The heatsink cooling arrangement, fitted to cool a semiconductor component, is transferring heat to a backplate heatsink and secures a mechanical stabile assembly of PCBA, encapsulation, heatsink cooling arrangement to a backplate heatsink, which is fast and easy to assemble with usage of few- or no tools.

Provided is a display device which has improved heat dissipation efficiency. A display device according to the present invention is provided with a display unit, a circuit board which is positioned in the rear of the display unit, a heat dissipation member which is positioned in the rear of the circuit board and is capable of dissipating the heat of the circuit board, and a case body which contains at least the heat dissipation member. The heat dissipation member has a plurality of heat dissipation pieces which protrude to the outside of the case body through an opening that is provided in the case body, and which extend in the vertical direction, and the opening has an inclined surface, which is inclined upwardly, in a portion that faces the top of each heat dissipation piece.

An image projector includes a projecting section, a support section, an exterior section, a first heat conductor, and a second heat conductor. The projecting section projects an image, and includes an image forming section that forms the image. The support section supports the projecting section, and includes a projecting section placement face on which the projecting section is disposed. The exterior section covers the projecting section and the support section. The first heat conductor is disposed between the projecting section and the support section. The second heat conductor is disposed between the support section and the exterior section. The first heat conductor is disposed so as to at least partially overlap the image forming section in a plan view of the projecting section placement face.

An actuator usable in a cooling system is described. The actuator includes an anchored region and a cantilevered arm. The cantilevered arm extends outward from the anchored region. The cantilevered arm includes a step region, an extension region and an outer region. The step region extends outward from the anchored region and has a step thickness. The extension region extends outward from the step region and has an extension thickness less than the step thickness. The outer region extends outward from the extension region and has an outer thickness greater than the extension thickness.

A heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component.

A thermally conductive band can improve the flow of heat from a first portion of a mobile computing device (e.g., the base portion of a laptop computer) to a second portion of the mobile computing device (e.g., the lid portion of the laptop). The band is removably attachable to the mobile computing device via magnets or another attachment approach. The band comprises a thermally conductive layer, a first end removably attachable to an external surface of the first device portion, and a second end removably attachable to an external surface of the second device portion. The band can comprise thermal gap pads between the thermally conductive layer and the external surfaces to aid in providing a low thermal resistance path between the device and the band.

A heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component.

An inverter assembly for a motor vehicle includes a housing with an inlet end for receiving a flow of coolant and an outlet end for discharging the flow of coolant. The assembly further includes a first plurality of power transistors conducting and switching an electrical current and generating a first amount of heat. The assembly further includes a second plurality of power transistors conducting and switching the electrical current and generating a second amount of heat that is less than the first amount of heat. A heat sink includes a plate with a first section adjacent to the first plurality of power transistors and a second section adjacent to the second plurality of power transistors. The heat sink further includes a first plurality of fins for drawing the first amount of heat from the first section and a guide vane directing the flow of coolant toward the first plurality of fins.

A heatsink comprising a heat exchange device having a plurality of heat exchange elements each having a surface boundary with respect to a heat transfer fluid, having successive elements or regions having varying size scales. According to one embodiment, an accumulation of dust or particles on a surface of the heatsink is reduced by a removal mechanism. The mechanism can be thermal pyrolysis, vibration, blowing, etc. In the case of vibration, adverse effects on the system to be cooled may be minimized by an active or passive vibration suppression system.

A computing device comprises a heat sink including a base and a multi-dimensional thermal dissipation device disposed adjacent to the base. A thermally-conductive grease layer is disposed between and in direct contact with the multi-dimensional thermal dissipation device and the base. A gasket contains the thermally-conductive grease layer between the multi-dimensional thermal dissipation device and the base.