configured to enhance heat conduction between the surface of the electronic device and the airflow channel. Furthermore, the invention provides a corresponding method of manufacturing such a heat management arrangement on an electronic device and a corresponding electronic device.

An audio recording apparatus provided with a heat radiation fan comprises at least one processor and/or circuit configured to function as following units: an acquiring unit configured to acquire a type of microphone used to record audio; a control unit configured to control a rotation frequency for driving the heat radiation fan; and a recording unit configured to record audio acquired by the used microphone, wherein the control unit changes the rotation frequency of the heat radiation fan according to the type of the used microphone acquired by the acquiring unit.

A technology downsizing a control panel unit is provided. The control panel unit for a machine tool comprises a casing, a duct, and a fan. The casing has an openable door. A control device is arranged in an internal space, which is closed when the door is closed. The duct has a groove and a ventilation opening. The groove is closed at a closed end and open to the internal space at an open end. The ventilation opening connects the groove with the internal space in a position nearer the closed end than the open end. The duct is fixed to an inner wall of the casing in such manner as the groove faces the inner wall. The fan is mounted on the ventilation opening. The air in the internal space is taken into the groove enclosed by the inner wall and the duct by the operation of the fan.

A frequency changer cabinet includes a transformer cabinet to accommodate a transformer, a first air outlet being disposed at a top of the transformer cabinet, and a first air inlet being disposed at a side wall; and a power unit cabinet to accommodate at least one power unit, a second air inlet being disposed at a front side wall, and a rear side of the being connected to the transformer cabinet. In an embodiment, a first air passage baffle and a second air passage baffle are respectively disposed at an upper end and a lower end of a secondary coil, such that air entering from the power unit cabinet to the transformer cabinet can be directly sent to the secondary coil. Further, air entering from the first air inlet can pass through a primary coil and the secondary coil, and then flow out of the transformer cabinet.