Provided herein is a system and method for cooling a sensor enclosure of a vehicle. The system comprises one or more sensors configured to determine a speed of the vehicle, an internal temperature of an enclosure, and an external temperature. The system comprises an enclosure to house the one or more sensors. The system comprises a fan disposed at a base of the enclosure. The system comprises a controller configured to regulate a rotation speed of the fan based on the speed of the vehicle, the internal temperature of the enclosure, the external temperature, or the difference between the internal temperature of the enclosure and the external temperature. The controller operates the fan at the regulated rotation speed.

A cooling device for use with circuit interrupters includes a housing structured to be coupled to a terminal of the circuit interrupter and formed with several ventilation openings, as well as a permanent magnet, a torque converter and a fan blade all contained within the housing. When the cooling device is coupled to a terminal of a circuit interrupter and current flows through the terminals of the circuit interrupter, parasitic magnetic fields are generated and induce oscillatory motion of the permanent magnet. The torque converter is coupled to the permanent magnet and converts the oscillatory motion of the magnet to rotational motion that rotates the fan blade. The fan blade is disposed near the ventilation openings of the housing so that air flow produced by rotation of the fan blade travels across the surface of the circuit interrupter terminal nearest the ventilation openings to increase convection.

According to an embodiment, a fan unit holding mechanism includes an installation bracket with a slot, a projection portion on the bracket, and an elastic member at a bottom of the slot. The installation bracket receives a fan unit within the slot. The projection portion is inserted into an attachment hole of the fan unit when the installation bracket receives the fan unit. The elastic member comes into contact with the fan unit and presses against the fan unit.

A headset includes a thermal frame disposed within a housing. A printed circuit board is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. The thermal frame provides a substantially rigid structural support to which components are coupled and is configured to transfer thermal energy away from the one or more electrical components of the headset and toward an environment located outside of the housing.

A cooling system including a support structure and a cooling element is described. The cooling element has a thickness and includes an anchored region and a cantilevered arm. The anchored region is coupled to and supported by the support structure. The cantilevered arm extends outward from the anchored region. The cantilevered arm includes at least one cavity therein. The at least one cavity has a depth of at least one-third and not more than three-fourths of the thickness of the cooling element. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid for cooling a heat-generating structure.

The present invention relates to a modular solar photovoltaic inverter where by reducing the size of the filtering module and reducing the number of components, it reduces the size of the solar inverter compared to the state of the art; and with the configuration of the power modules, it generates channels that allow the passage of air from the cooling module, obtaining a modular photovoltaic solar inverter that improves the dimensions, weight, maintenance, cooling and safety with respect to those known up until now.

A charger includes a housing, a fan, and a circuit board assembly. The housing is formed with an air inlet and an air outlet. The fan is disposed in the housing and used for generating a heat dissipation. A heat dissipation channel for the heat dissipation airflow to flow through is further formed in the housing and includes a first channel and a second channel. A first port of the first channel facing the air inlet has a larger cross-sectional area than the second channel so that the heat dissipation airflow flowing through the first channel is capable of accelerating through the second channel.

A latch assembly and an electronic device using the same are provided. The electronic device includes a chassis, a fan module, and the latch assembly. The chassis has a chassis sidewall and a fixing bolt fixed on the chassis sidewall. The fan module is adapted to be accommodated in the chassis. The latch assembly is mounted on a module sidewall of the fan module. The latch assembly includes a latch is pivotally connected to the module sidewall, a moving member movably disposed on the module sidewall and connected to the latch, and a rotating hook pivoted on the module sidewall and connected to the moving member. The rotating hook and the latch are respectively connected to opposite sides of the moving member. When the fan module is placed in the chassis, the rotating hook of the latch assembly is adapted to be hooked to the fixing bolt of the chassis.

A plasma deposition system comprising a wafer platform, a second electrode, a first electrode, a first high voltage pulser, and a second high voltage pulser. In some embodiments, the second electrode may be disposed proximate with the wafer platform. In some embodiments, the second electrode can include a disc shape with a central aperture; a central axis, an aperture diameter, and an outer diameter. In some embodiments, the first electrode may be disposed proximate with the wafer platform and within the central aperture of the second electrode. In some embodiments, the first electrode can include a disc shape, a central axis, and an outer diameter. In some embodiments, the first high voltage pulser can be electrically coupled with the first electrode. In some embodiments, the second high voltage pulser can be electrically coupled with the second electrode.

A processing executing unit of a control device is configured to set the number of blocks to be read indicating the number of blocks to be read from a storage unit per unit time and a fan rotational speed of a fan motor in accordance with the amount of allowable machining error or a feed rate of a table that is inputted by an operator, and further configured to read a machining program from the storage unit block by block at the set number of blocks to be read and cause a fan control unit to perform a process to drive the fan motor at the set fan rotational speed.