A heat dissipation device, which is used in a wireless transmission system including an operating unit and a transmission unit, includes a case unit and a heat dissipation unit. The case unit includes a first case and a second case that cooperatively define a space therebetween for receiving the wireless transmission system. The first case is formed with multiple heat dissipation holes spatially communicating the space with the environment. The heat dissipation unit includes a first dissipation member made of metal and, a second heat dissipation member made of a non-metal material, and a third heat dissipation member connected to the first heat dissipation member and being exposed to the environment.

A system includes a retainer assembly to align each of a group of cooling devices with a corresponding electrical component of a group of electrical components that are mounted to a circuit board, where the retainer assembly includes a group of apertures, such that each of the cooling devices protrudes through a corresponding aperture when the retainer assembly is installed on the circuit board, and where the retainer assembly includes a group of retaining springs, each of which is associated with a corresponding aperture, that applies a respective force, of a group of forces, to a corresponding one of the cooling devices when the retainer assembly is installed on the circuit board. The system also includes a set of fasteners to mount the retainer assembly to the circuit board, such that the cooling devices dissipate heat that is generated by the electrical components.

An electronic device for motor vehicles comprises a heat-conducting housing containing a printed circuit board and an element producing heat mounted on the printed circuit board. The housing comprises a housing base on which the printed circuit board is mounted and comprises a cover opposite to the housing base. A first heat-dissipating metal structure is mounted on the element producing heat, and a second heat-dissipating metal structure, formed as part of the cover of the housing and protruding into the housing, is coupled with the first heat-dissipating metal structure, in such a manner as to facilitate the dissipation of the thermal energy from the element producing heat towards the outside of the housing.

In order to efficiently cool a heat-generating semiconductor element, it is desirable to cool a power semiconductor element from both surfaces. Therefore, in order to cool multiple power semiconductor elements, it is an effective way to alternately arrange a semiconductor component having the incorporated semiconductor element and a cooling device. A power conversion device for handling a high-power voltage needs to ensure pressure resistance between semiconductor elements or circuits inside the device. It is an effective way to seal the semiconductor component with a sealing material such as a silicone gel. Therefore, it is necessary to install the semiconductor component or the circuit having the incorporated semiconductor element, in a case from which a liquid silicone gel prior to curing does not leak even if the gel is injected. For these reasons, an object to be achieved by the invention is that the semiconductor element can be cooled from both surfaces by alternately arranging the semiconductor component having the incorporated semiconductor element and the cooling device. The above-described object can be achieved as follows. A substantially rectangular thin plate is subjected to mountain bending and valley bending so as to form a shape having as many recesses as the number of the mounted semiconductor components having the incorporated semiconductor element. Concurrently, a lateral side in a direction orthogonal to the above-described bending direction is bent so as to dispose the case in which all edges configuring an outer shape of the thin plate are arranged on substantially the same plane. The semiconductor component having the incorporated semiconductor element is arranged at a position serving as the recess of the case. The cooling devices are arranged so as to interpose the semiconductor component having the incorporated semiconductor element via the case. The semiconductor component having the incorporated semiconductor element is sealed with a silicone gel. In addition, preferably, the case is configured to include metal which has high heat conductivity. More preferably, the case is configured to include aluminum, copper, or an alloy whose principal components are both of these.

Inverters for direct current (DC) to alternating current (AC) conversion may comprise switching elements which produce harmonic overtones. Inductive elements may be added into the inverters, such as to attenuate effects of harmonic overtones. Methods and systems for a casing suitable for reduced potting over its inductive elements is described. One or more heat dispersing elements may be disposed in the casing. Related systems and methods are also described.

The present document describes a passive thermal-control structure for speakers and associated apparatuses and methods. The architecture of the passive thermal-control structure is such that heat is transferred from electronic subsystems of the electronic speaker device to the passive thermal-control structure, which acts as an internal, structural frame of the electronic speaker device and provides both thermal mitigation and structural stability. The passive thermal-control structure conducts heat from the electronic subsystems to a housing of the electronic speaker device. The housing of the electronic speaker device may dissipate the heat to the ambient environment to prevent thermal runaway of the electronic subsystems, and the internal frame mitigates the temperature of the housing from exceeding ergonomic temperature limits.

A heatsink with an air-partitioning baffle. In one embodiment, the heatsink comprises a plurality of fins defining a plurality of channels, an inlet channel that is at least partially defined by the plurality of fins and extends across the plurality of channels, and a baffle at least partially within the inlet channel. The baffle is configured to direct a first fluid flow, such as warm air, from a first portion of the plurality of channels and to direct a second fluid flow, such as cooling air, through at least one inlet of the inlet channel to a second portion of the plurality of channels.

An actuator usable in a cooling system is described. The actuator includes an anchored region and a cantilevered arm. The cantilevered arm extends outward from the anchored region. The cantilevered arm includes a step region, an extension region and an outer region. The step region extends outward from the anchored region and has a step thickness. The extension region extends outward from the step region and has an extension thickness less than the step thickness. The outer region extends outward from the extension region and has an outer thickness greater than the extension thickness.

An I/O connector includes a body comprising a first surface, a second surface, side surfaces extending between the first surface and the second surface, and a cable entrance port at a rear end of the body extending toward a front end of the body. The I/O connector includes a printed circuit board (PCB) positioned between the first surface and the second surface of the body. The PCB includes a first set of one or more electrical components mounted on a first side of the PCB. A first heatsink is disposed on the first surface. The I/O connector includes first heatpipe thermally coupled with the first heatsink and the first set of one or more electrical components, positioned between the first surface and the first side of the PCB.

A radiator is provided having high heat dissipation performance while being compact and lightweight. A radiator 1 is configured from a base portion 4 having a heat receiving surface 2 abutting on a heat generating element, such as a semiconductor device and an electronic component, and a heat transfer surface 3 opposed to the heat receiving surface 2 and a fin 5 extending from the heat transfer surface 3 of the base portion 4. In the radiator 1 thus configured, the fin 5 is configured from a fin base 5a extending from the heat transfer surface 3 and a plurality of heat diffusing projections 8 and 9 formed on a surface of the fin base 5a.