Example implementations relate to a host electronic device configured for establishing a thermal contact between a heat generating component of a removable electronic device, and a cooling component of the host electronic device, when the removable electronic device is detachably connected to the host electronic device. The host electronic device includes a support structure, the cooling component, a driver, and an actuator. The cooling component is movably connected to the support structure. The driver is also movably connected to the support structure. The actuator is movably connected to the support structure and the driver. The actuator, upon contact by the removable device, causes a movement of the cooling component via the driver for establishing the thermal contact between the cooling component and the heat generating component.

An imaging device includes: a heat source; a heat dissipation mechanism for dissipating heat of the heat source; and a main body to which the heat source and the heat dissipation mechanism are attached, wherein the heat dissipation mechanism is disposed on an outer peripheral portion of the main body.

The disclosure relates to the technical field of an electronic device, and provides a case and an electronic device. The case includes: a case body, which has a plurality of case sides, a cavity enclosed by the case sides and configured to accommodate the electronic device; a plurality of vents, which are disposed on at least part of the case sides and configured to ventilate between the case cavity and an external space; and a water retaining mechanism, which is on the inner wall of the case body and positioned at the vents.

A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

An electronic control device includes: an electronic component; a base thermally coupled to the electronic component; a first fan and a second fan provided on one surface of the base; a plurality of first heat-dissipating fins provided on the one surface of the base and provided in a first region including a region between the first fan and the second fan; and a plurality of second heat-dissipating fins provided on the one surface of the base and provided in a second region farther from the first and second fans than the first region. The plurality of first heat-dissipating fins have a structure for guiding a refrigerant sent by one of the first fan and the second fan toward a remaining one of the first fan and the second fan in the first region. The plurality of second heat-dissipating fins formed in the second region have a structure for guiding a refrigerant flowing in from the first fan or the second fan to a side away from each of the first fan and the second fan.

An optical communication system includes a co-packaged optical module and a heatsink mounted to the co-packaged optical module. The co-packaged optical module includes a processor disposed on a substrate and a plurality of light engines disposed at different locations around the processor on the substrate. The processor and the light engines generating different amounts of heat during operation. The heatsink includes a plurality of heat pipes non-uniformly distributed throughout the heatsink to remove the different amounts of heat generated at a location of the processor and respective locations of the different ones of the light engines.

A cooling system for a computing device includes an outer chassis of the computing device, a heat spreader, a heat bridge, and a heat dissipating structure. The outer chassis of the computing device is configured to support heat generating modules. The heat spreader is integrated into the outer chassis. The heat bridge couples the heat spreader to a corresponding heat generating module at a first location in the computing device. The heat dissipating structure is coupled to the heat spreader at a second location in the computing device. The second location is positioned in the computing device to experience higher airflow than the first location.

A cooling system and a cooling device are provided. The cooling device includes a container, a heat dissipation module, and a cooling module. The cooling module includes a cover plate and a heat dissipation fin assembly. The cover plate covers an opening of the container. The cover plate includes a cooling channel. The cooling channel is arranged in the cover plate and includes an inlet and an outlet. The inlet and the outlet are respectively located at two sides of the cover plate. One side of the heat dissipation fin assembly is in contact with a surface of the cover plate, and an other side of the heat dissipation fin assembly is located in the container. Through the above structure, a usage amount of heat transfer fluid injected into the container of the cooling device is lower than that of a conventional immersion cooling device.

A heat dissipation assembly and an electronic assembly, wherein the heat dissipation assembly includes condensers and fan, the condensers each include first chamber body, second chamber body, and pipes. Two opposite ends of each pipe are respectively in fluid communication with the first and second chamber bodies, every two of the pipes located adjacent to each other define a heat dissipation gap therebetween. The first and second chamber bodies and the pipes together define a heat dissipation channel which is in air communication with the heat dissipation gaps. The fan is disposed on the condensers and in air communication with the heat dissipation channel and configured to guide an airflow flowing through the heat dissipation channel and the heat dissipation gaps so as to cool the working fluid flowing through the pipes.

Some embodiments include a high voltage pulsing power supply. A high voltage pulsing power supply may include: a high voltage pulser having an output that provides pulses with an amplitude greater than about 1 kV, a pulse width greater than about 1 μs, and a pulse repetition frequency greater than about 20 kHz; a plasma chamber; and an electrode disposed within the plasma chamber that is electrically coupled with the output of the high voltage pulser to produce a pulsing an electric field within the chamber.