Actively cooled heat-dissipation lid for removing excess heat from heat-generating devices attached to printed circuit boards, processor assemblies and other electronic devices, the actively cooled heat-dissipation lid comprising a first plate configured to be placed in thermal communication with a heat-generating device, a raised sidewall to facilitate fastening the actively cooled heat-dissipation lid to the printed circuit board or processor assembly, and thereby defining a device chamber for the heat-generating devices on the printed circuit board to reside. A second raised sidewall extends from the opposite surface of the first plate to join with a second plate in a spaced relation to the first plate, wherein the opposite surface of the first plate, the second raised sidewall and the second plate together define a fluid chamber that is adjacent to the device chamber, the fluid chamber being configured to prevent any cooling fluid flowing therethrough to enter the adjacent device chamber. An inlet conduit in fluid communication with the fluid chamber is configured to admit coolant fluid from a pressurized source to pass into the fluid chamber to absorb heat from the second surface of the first plate in thermal communication with the heat-generating device. An outlet conduit in fluid communication with the fluid chamber is configured to let warmed coolant fluid flow out of the fluid chamber and into a closed loop fluid-cooling system, where the coolant fluid is then re-cooled before being pumped back into the fluid chamber via the inlet conduit.

A composite heat dissipation device includes an electromagnetic radiation dissipation pile including a polar dielectric material assembly including a plurality of polar dielectric material units. The polar dielectric material assembly is configured to interact with solar radiation. Surfaces of the polar dielectric material units each are configured to interact with the solar radiation to generate scattering of light. The polar dielectric material units each include an optical phonon configured to interact with thermal radiation to increase strength of the thermal radiation.

A thermal radiation heat dissipation device includes a radiation heat transfer pile including a plurality of polar dielectric material units of high energy gap, the polar dielectric material units each including at least one light scattering unit and a thermal radiation unit. The light scattering unit interacts with solar radiation to generate scattering of light. The thermal radiation unit interacts with thermal radiation to increase strength of thermal radiation.

A thermal radiation heat dissipation device for an electronic component includes a heat dissipation substrate including a heat dissipation surface having a heat dissipation surface emissivity; and an emissivity modulation layer disposed on the heat dissipation surface including an emissivity modulation layer surface having an emissivity modulation layer surface emissivity. The emissivity modulation layer surface emissivity is greater the heat dissipation surface emissivity.

An insulating heat dissipation coating composition including a coating layer-forming component including a subject resin, and an insulating heat dissipation filler. Therefore, the coating composition may have excellent thermal conductivity and excellent thermal emissivity, and therefore an insulating heat dissipation coating layer which exhibits excellent heat dissipation performance and has insulating property may be formed. In addition, the heat dissipation coating layer formed thereby has a very excellent adhesive strength to a surface to be coated so as to significantly prevent peeling of the coating layer during use, and to maintain durability of the coating layer even against a physical or chemical stimulus such as external heat, organic solvent, moisture or shock, which is generated after the coating layer is formed.

This document describes a reinforced graphite heat-spreader for a surface of a housing component of an electronic device. The reinforced graphite heat-spreader includes a heat-spreader material stack having a layer of graphite material to spread heat. The reinforced graphite heat-spreader also includes an interface material stack that joins the heat-spreader material stack to the housing surface of an electronic device. The interface material stack, which may be formed using embossing techniques, includes protuberances that may be formed from an adhesive material.

A heat radiation material which includes metal particles and a resin and has a region inside where the metal particles arranged along the surface direction are present in a relatively high density.

This heat radiation material contains metal particles and a resin, and has a structure in which the metal particles are localized in at least one surface side.

A heat sink includes a baseplate of thermally-conductive material and a radiator for transferring heat to atmosphere around the radiator. The baseplate is configured to be in thermal communication with a heat source, such as an integrated circuit or a power electronic device. The radiator is disposed upon the baseplate and includes a skin of melted material formed by additive manufacturing which encloses a chamber. An outer wick of porous material is disposed within the chamber, the outer wick coats an inner surface of the skin. A refrigerant is disposed within the chamber. The refrigerant changes between a liquid phase and a vapor phase to convey heat from the baseplate to the skin, and is conveyed back through the wick in the liquid phase by capillary action. The radiator also includes a plurality of fins extending from a cover to promote heat transfer to the atmosphere.

The present disclosure is generally directed to a housing for use with optical transceivers or transmitters that includes integrated heatsinks with a graphene coating to increase thermal dissipation during operation. In more detail, an embodiment of the present disclosures includes a housing that defines at least first and second sidewalls and a cavity disposed therebetween. The first and/or second sidewalls can include integrated heatsinks to dissipate heat generated by optical components, e.g., laser diodes, laser diode drivers, within the cavity of the housing. The integrated heatsinks can include at least one layer of graphene disposed thereon to increase thermal performance, and in particular, to decrease thermal resistance of the heatsink and promote heat dissipation.