The present disclosure relates to a housing assembly for accommodating printed circuit boards (PCBs). The housing assembly comprises a first housing portion configured to accommodate a first PCB, a second housing portion configured to accommodate a second PCB, and a separating portion for separating the first housing portion from the second housing portion. The separating portion comprises a first separating region in which the first housing portion and the second housing portion overlap and a second separating region that extends beyond the second housing portion and covers the first housing portion. The second separating region comprises one or more convection openings.

Systems and methods for controlled-force thermal management device installation that helps thermal management of emerging, next-generation devices are provided. A system includes a mounting assembly for a thermal management device. The mounting assembly includes a fastener and a coupler. The system further includes a compression and locking interface configured to lock with the coupler and compress the mounting assembly to a predetermined loading point using a controlled force. The fastener is installed when the mounting assembly is at the predetermined loading point.

The present invention provides a colored radiative cooler based on a Tamm structure, including a substrate on which metal film and dielectric layers A to G are sequentially provided from bottom to top, where the Tamm structure is formed from the metal film and the dielectric layers A to D; a distributed Bragg reflector is formed from the dielectric layers A to D; and a selective emitter is formed from the dielectric layers E to G. Compared to the conventional radiative cooler, the colored radiative cooler not only has better cooling performance, but it has a wide applications in many aspects such as aesthetics and decoration.

A method includes providing a first metal sheet and a second metal sheet, printing a plurality of channels on the first metal sheet, bonding the first metal sheet and the second metal sheet to each other to obtain a fin body, bending a first portion of the fin body to be transverse to a second portion of the fin body, separating the first metal sheet and the second metal sheet from each other to form the plurality of channels, introducing working fluid in the plurality of channels, and sealing the first metal sheet and the second metal sheet.

A heat sink includes a graphite plate, two base materials each of which is disposed adjacent to the graphite plate, and a fixing member, in which the graphite plate has a strip shape and includes a fin portion and a base portion provided at one end of the fin portion, the base material includes a hole into which the fixing member can be inserted, the fixing member is inserted into the holes of the two base materials so that the two base materials are disposed to be adjacent to both sides of the base portion in a thickness direction, the base portion is in close contact with the base material adjacent to each other on both sides of the base portion in the thickness direction, the adjacent base materials are crimped and fixed by the fixing member in a state of being in close contact with each other, and in a case where a surface roughness of the fin portion is defined as Ra1, a surface roughness of the base material is defined as Ra2, and a surface roughness of the base portion is defined as Ra3, a relationship of Ra1>Ra2≥Ra3 is satisfied.

An electronic control device includes an enclosure including a first enclosure having an assembly opening and a second enclosure covering the entire assembly opening, the enclosure having a communication opening communicating with the assembly opening; a circuit board accommodated in the enclosure; an integrated circuit element mounted on the circuit board; and a heat dissipating shield member thermally coupled to the integrated circuit element and grounded, wherein the heat dissipating shield member includes an inner portion accommodated inside the enclosure and thermally coupled to the integrated circuit element and an outer portion extending to an outside of the enclosure via the communication opening.

A technique and corresponding device to provide for a floating heat sink is disclosed. The technique includes a method that allows for insertion of an electronic component (e.g., an optical transceiver) into a cage that has a pre-installed heatsink. At the beginning phases of insertion, no friction is present between the electronic component and the heatsink. At or very near an insertion end phase (the electronic component is almost fully inserted), an actuator (e.g., roller or button) is impacted to impart a pivot motion via a lever arm to cause lowering of the heatsink toward the electronic component. A thermal interface material (TIM) may therefore be present to establish a thermal coupling between the heatsink and the electronic component. The TIM and heatsink contact the electronic component via a downward motion (caused by the pivot) to provide a nearly frictionless sliding impact to the TIM.

A receptacle assembly includes a heat sink assembly for a receptacle cage for dissipating heat from a pluggable module plugged into the receptacle cage. The heat sink assembly includes fin plates and spacer plates arranged in a plate stack independently movable for engaging and conforming to the pluggable module. Each spacer plate includes a thermal interface at a bottom of the spacer plate engaging the pluggable module. Each fin plate includes a thermal interface at a bottom of the fin plate engaging the pluggable module. The fin plates include branched fin plates and unbranched fin plates. Each of the unbranched fin plates are planar between the bottom and the distal end thereof. Each of the branched fin plates are non-planar and include at least one bend between the bottom and the distal end thereof.

A heat dissipation apparatus or an inverter, includes a main heat sink, an extra heat sink, and a heat conducting element, the main heat sink includes a main substrate and a main fin, one end of the main fin is connected to the main substrate, the extra heat sink is located at an end of the main fin farther from the main substrate, the extra heat sink is detachably connected to the main heat sink, and the heat conducting element extends from the main substrate to the extra heat sink, to transfer heat between the main substrate and the extra heat sink. In this application, the heat dissipation apparatus is designed as a split structure. A dual heat dissipation function of the main heat sink and the extra heat sink improves a heat dissipation capability of the heat dissipation apparatus, and improves heat dissipation efficiency.

The disclosure discloses a heat dissipation member, including a base plate, a plurality of first sheet structures, and a plurality of second sheet structures. Each first sheet structure is vertically arranged on a side of the base plate, and an end of the each first sheet structure is arranged adjacent to a side edge of the base plate. A spacing between two adjacent first sheet structures gradually increases from a first side edge of the base plate to a second side edge of the base plate. The first side edge is not adjacent to the second side edge. Each second sheet structure is arranged between two adjacent first sheet structures.