The present disclosure is generally directed to a housing for use with optical transceivers or transmitters that includes integrated heatsinks with a graphene coating to increase thermal dissipation during operation. In more detail, an embodiment of the present disclosures includes a housing that defines at least first and second sidewalls and a cavity disposed therebetween. The first and/or second sidewalls can include integrated heatsinks to dissipate heat generated by optical components, e.g., laser diodes, laser diode drivers, within the cavity of the housing. The integrated heatsinks can include at least one layer of graphene disposed thereon to increase thermal performance, and in particular, to decrease thermal resistance of the heatsink and promote heat dissipation.

A thermal interface assembly for transferring heat from a heat generating component to a heat dissipating component. The thermal interface assembly includes a plurality of discrete thermal sheets attached to a resilient pad.

A wireless power transmission device for a vehicle is provided. The wireless power transmission device according to an exemplary embodiment of the present invention comprises: a wireless power transmission module comprising at least one flat coil for transmitting wireless power and a magnetic field shielding sheet arranged on one surface of the flat coil; a heat radiating case for radiating heat generated by a heat source, with the wireless power transmission module being coupled to one side thereof and at least one circuit board for driving the wireless power transmission module being embedded therein; a heat radiating coating layer applied to the outer surface of the heat radiating case; and a cover detachably coupled to the heat-radiating case. The wireless power transmission device for the vehicle described above may be installed or embedded within a vehicle for using in charging the main battery of a portable terminal.

A pedestal housing for heat reduction generated by electronic components within the pedestal housing having a cover in which the electronic components are located, a cap positioned on an upper surface of the cover for forming an attic above the cover, a support layer and an insulation layer positioned between the cover and the cap in the attic and a heat and solar barrier layer positioned within the attic for electromagnetic radiation reflection away from the electronic components and electromagnetic radiation absorption from a radiation source and the electronic components.

Aspects of the subject technology relate to electronic devices having adaptive surfaces. An adaptive surface may expand or deform responsive to a temperature change and/or a mechanical strain for thermal management for the device or for mechanical restructuring of the device in various configurations. The adaptive surface may be formed from a negative Poisson's ratio relief pattern in the surface or an inhomogeneous arrangement of materials.

An insulating heat dissipation coating composition including a coating layer-forming component including a subject resin, and an insulating heat dissipation filler. Therefore, the coating composition may have excellent thermal conductivity and excellent thermal emissivity, and therefore an insulating heat dissipation coating layer which exhibits excellent heat dissipation performance and has insulating property may be formed. In addition, the heat dissipation coating layer formed thereby has a very excellent adhesive strength to a surface to be coated so as to significantly prevent peeling of the coating layer during use, and to maintain durability of the coating layer even against a physical or chemical stimulus such as external heat, organic solvent, moisture or shock, which is generated after the coating layer is formed.

Provided is a high heat radiation thin film. The high heat radiation thin film may comprise a metal substrate, and a carbon layer which is disposed on the metal substrate and is thicker than 2.5 nm and thinner than 10 nm.

A thermal interface assembly for transferring heat from a heat generating component to a heat dissipating component. The thermal interface assembly includes a plurality of discrete thermal sheets attached to a resilient pad.

A cold plate assembly has a cold plate that is resistant to corrosion and particulate fouling, allowing direct use of facility-grade cooling liquid and omission of a secondary coolant loop that uses a purified liquid coolant. The cold plate has a surface configured with an array of extended fins coated with at least one of a hydrophobic, non-conductive, and/or anti-corrosive surface treatment. The coated extended fins provide heat transfer directly to the cooling liquid without requiring a secondary coolant loop and without causing corrosion or clogging due to facility liquid chemical contaminants or particulates. An encapsulating lid of the cold plate assembly attaches to a perimeter of the surface encompassing the array of extended fins to form a liquid cooling cavity. The encapsulating lid has input and output ports sealably connectable by an open-loop liquid distribution system, respectively, to a facility liquid supply and return.

Passive radiative cooling structures and apparatus manufactured with such cooling structures conserve energy needs. A flexible film transparent to visible light incorporates particles at a volume percentage larger than 25% so as to absorb and emit infrared radiation at wavelengths where Earth's atmosphere is transparent. Another film transparent to visible light is thin and flexible and configured to absorb and emit infrared radiation at wavelengths where Earth's atmosphere is transparent, wherein etchings or depositions are present on one or both surfaces. A high efficiency cooling structure has an emissive layer sandwiched between a waveguide layer and a thermal conductive layer. A solar cell panel is covered by a transparent passive radiative cooling film. A container housing an active cooling unit incorporates passive radiative cooling structures on one or more exterior surfaces.