A heat dissipation assembly includes a condenser, an evaporator, a vapor conduit, and a liquid conduit. The condenser has a condensing chamber therein. Two ends of the vapor conduit are respectively connected to the condenser and the evaporator. Two ends of the liquid conduit are respectively connected to the condenser and the evaporator. A geometric center of the liquid conduit in the condensing chamber is lower than or equal to a geometric center of the condensing chamber.

A heat dissipation device assembly includes an aluminum base seat, an aluminum radiating fin assembly and at least one U-shaped copper heat pipe, which is upright arranged or horizontally arranged. The aluminum base seat has at least one connection section. A copper embedding layer is disposed on the connection section. The aluminum radiating fin assembly is assembled and disposed on the aluminum base seat. The copper heat pipe has a heat dissipation section and a heat absorption section respectively connected on the aluminum radiating fin assembly and the connection section of the aluminum base seat. By means of the copper embedding layer, the aluminum base seat and the copper heat pipe can be directly welded and connected with each other without chemical nickel treatment.

An electrical connector cage assembly includes a connector casing, a heat sink, and an attaching part. The heat sink includes a base and a plurality of fins extending from a top surface of the base. The fins extend above a marginal area of the top surface to form an open slot with the marginal area. The open slot has two end openings and a side opening extending to the end openings. The attaching part passes through the open slot and protrudes from the end openings to be detachably engaged with the connector casing to detachably fix the base onto the connector casing. Therein, the attaching part is separable from the heat sink from the side opening. An electrical connector includes a circuit board, an electrical connector base, and the electrical connector cage assembly. The electrical connector base is electrically connected onto the circuit board and exposed from the connector casing.

A connector assembly includes a guiding shield cage, a receptacle connector, a partitioning bracket and a movable heat sink. The receptacle connector is provided to a rear segment of an interior of the guiding shield cage, the receptacle connector has an upper receptacle and a lower receptacle. The partitioning bracket is provided in the guiding shield cage, the partitioning bracket and the guiding shield cage together define an upper receiving space which corresponds to the upper receptacle and a lower receiving space which corresponds to the lower receptacle. The movable heat sink is assembled to the partitioning bracket, the movable heat sink is capable of moving relative to the partitioning bracket between a front position where the movable heat sink is positioned in front of a front end of the upper receptacle a front end of the lower receptacle and a rearward position where the movable heat sink at least partially enters into between the upper receptacle and the lower receptacle.

A display assembly for an imaging device including a display panel, a display, a first control unit, a second control unit and a thermally insulating layer, and a housing. The thermally insulating layer divides the housing in at least a first cavity including the first control unit and a second cavity including the second control unit. The thermally insulating layer preventing heat generated in the first cavity or the second cavity from reaching the other cavity and including an electrically conductive material to at least partially shield electromagnetic radiation generated in the first or the second cavity from reaching the other cavity.

A connector assembly is provided which includes a shielding shell, a receptacle connector and a heat sink. The shielding shell has a top wall, a receiving cavity positioned inside, an inserting opening which is positioned at a front end of the shielding shell and communicated with the receiving cavity and a window which is formed to the top wall, extends rearwardly and is communicated with the receiving cavity. The receptacle connector is provided to a rear segment of the receiving cavity. The heat sink is provided to the top wall and includes a heat dissipating base. A bottom face of the heat dissipating base downwardly enters the receiving cavity via the window and directly faces a top face of the receptacle connector. The bottom face of the heat dissipating base facing the receptacle connector is provided with a front stopping portion which is adapted to stop a mating module.

Systems and methods are disclosed relating to welding-type power supplies. In some examples, the power supplies may have no vents, which may help prevent environmental contaminants from entering the power supplies. Instead, the power supplies include one or more thermal interfaces configured to conduct heat generated by internal circuitry of the power supply from the interior of the power supply to an exterior of the power supply. Additionally, the thermal interface(s) may be configured for attachment to one or more exterior heat dissipating devices.

A micro-strand heat dissipation system includes a first processing device and a plurality of first micro-strand heat dissipator elements that are each positioned on the first processing device in a spaced apart orientation from the other first micro-strand heat dissipator elements. Each of the plurality of first micro-strand heat dissipator elements include a first micro-strand heat dissipator element portion that extends into the first processing device from an outer surface of the first processing device, and a second micro-strand heat dissipator element portion that extends from the outer surface of the first processing device. The first processing device may define a plurality of micro-strand heat dissipator connector features to which each of the plurality of first micro-strand heat dissipator elements may be connected, or the plurality of first micro-strand heat dissipator elements may be integrated as part of the first processing device.

The present disclosure relates to heat dissipation apparatus. One example heat dissipation apparatus includes a heat dissipation assembly and a bracket assembly, where the heat dissipation assembly is configured to dissipate heat for a server chip and includes a substrate and a heat sink, the heat dissipation assembly is connected to the bracket assembly, the bracket assembly includes a bracket and a plurality of first elastic structural members that are disposed on the bracket, each first elastic structural member includes a supporting portion and a connection portion, and at least one hook is disposed on the connection portion.

A micro-strand transceiver device heat dissipation system includes a transceiver device chassis, at least one transceiver component located in the transceiver device chassis, and micro-strand heat dissipator elements that are each positioned in the transceiver device chassis in a spaced apart orientation from the others of the micro-strand heat dissipator elements. Each of the micro-strand heat dissipator elements include a first micro-strand heat dissipator element portion that engages the at least one transceiver component, and a second micro-strand heat dissipator element portion that extends from the at least one transceiver component. The first micro-strand heat dissipator element portion on each of the micro-strand heat dissipator elements conducts heat generated by the at least one transceiver component to the second micro-strand heat dissipator element portion on that micro-strand heat dissipator element, which allows that heat to be dissipated.