Patent classifications
H05K7/20145
Tool-less apparatus and methods for sealing the flow of cooling fan air to a heat exchanger
Tool-less apparatus and methods are provided for sealing flow of cooling air from the outlet of a cooling fan blower to the inlet of a heat exchanger within a chassis enclosure of an information handling system. The disclosed apparatus and methods may be implemented in a tool-less manner by employing tool-less chassis mounting features that mate with tool-less cooling fan mounting features to mechanically align and secure an air outlet of a cooling fan blower in sealing relationship with an air inlet of a heat exchanger within a chassis enclosure of an information handling system by properly aligning the axes of a cooling fan in relation to the inlet of the heat exchanger so that in on embodiment no gap exists between the cooling air outlet of the cooling fan and the cooing air inlet of the heat exchanger.
Cooling system with hyperbaric fan and evacuative fan
A system and method for cooling components and a chassis in a portable information handling system includes a pressure barrier that divides the chassis into a plurality of zones, an evacuative fan in a first zone to generate airflow across components to cool the components and a hyperbaric fan in a second zone to increase air pressure in the second zone. The pressure barrier may provide thermal isolation, acoustic dampening and electromagnetic insulation. A controller communicatively coupled to the fans can operate each fan independently to cool components for improved performance and maintain a surface temperature of the chassis below a temperature for user comfort.
BOARD STRUCTURE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING BOARD STRUCTURE
A board structure includes: a board provided with a heat generating element; a heat sink including a plate-shaped base member having one face being in contact with the heat generating element, and plural fins arranged side by side in a fin arrangement direction on an other face of the base member, the fins each extending in a flow direction in which cooling air flows, the fins each having a distal end at a downstream end in the flow direction; a first resisting member provided on a downstream side in the flow direction with respect to the heat sink, the first resisting member acting as a resistor for the cooling air to be exhausted; and a second resisting member provided on the downstream side in the flow direction and on a first side in the fin arrangement direction with respect to the heat sink, the second resisting member acting as a resistor for the cooling air to be exhausted. The distal ends of the fins provided on a second side in the fin arrangement direction reside on an upstream side in the flow direction with respect to the distal ends of the fins provided on the first side.
PROJECTION DEVICE
Provided is a projection device, including a casing, a light source module, an optical engine module, a projection lens, and a fan. The casing includes a right cover plate and a baffle opposite to each other, and a lower cover plate adjacent to the right cover plate. The baffle divides the casing into first and second areas. The right and lower cover plates respectively have first and second air outlets adjacent to each other and located in the second area. The light source module, the optical engine module, located on a light transmission path of the light source module, the projection lens, connected to the optical engine module, and the fan, adjacent to the baffle, are disposed in the first area of the casing. The projection device is placed in a first or second state, and hot airflow therein flows out from the first or second air outlet.
HEAT DISSIPATION MODULE AND DYNAMIC RANDOM ACCESS MEMORY DEVICE
A heat dissipation module and a dynamic random access memory device are provided. The heat dissipation module includes a main body, a fan, and an electrical connection component. The main body is fixedly disposed on a substrate of a memory component that includes a dynamic random access memory. The main body includes a receiving through-hole, a plurality of guide through-holes, and a plurality of exhaust through-holes. The fan is fixedly disposed on the main body and configured to allow air outside the substrate to enter the substrate through the receiving through-hole and the guide through-holes, and the air entering the substrate through the receiving through-hole and the guide through-holes is discharged outwardly through the exhaust through-holes. The electrical connection component is configured for an external power supply module to supply power to the fan.
AIR-COOLED CARRIER FOR STORAGE MODULES WITH COMPENSATED AIRFLOW TO MAINTAIN COOLING OF MOUNTED COMPONENTS
An air-cooled carrier of heat-generating electronic components includes a frame, a plate, and baffles. The plate coupled to the frame divides airflow in the frame into two channels. Opposite sides of each channel along a first direction carry inlet and outlet. A pair of baffles is coupled to each channel, each baffle comprises a mounting part, an arc-shaped elastic part, and a blocking part. The mounting part is fixed to the frame and the arc-shaped elastic part. The blocking part is fixed to the arc-shaped elastic part and extends to middle of the airflow cavity in a second direction perpendicular to the first direction. In the absence of a mounted storage component, the elastic part bringing the blocking part to a first position and so blocking air flow from that outlet to that inlet.
Device holder and solar powered charger unit for smart device cooler
A solar powered cooler for a smart device such as a smartphone or smart tablet is provided, optionally with a device holder and a solar powered charger unit. The cooler may include an upper fan casing, an optional bottom fan casing, smart device holder, and an air passage formed between the upper fan casing and the smart device holder. The heat dissipation structure of the smart device holder for holding a smart device is disposed in the close proximity space of the smart device to provide a good heat dissipation effect by way of active cooling (forced convection) and passive cooling (natural convection) so as to enhance the heat dissipation performance of the smart device.
METHOD AND SYSTEM FOR COOLING ELECTRONICS IN AN UNMANNED AERIAL VEHICLE
The present disclosure provides an unmanned aerial vehicle (UAV) having a housing containing electronic components required of the UAV and a heat transfer device for cooling heat generated by said electronic components; at least one boom for connecting said housing to at least one propeller. The boom includes one or more inlet located on a first surface of the boom and within an airflow of said at least one propeller; at least one outlet on a second surface of the boom; a hallow channel extending in interior of the boom from said at least one inlet to said at least one outlet, wherein said airflow generated by said at least one propeller passes into said at least one inlet through the hollow channel to said at least one outlet providing cooling for said heat transfer device.
Information handling system having regional cooling
Custom cooling strategies may be implemented for different regions in computers, servers, and other information handling systems. Chassis architecture may have multiple cooling fans, with each fan cooling a different region via dedicated duct work. A user or administrator may thus implement different cooling strategies for internal components, based on different thermal curves defined for each different region.
Variable frequency drive and method of its air cooling
A forced double-circuit air cooling system designed for using in a sealed cabinet structure. A first air circuit is formed by an air loop moved around each of local modules (3; 4) of a sealed compartment [2] with using a circulation fan (26) which is installed within a sealed air channel [28]. The first air circuit is formed within an internal air channel (18) of the sealed compartment [2]. Wherein the internal air channel is connected to a number of air heat exchangers [22]. A first pair [22.1] of said number of air heat exchangers is equipped with the circulation fan [26]. Wherein a second air circuit [25] contains straight air channels [23] arranged within the ventilated compartment [24] adjacent to the sealed compartment [2]. Each of said straight air channels [23] comprising a second pair [22.2] of air heat exchangers with a blast fan [27] between them.