Patent classifications
H05K7/20172
Universal replaceable fan unit for datacenters
A universal replaceable fan unit and method of reversing an airflow direction of a universal replaceable fan unit is provided. The universal replaceable fan unit includes a fan assembly designed to create an airflow from an intake end to an output end. The universal replaceable fan unit also includes a fan mounting that receives and secures the fan assembly in an operable position. The fan mounting includes a frame member and a securing member. The fan mounting is designed to allow the fan assembly to be moved between a first position defining a first airflow direction and a second position defining a second airflow direction. The first airflow direction is opposite the second airflow direction. The universal replaceable fan unit further includes an electrical connector removably attached to the fan assembly. The electrical connector allows electricity to be provided to the fan assembly for operation.
DUAL PARALLEL PATH COOLING SYSTEM FOR DUAL SOCKET INFORMATION HANDLING SYSTEMS
An air duct for cooling dual socket information handling systems divides airflow into two parallel paths. Inner walls, a chassis divider and a top surface form a main channel. An intermediate divider and intermediate wall are positioned between the sockets, wherein airflow exiting the first socket is prevented from flowing through the second socket. Lower lateral channels and upper lateral channels are formed between each inner wall and a corresponding outer wall, wherein lower lateral channels allow airflow to bypass the first socket to cool the second socket and the upper lateral channels allow heated airflow exiting the first socket to bypass the second socket.
PROCESSOR COOLING WITH PHASE CHANGE MATERIAL FILLED SHELL
A processor cooling system may include a processor, a shell having an interior thermally coupled to the processor to receive heat from the processor and a mass of solid to liquid (STL) phase change material filling the shell.
Dual-sided fan tray assembly of an electronic system
Example implementations relate to a dual-sided fan tray assembly of an electronic system. The fan tray assembly includes a housing having a front panel, a back panel, and a pair of side walls coupled to the front and back panels. The fan tray assembly further includes a handle assembly pivotably connected to the pair of side walls such that the handle assembly is at least rotatable around the housing to at least first and second positions spaced apart from each other. When the handle assembly is rotated to the first position, the fan tray assembly is slidably insertable into a chassis of an electronic system with the front panel facing the chassis to install the fan tray assembly to the electronic system. When the handle assembly is rotated to the second position, the fan tray assembly is slidably insertable into the chassis with the back panel facing the chassis.
Modular and highly available cooling distribution unit for information handling systems
A highly available and modular cooling distribution unit (CDU) includes a heat exchange module and a pair of redundant pump modules, all configured to occupy a designated rack space that is comparable to rack space required for a conventional 1×CDU without redundancy. The heat exchange module may be fluidically coupled to one or more rack information handling resources via liquid coolant conduits, manifolds and accompanying valves, sensors, etc. In at least one embodiment, the heat exchange module includes a heat exchanger to dissipate heat from a liquid coolant and a fan assembly to move heated air in proximity to the heat exchanger. Each pump module is coupled to the heat exchange module and configured to circulate liquid coolant through a closed loop circuit that includes the heat exchanger, the liquid coolant conduits and manifolds, and information handling resources.
Optical engine module and projection apparatus
An optical engine module is adapted to a projection apparatus. The optical engine module includes an optical engine housing, a first optical element and a heat dissipation assembly. The optical engine housing has a first vent and a second vent. The first optical element is disposed in the optical engine housing and adjacent to the first vent. The heat dissipation assembly is disposed outside the optical engine housing and adapted to generate airflow flowing through the first vent, the first optical element and the second vent. The heat dissipation assembly includes a fan and an air duct, in which the air duct is connected between the first vent and the fan. A projection apparatus having the optical engine module is also provided.
HIGH-PERFORMANCE COMPUTING COOLING SYSTEM
A computing cooling system includes a chassis having chassis air inlet(s) and outlet(s). Heat dissipation device(s) thermally coupled to heat producing component(s) are located in the chassis adjacent the chassis air outlet(s). A first fan device located in the chassis adjacent the chassis air inlet(s) pulls first air from outside the chassis into the first fan device via the chassis air inlet(s), and pushes the first air though the heat dissipation device(s) and out of the chassis via the chassis air outlet(s). A second fan device located in the chassis adjacent the chassis air inlet(s) pulls second air from outside the chassis into the second fan device via the chassis air inlet(s), pushes a first portion of the second air past the heat dissipation device(s) and out of the chassis via the chassis air outlet(s), and pushes a second portion of the second air into the chassis.
THERMAL MANAGEMENT SYSTEM FOR ELECTRONIC DEVICE
A headset includes a thermal frame disposed within a housing. A printed circuit board is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. The thermal frame provides a substantially rigid structural support to which components are coupled and is configured to transfer thermal energy away from the one or more electrical components of the headset and toward an environment located outside of the housing.
INFORMATION PROCESSING APPARATUS AND COOLING METHOD
An information processing apparatus comprises a first heat generation circuit, a second heat generation circuit, a blocking assembly, and a processor. The blocking assembly performs a first operation of blocking air flowing from the first heat generation circuit toward the second heat generation circuit or a second operation of passing the air, and the processor is configure to instruct the blocking assembly to perform the first operation in a case where a temperature of the air is higher than a predetermined value, and instruct the blocking assembly to perform the second operation in a case where the temperature of the air is lower than the predetermined value.
HUB DRIVEN VARIABLE HEIGHT FAN
A variable height fan of an information handling system includes a first fan having a first hub and a first plurality of fan blades. A second fan impeller includes a second hub and a second plurality of fan blades. The first hub slides along the second hub as the variable height fan transitions between an expanded position and a collapsed position. Interior edges of the first hub are in physical communication with exterior edges of the second hub, and the second fan impeller drives the first fan impeller through the physical communication between the interior edges of the first hub and the exterior edges of the second hub.