Embodiments of this application relate to a heat dissipator including a cover plate, an orifice plate, and a base plate that are stacked in sequence. A distribution cavity is disposed between the orifice plate and the cover plate, a heat exchange cavity is disposed between the orifice plate and the base plate, and the distribution cavity communicates with the heat exchange cavity by using through holes disposed on the orifice plate. A plurality of pin fins facing the orifice plate are disposed on a surface of the base plate in the heat exchange cavity, gaps between the plurality of pin fins constitute a fluid passage, and the pin fins include a combination pin fin in contact with the orifice plate, and a flow guiding pin fin that corresponds to the through hole and that has a gap with the through hole.

A wearable electronic device is disclosed. The device can include a support structure and an electronic component disposed in or on the support structure. A heat exchanger element can be thermally coupled with the electronic component, the heat exchanger element comprising a fluid inlet port and a fluid outlet port. A first conduit can be fluidly connected to the fluid inlet port of the heat exchanger, the first conduit configured to convey, to the heat exchanger, liquid at a first temperature. A second conduit can be fluidly connected to the fluid outlet port of the heat exchanger, the second conduit configured to convey, away from the heat exchanger, liquid at a second temperature different from the first temperature.

A wavelength conversion device includes a rotating device, a substrate rotated by the rotating device, a wavelength conversion element, and a first cooling device including, on an inside, a space in which working fluid is encapsulated, the first cooling device cooling the wavelength conversion element. The first cooling device is disposed in a position corresponding to the wavelength conversion element. The space extends from an outer edge side of the substrate to a rotation axis side. The first cooling device includes an evaporator and a condenser which are provided in the space. The evaporator includes a liquid retaining part configured to retain the working fluid in a liquid phase. The liquid retaining part is provided at the outer edge side in the space and disposed in the position corresponding to the wavelength conversion element.

An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).

An electronic apparatus includes: a chassis; a substrate housed in the chassis and with a processing device mounted thereon; a speaker device housed in the chassis and having a speaker unit and a speaker box; and a cooling device housed in the chassis and used to cool the processing device. The substrate is placed vertically along the vertical direction of the chassis. The cooling device includes: a fan having air intake ports provided on upper and lower surfaces, exhaust ports provided on side surfaces, and an impeller, and being placed horizontally in the chassis with a rotating shaft of the impeller placed along the vertical direction of the chassis; a fin placed facing the exhaust port of the fan and placed horizontally in the chassis; and a heat pipe with a first end connected to the processing device and a second end connected to the fin.

A solar powered cooler for a smart device such as a smartphone or smart tablet is provided, optionally with a device holder and a solar powered charger unit. The cooler may include an upper fan casing, an optional bottom fan casing, smart device holder, and an air passage formed between the upper fan casing and the smart device holder. The heat dissipation structure of the smart device holder for holding a smart device is disposed in the close proximity space of the smart device to provide a good heat dissipation effect by way of active cooling (forced convection) and passive cooling (natural convection) so as to enhance the heat dissipation performance of the smart device.

A cooling system for power semiconductor switches is provided. The cooling system includes a heat sink that is pressed against the power semiconductor switch. A plenum is also provided with an opening through a wall thereof which is aligned with the heat sink. A fan draws air through or around the heat sink and through the plenum wall opening and the plenum in order to cool the power semiconductor switch.

A vapor chamber structure includes a main body, a fan and perforations. The main body has a heat absorption section, a heat dissipation section and a chamber. The heat absorption section and the heat dissipation section are respectively horizontally disposed on left and right sides of the main body. The heat absorption section is attached to at least one heat source. The chamber is positioned at the heat absorption section and partially extends to the heat dissipation section. The chamber has a capillary structure and at least one perforated section. The perforated section is connected between an upper side and a lower side of the chamber. The fan is disposed on one side of the heat dissipation section. The perforations are formed through the parts of the main body, which parts are free from the chamber and the parts of the main body, where the perforated section is disposed.

Access points can be mounted in a variety of locations or orientations and can support multiple communications protocols. In some embodiments, an access point includes a main housing and a front housing. The main and front housing are connected by a hinge. A Wi-Fi antenna is included in the front housing in some embodiments. The access point is configured for use in either an open or closed position. When mounted in a vertical position, the front housing can be lowered into a horizontal position, which facilitates a preferred orientation of an antenna with respect to the ground. A first set of cooling fins serves to maintain components of the access point offset from a wall to which the access point is mounted. This facilitates airflow. Additional fins act as a spacer between the main housing and the front housing when the access point is used in a closed position. This facilitates air flow around both sides of the main housing.

An electronic apparatus includes: a chassis; a first and a second heat generating elements which are placed with a step between surfaces thereof; and a cooling module that absorbs heat generated by the first and the second heat generating elements. The cooling module has: a first heat pipe having a first surface thereof connected to a surface of the first heat generating element; a plate-shaped vapor chamber having a first surface thereof connected to a surface of the second heat generating element and a second surface of the first heat pipe; a second heat pipe which is connected to a second surface of the vapor chamber and overlaps the second heat generating element; a first fin connected to the first heat pipe; and a second fin connected to the second heat pipe.