An information handling system, including a cover including a first section and a second section; a first battery cell in superimposition with the second section of the cover; a second battery cell in superimposition with the second section of the cover, the second battery cell spaced-apart from the first battery cell to define a channel therebetween; a graphene coating in superimposition with the second section of the cover; and a first portion of a graphite sheet that is i) in superimposition with a first region of the second section of the cover, ii) in superimposition with the channel defined between the first battery and the second battery, and iii) in superimposition with a first portion of the graphene coating.

The present invention discloses a motherboard structure and an electronic device. The motherboard structure includes a circuit substrate, a processor, at least one adapter, at least one external card, and a heat dissipation module. The processor is arranged at the circuit substrate. The adapter is arranged at the circuit substrate, and includes a slot facing the processor. The external card is inserted into the slot, and the external card and the circuit substrate collectively define an opening facing the processor. The heat dissipation module is arranged at the processor, and includes a notch facing the opening. The heat dissipation module is adapted to generate an airflow flowing to the opening through the notch.

An electrical connection unit includes an electronic component, a first bus bar, a base member, a rigid member, and a first heat transfer member. The first bus bar is electrically connected to a first terminal of the electronic component. The base member supports the first bus bar. The rigid member faces the base member. The first heat transfer member is disposed between the rigid member and the first bus bar and has elasticity. The rigid member includes a first fixing portion to which the base member is fixed and a second fixing portion to which the electronic component is fixed. When viewed from a first direction from the base member toward the rigid member, a part of the first heat transfer member is located on a straight line connecting the first fixing portion and the second fixing portion.