Thermal management systems are described herein. A thermal management system includes components of a computing device. The computing device includes a housing. The housing includes an inner surface. A portion of the inner surface of the housing has a first emissivity. The computing device also includes a thermal management device positioned within the housing, at a distance from the portion of the inner surface of the housing. The thermal management device includes an outer surface. The outer surface of the thermal management device includes a first portion and a second portion. The first portion of the outer surface of the thermal management device has a second emissivity, and the second portion of the outer surface of the thermal management device has a third emissivity. The second emissivity is greater than the third emissivity, and the first emissivity is substantially the same as the second emissivity.

A thermal conductive device and thermal conductive device manufacturing method, an electrical connector, and an electronic device. The thermal conductive device comprises first housing, a second housing, a capillary mesh component, and a coolant. The second housing is disposed on the first housing. An airtight and vacuumed accommodating space is provided between the first housing and the second housing. The capillary mesh component is disposed in the accommodating space. The capillary mesh component comprises a plurality of capillary pores. The plurality of capillary pores and the accommodating space form a plurality of interconnected circulation channels. The coolant is filled in the accommodating space. Inside the thermal conductive device, the conventional copper powder sintered configuration is replaced with capillary mesh component, so that the thermal conductive device could be thinned and could present a better thermal conductivity.

A wireless power transmission device for a vehicle is provided. The wireless power transmission device according to an exemplary embodiment of the present invention comprises: a wireless power transmission module comprising at least one flat coil for transmitting wireless power and a magnetic field shielding sheet arranged on one surface of the flat coil; a heat radiating case for radiating heat generated by a heat source, with the wireless power transmission module being coupled to one side thereof and at least one circuit board for driving the wireless power transmission module being embedded therein; a heat radiating coating layer applied to the outer surface of the heat radiating case; and a cover detachably coupled to the heat-radiating case. The wireless power transmission device for the vehicle described above may be installed or embedded within a vehicle for using in charging the main battery of a portable terminal.

A canister system having a cylindrical housing and a modular electronic rack system disposed within the cylindrical housing. The modular electronic rack system includes a thermal contact member that is in at least selective physical contact with an interior surface of the cylindrical housing to permit conductive heat transfer there through. An input/output device extends along at least a portion of the modular electronic rack system and includes a power input and a signal output electrically coupled thereto. A plurality of electronic slots disposed at a position generally along the modular electronic rack system is provided.

A pedestal housing for heat reduction generated by electronic components within the pedestal housing having a cover in which the electronic components are located, a cap positioned on an upper surface of the cover for forming an attic above the cover, a support layer and an insulation layer positioned between the cover and the cap in the attic and a heat and solar barrier layer positioned within the attic for electromagnetic radiation reflection away from the electronic components and electromagnetic radiation absorption from a radiation source and the electronic components.

Actively cooled heat-dissipation lid for removing excess heat from heat-generating devices attached to printed circuit boards, processor assemblies and other electronic devices, the actively cooled heat-dissipation lid comprising a first plate configured to be placed in thermal communication with a heat-generating device, a raised sidewall to facilitate fastening the actively cooled heat-dissipation lid to the printed circuit board or processor assembly, and thereby defining a device chamber for the heat-generating devices on the printed circuit board to reside. A second raised sidewall extends from the opposite surface of the first plate to join with a second plate in a spaced relation to the first plate, wherein the opposite surface of the first plate, the second raised sidewall and the second plate together define a fluid chamber that is adjacent to the device chamber, the fluid chamber being configured to prevent any cooling fluid flowing therethrough to enter the adjacent device chamber. An inlet conduit in fluid communication with the fluid chamber is configured to admit coolant fluid from a pressurized source to pass into the fluid chamber to absorb heat from the second surface of the first plate in thermal communication with the heat-generating device. An outlet conduit in fluid communication with the fluid chamber is configured to let warmed coolant fluid flow out of the fluid chamber and into a closed loop fluid-cooling system, where the coolant fluid is then re-cooled before being pumped back into the fluid chamber via the inlet conduit.

Actively cooled heat-dissipation lid for removing excess heat from heat-generating devices attached to printed circuit boards, processor assemblies and other electronic devices, the actively cooled heat-dissipation lid comprising a first plate configured to be placed in thermal communication with a heat-generating device, a raised sidewall to facilitate fastening the actively cooled heat-dissipation lid to the printed circuit board or processor assembly, and thereby defining a device chamber for the heat-generating devices on the printed circuit board to reside. A second raised sidewall extends from the opposite surface of the first plate to join with a second plate in a spaced relation to the first plate, wherein the opposite surface of the first plate, the second raised sidewall and the second plate together define a fluid chamber that is adjacent to the device chamber, the fluid chamber being configured to prevent any cooling fluid flowing therethrough to enter the adjacent device chamber. An inlet conduit in fluid communication with the fluid chamber is configured to admit coolant fluid from a pressurized source to pass into the fluid chamber to absorb heat from the second surface of the first plate in thermal communication with the heat-generating device. An outlet conduit in fluid communication with the fluid chamber is configured to let warmed coolant fluid flow out of the fluid chamber and into a closed loop fluid-cooling system, where the coolant fluid is then re-cooled before being pumped back into the fluid chamber via the inlet conduit.

Aspects of the subject technology relate to electronic devices having adaptive surfaces. An adaptive surface may expand or deform responsive to a temperature change and/or a mechanical strain for thermal management for the device or for mechanical restructuring of the device in various configurations. The adaptive surface may be formed from a negative Poisson's ratio relief pattern in the surface or an inhomogeneous arrangement of materials.

A spectrally selective radiation emission device is described. In one or more implementations, an apparatus includes a housing, one or more electrical components disposed within the housing, and a spectrally selective radiation emission device. The one or more electrical components are configured to generate heat during operation. The spectrally selective radiation emission device is disposed on the housing and configured to emit radiation when heated by the one or more electrical components at one or more wavelengths of electromagnetic energy and reflect radiation at one or more other wavelengths of electromagnetic energy.

A cold plate assembly has a cold plate that is resistant to corrosion and particulate fouling, allowing direct use of facility-grade cooling liquid and omission of a secondary coolant loop that uses a purified liquid coolant. The cold plate has a surface configured with an array of extended fins coated with at least one of a hydrophobic, non-conductive, and/or anti-corrosive surface treatment. The coated extended fins provide heat transfer directly to the cooling liquid without requiring a secondary coolant loop and without causing corrosion or clogging due to facility liquid chemical contaminants or particulates. An encapsulating lid of the cold plate assembly attaches to a perimeter of the surface encompassing the array of extended fins to form a liquid cooling cavity. The encapsulating lid has input and output ports sealably connectable by an open-loop liquid distribution system, respectively, to a facility liquid supply and return.