A fan system and a computing system with the fan system are disclosed. The fan system includes a fan module. The fan module includes a housing configured to retain a fan and a motor to rotate the fan. The housing includes an air inlet aperture on an air inlet side of the housing and an air outlet aperture on an air outlet side of the housing. The fan system further includes an outlet fan guard coupled to the fan module on the air outlet side of the housing. The outlet fan guard includes at least one flap rotatable between a closed position, covering the air outlet aperture of the housing, and an open position, uncovering the air outlet aperture of the housing. The outlet fan guard further includes at least one spring urging the at least one flap into the closed position.

An airflow management system that can be fitted to an electrical cabinet intended to accommodate electrical devices in the internal volume thereof, the system comprising: a casing comprising at least one air input intended to be placed in communication with the internal volume of the electrical cabinet, at least two air outputs and at least one principal throat arranged to connect the air input to the two air outputs, a switch device arranged inside said principal throat, between the first air output and the second air output, the switch device comprising movable flaps that can be controlled between a first position in which the air input communicates solely with the first air output and a second position in which the air input communicates at least with the second air output.

An electrical apparatus includes an electrical device that generates heat and a fan unit. A case of the electrical device includes a first opening and a second opening. A case of the fan unit includes a third opening and a fourth opening. The case of the electrical device and the case of the fan unit are configured such that a space sandwiched between a recess of the case of the electrical device and the support rail and a space sandwiched between a recess of the case of the fan unit and the support rail constitute an air flow path.

A computing device comprises: a heat sink that has a plurality of cooling fins and a vapor chamber; one or more heat-generating electronic devices that are thermally coupled to the vapor chamber; and at least one cooling fan configured to direct cooling air across the plurality of cooling fins, wherein a first fin included in the plurality of cooling fins and a second fin included in the plurality of cooling fins form a first air passage that has a first air inlet opening and a first air outlet opening, and wherein the first fin is adjacent to the second fin, and a first distance between the first fin and the second fin proximate to the first air inlet opening is less than a second distance between the first fin and the second fin proximate to the first air outlet opening.

A fan frame structure includes a base portion and a wall portion. The base portion has at least one extension section vertically extended from an outer peripheral edge of the base portion, and the extension section has connecting sides. The wall portion is formed along the outer peripheral edge of the base portion through an insert molding process. The wall portion includes a plurality of wall segments connected to the connecting sides of the extension sections, and a clearance is formed between any two adjacent wall segments. With these arrangements, the base portion can better resist a wrapping force from the insert-molded wall portion to avoid deformation.

An apparatus includes a fan having a fan housing with guidance members extending from opposing sides of the housing, wherein the fan housing has a depth that is less than a height and width. A handle is pivotably coupled to the fan housing, and guidance tracks are positioned on opposing sides of an open channel. Each of the guidance tracks has a first track portion extending from a first face of a chassis in a first direction into the chassis and a second track portion extending from the first track portion in a second direction. The guidance members move along the corresponding guidance tracks, wherein the fan housing moves along the first track portion in a sideways orientation and reaches an operating orientation in the second track portion.

A component carrier includes a baseboard, two sidewalls, and an ejector. The two sidewalls extend from opposite sides of the baseboard. The ejector includes a side plate, a handle, and a tab. The side plate is positioned in proximity to a first sidewall of the two sidewalls of the component carrier. The handle extends from a first end of the side plate in a first direction that is generally perpendicular to the side plate. The tab is positioned in proximity to the baseboard, and extends from a second opposing end of the side plate in a second direction that is generally perpendicular to the side plate and opposite to the first direction, the tab coupled to a first connector extending from the baseboard. The baseboard includes a first opening such that a portion of the tab of the ejector is configured to directly contact the electronic component therethrough.

A vapor chamber structure includes a main body, a fan and perforations. The main body has a heat absorption section, a heat dissipation section and a chamber. The heat absorption section and the heat dissipation section are respectively horizontally disposed on left and right sides of the main body. The heat absorption section is attached to at least one heat source. The chamber is positioned at the heat absorption section and partially extends to the heat dissipation section. The chamber has a capillary structure and at least one perforated section. The perforated section is connected between an upper side and a lower side of the chamber. The fan is disposed on one side of the heat dissipation section. The perforations are formed through the parts of the main body, which parts are free from the chamber and the parts of the main body, where the perforated section is disposed.

An electronic rack includes a stack of one or more information technology (IT) components disposed therein to form a frontend and a backend of the electronic rack. The electronic rack further includes a fan unit detachably mounted on the backend of the electronic rack. The fan unit generates an air flow flowing from the frontend to the backend past through an air space of the stack of IT components to reduce a temperature of the IT components. The electronic rack further includes a heat exchange unit detachably mounted on the backend of the electronic rack to exchange heat generated from the IT components. The heat exchange unit includes one or more tubes forming a heat exchange screen. The one or more tubes allow a cool liquid to travel therein to exchange the heat carried by the air flow past through the heat exchange screen.

A heat dissipating apparatus includes a frame, an elastic body, a magnetic member and a coil. The frame has an opening. The elastic body is disposed on the frame, and the frame and the elastic body define a space. The magnetic member is located corresponding to the space and disposed at one side of the elastic body. The coil is located corresponding to the periphery of the space and disposed on the frame. An electronic device with the heat dissipating apparatus is also disclosed.